Patent classifications
H05F1/00
Composite tubes for a fluid transport system
A method and apparatus for reducing an intensity of an electrical discharge that occurs within a fluid transport system in an aerospace vehicle. In one illustrative embodiment, an apparatus includes a transport member. The transport member is configured for use in the fluid transport system. The transport member includes a material configured to reduce voltages and currents, induced in response to an electromagnetic event, along the transport member.
Composite tubes for a fluid transport system
A method and apparatus for reducing an intensity of an electrical discharge that occurs within a fluid transport system in an aerospace vehicle. In one illustrative embodiment, an apparatus includes a transport member. The transport member is configured for use in the fluid transport system. The transport member includes a material configured to reduce voltages and currents, induced in response to an electromagnetic event, along the transport member.
Antistatic film and liquid crystal display device
An antistatic film including: a substrate film made of a thermoplastic resin containing a polymer including an alicyclic structure; and an antistatic layer provided on the substrate film, the layer containing electroconductive metal oxide particles, wherein the antistatic layer has a surface resistance of 1.010.sup.6 /sq. or more and 1.010.sup.10 /sq. or less, and the antistatic film has a haze value of 0.3% or less.
Antistatic film and liquid crystal display device
An antistatic film including: a substrate film made of a thermoplastic resin containing a polymer including an alicyclic structure; and an antistatic layer provided on the substrate film, the layer containing electroconductive metal oxide particles, wherein the antistatic layer has a surface resistance of 1.010.sup.6 /sq. or more and 1.010.sup.10 /sq. or less, and the antistatic film has a haze value of 0.3% or less.
Integrated capacitive discharge electrical bonding assurance system
In one embodiment, an aircraft electronics system includes a hardware processor, a charge collection circuit to collect charge; a switching circuit controlled by the hardware processor to discharge the charge collected on the charge collection circuit through a bonding circuit formed from a chassis and a bonding surface; and a voltage measurement circuit to measure a voltage difference between measurement terminals across the chassis and the bonding surface.
Portable Static Reducer
The present invention relates to reducing static electricity in the general populations clothing, as well as but not limited to, static electricity shock between a person and metal. The present invention consists of a protective material or tubing (1a and 2a) shaped to protect a Resistor (1b and 2b). Metal attachments or Metal Screws (1c and 2c) are attached to said Protective Material and to said Resistor (1b and 2b). The static electricity flows from the screws, to the resistor, neutralizing the static shock to the person. The same neutralizing capability reduces static electricity in clothing. The static electricity flows from the clothing to the resistor, neutralizing the static charge.
Portable Static Reducer
The present invention relates to reducing static electricity in the general populations clothing, as well as but not limited to, static electricity shock between a person and metal. The present invention consists of a protective material or tubing (1a and 2a) shaped to protect a Resistor (1b and 2b). Metal attachments or Metal Screws (1c and 2c) are attached to said Protective Material and to said Resistor (1b and 2b). The static electricity flows from the screws, to the resistor, neutralizing the static shock to the person. The same neutralizing capability reduces static electricity in clothing. The static electricity flows from the clothing to the resistor, neutralizing the static charge.
Lightning suppression-type wind power generation equipment
A wind power generation facility capable of realizing a lightning strike suppression effect while maintaining power generation efficiency by maintaining a blade shape that greatly affects power generation efficiency. An erected support column, a generator G provided at an upper portion of the support column, a hub H provided on a drive shaft that rotationally drives the generator, a plurality of blades radially provided to the hub about the drive shaft, charged bodies provided at tips of the blades, and a capacitor provided in an inner space of the hub are provided, and the capacitor includes a first electrode body that is grounded and a second electrode body that faces the first electrode body with an electrically insulating layer interposed therebetween and connected to the charged bodies.
SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTATIC DISCHARGE (ESD) PREVENTION LAYER
Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.
SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTATIC DISCHARGE (ESD) PREVENTION LAYER
Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.