Provided is a substrate cleaning apparatus including: a substrate holding and rotating mechanism configured to hold and rotate a substrate; a cleaning liquid supplier configured to supply a cleaning liquid to the substrate; a cleaning member configured to come into contact with the substrate to clean the substrate; a charge amount adjustment apparatus capable of increasing and decreasing a charge amount of the substrate; a charge amount measuring instrument configured to measure the charge amount of the substrate; and a controller configured to control the charge amount adjustment apparatus according to the charge amount measured by the charge amount measuring instrument.

An air duct that can be attached to existing grille of an electronic device to improve airflow and reduce overall system impedance/pressure drop without increasing the power to an air mover. The air duct has a wall configuration to smooth-out airflow while simultaneously delivering more airflow to selected portions of the interior of an electronic device, such as a server.

An air duct that can be attached to existing grille of an electronic device to improve airflow and reduce overall system impedance/pressure drop without increasing the power to an air mover. The air duct has a wall configuration to smooth-out airflow while simultaneously delivering more airflow to selected portions of the interior of an electronic device, such as a server.

In one embodiment, an aircraft electronics system includes a hardware processor, a charge collection circuit to collect charge; a switching circuit controlled by the hardware processor to discharge the charge collected on the charge collection circuit through a bonding circuit formed from a chassis and a bonding surface; and a voltage measurement circuit to measure a voltage difference between measurement terminals across the chassis and the bonding surface.

A touchpad module for a computing device is provided. The touchpad module is installed within a fixing frame of the computing device. The touchpad module includes a base plate, a touch member, a conductive supporting structure, a first adhesive layer, a second adhesive layer and a conducting element. The touch member is located over the base plate. The conductive supporting structure is arranged between the base plate and the touch member. The conducting element is connected between the base plate and the fixing frame of the computing device. An electrostatic discharge path is defined by the touch member, the conductive supporting structure, the base plate, the conducting element and the fixing frame of the computing device collaboratively. In addition, static electricity generated on the touch member is guided out of the touchpad module through the electrostatic discharge path.

A touchpad module for a computing device is provided. The touchpad module is installed within a fixing frame of the computing device. The touchpad module includes a base plate, a touch member, a conductive supporting structure, a first adhesive layer, a second adhesive layer and a conducting element. The touch member is located over the base plate. The conductive supporting structure is arranged between the base plate and the touch member. The conducting element is connected between the base plate and the fixing frame of the computing device. An electrostatic discharge path is defined by the touch member, the conductive supporting structure, the base plate, the conducting element and the fixing frame of the computing device collaboratively. In addition, static electricity generated on the touch member is guided out of the touchpad module through the electrostatic discharge path.

An electrostatic discharge bag may include a bottom portion, and a front portion integrally connected to the bottom portion and including a first inside-out creased edge. The electrostatic bag may include a first side portion integrally connected to the bottom portion and the front portion and including a second inside-out creased edge and a first pair of outside-in creased edges, and a second side portion integrally connected to the bottom portion and the front portion and including a third inside-out creased edge and a second pair of outside-in creased edges. The first and second pairs of outside-in creased edges may enable the electrostatic discharge bag to collapse inward and downward toward the bottom portion. The electrostatic discharge bag may include a rear portion integrally connected to the bottom portion, the first side portion, and the second side portion and including a fourth inside-out creased edge.

An electrostatic discharge bag may include a bottom portion, and a front portion integrally connected to the bottom portion and including a first inside-out creased edge. The electrostatic bag may include a first side portion integrally connected to the bottom portion and the front portion and including a second inside-out creased edge and a first pair of outside-in creased edges, and a second side portion integrally connected to the bottom portion and the front portion and including a third inside-out creased edge and a second pair of outside-in creased edges. The first and second pairs of outside-in creased edges may enable the electrostatic discharge bag to collapse inward and downward toward the bottom portion. The electrostatic discharge bag may include a rear portion integrally connected to the bottom portion, the first side portion, and the second side portion and including a fourth inside-out creased edge.

Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.

A thermal control tape for providing thermal control of a spacecraft structure, to which the thermal control tape is applied is provided. The thermal control tape has a filled silicone resin layer having a first side and a second side. The filled silicone resin layer has a silicone resin material filled with a white inorganic filler material. The tape further has a silicone pressure sensitive adhesive (PSA) layer having a first side and a second side, the first side of the silicone PSA layer attached to the second side of the filled silicone resin layer. The filled silicone resin layer and the silicone PSA layer form the thermal control tape, with the second side of the silicone PSA layer configured for attachment to at least one surface of the spacecraft structure of a spacecraft, to provide thermal control of the spacecraft structure, by radiating heat away from the spacecraft structure.