A digital loudspeaker includes a substrate, a first stator fixed with respect to the substrate, a second stator fixed with respect to the substrate and spaced at a distance from the first stator, and a membrane between the first stator and the second stator. The membrane is displaceable between a first position in which the membrane mechanically contacts the first stator and a second position in which the membrane mechanically contacts the second stator. The first stator and the second stator are arranged to electrostatically move the membrane from a rest position spaced apart from the first position and the second position to the first position and the second position, respectively.

Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.

Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.

A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micromachined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.

A membrane and a method for producing a diaphragm, and a composite diaphragm are provided. The MCPET material is a MCPET baffle with micropores independent from each other; wherein an average size of the micropore is smaller than or equal to 5 m, a foaming rate of the MCPET baffle is less than 2 times, and a density of the MCPET baffle is less than 300 kg/m3. The MCPET baffle is further processed by means of layered cut to form the membrane that is thinner than the MCPET baffle. At least one surface with micropores is exposed to form a micropore exposed surface. The membrane is heated under a temperature of 130-140 C. to form the diaphragm. The composite diaphragm includes a main diaphragm and an auxiliary diaphragm, wherein the main diaphragm is made of the membrane of the present application. The diaphragm made of the membrane has a superior sound performance.

A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micro-machined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.

A digital loudspeaker and a method for operating a digital loudspeaker are disclosed. In an embodiment a digital loudspeaker includes a substrate, a first stator fixed with respect to the substrate, a second stator fixed with respect to the substrate and spaced at a distance from the first stator, and a membrane between the first stator and the second stator. The membrane is displaceable between a first position in which the membrane mechanically contacts the first stator and a second position in which the membrane mechanically contacts the second stator. The first stator and the second stator are arranged to electrostatically move the membrane from a rest position spaced apart from the first position and the second position to the first position and the second position, respectively.

A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micro-machined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.

The object of the present invention is that the surplus vibration involved therewith simultaneously generating a sound wave by the vibration of the vibrating cone of the loudspeaker unit is generated in the loudspeaker system, which has impaired the sound quality of the loudspeaker system. The purpose of the present invention is to provide a technique for improving the sound quality by reducing the this surplus vibration which are the loudspeaker frame vibration and the cabinet vibration like a front baffle vibration. The present invention is characterized in being configured with a viscoelastic material layer upon rear portions such as the frame surface of the loudspeaker unit and inside and outside surfaces of each surface configuring the loudspeaker cabinet, and additionally suppresses vibration by addition of a heavy member or pressurization caused by constraint of a binding member.

Systems and methods for acoustic simulation in accordance with embodiments of the invention are illustrated. One embodiment includes a method for simulating acoustic responses, including obtaining a digital model of an object, calculating a plurality of vibrational modes of the object, conflating the plurality of vibrational modes into a plurality of chords, where each chord includes a subset of the plurality of vibrational modes, calculating, for each chord, a chord sound field in the time domain, where the chord sound field describes acoustic pressure surrounding the object when the object oscillates in accordance with the subset of the plurality of vibrational modes, deconflating each chord sound field into a plurality of modal sound fields, where each modal sound field describes acoustic pressure surrounding the object when the object oscillates in accordance with a single vibrational mode, and storing each modal sound field in a far-field acoustic transfer (FFAT) map.