A device package and a method of forming a device package are described. The device package includes a dielectric on a conductive pad, and a first via on a first seed on a top surface of the conductive pad. The device package further includes a conductive trace on the dielectric, and a second via on a second seed layer on the dielectric. The conductive trace connects to the first via and the second via, where the second via connects to an edge of the conductive trace opposite from the first via. The dielectric may include a photoimageable dielectric or a buildup film. The device package may also include a seed on the dielectric prior to the conductive trace on the dielectric, and a second dielectric on the dielectric, the conductive trace, and the first and second vias, where the second dielectric exposes a top surface of the second via.

A light-emitting diode (LED) tube lamp comprising a tube, end caps with contact pins and located on both ends of the tube, a first rectifying circuit and a second rectifying circuit and a filtering circuit that are coupled with the contact pins on the two end caps respectively, and a switch circuitry that is located between the rectifying circuits and the filtering circuit characterized in that the switch circuitry is capable of detecting whether the LED tube lamp is correctly installed on a lamp socket so as to reduce the risk of electric shock.

A light-emitting diode (LED) tube lamp comprising a tube, end caps with contact pins and located on both ends of the tube, a first rectifying circuit and a second rectifying circuit and a filtering circuit that are coupled with the contact pins on the two end caps respectively, and a switch circuitry that is located between the rectifying circuits and the filtering circuit characterized in that the switch circuitry is capable of detecting whether the LED tube lamp is correctly installed on a lamp socket so as to reduce the risk of electric shock.

An electronic element mounting substrate includes a first substrate that has a first main surface, has a rectangular shape, and has a mounting portion for an electronic element on the first main surface, and a second substrate that is located on a second main surface opposite to the first main surface, is made of a carbon material, has a rectangular shape, has a third main surface facing the second main surface and a fourth main surface opposite to the third main surface, in which the third main surface or the fourth main surface has heat conduction in a longitudinal direction greater than heat conduction in a direction perpendicular to the longitudinal direction, and that has a recessed portion on the fourth main surface.

Proposed are a multilayer wiring board having both durability and chemical resistance, and a probe card including the same.

A module for a networking node is disclosed. The module includes a Printed Circuit Board (“PCB”); one or more circuits mounted to the PCB; and a faceplate that including a plurality of plates, angled relative to one another, such that the faceplate includes increased surface area relative to a substantially flat faceplate, wherein at least two plates of the plurality of plates include physical ports each having track lengths to a circuit of one or more circuits, wherein one or more of the physical ports support signals at a rate of at least 100 Gbps. Each plate of the plurality of plates can be flat. Any of the plurality of plates can include physical ports. The physical ports can be pluggable modules. Each type of the physical ports can be a same type on a given plate.

A module for a networking node is disclosed. The module includes a Printed Circuit Board (“PCB”); one or more circuits mounted to the PCB; and a faceplate that including a plurality of plates, angled relative to one another, such that the faceplate includes increased surface area relative to a substantially flat faceplate, wherein at least two plates of the plurality of plates include physical ports each having track lengths to a circuit of one or more circuits, wherein one or more of the physical ports support signals at a rate of at least 100 Gbps. Each plate of the plurality of plates can be flat. Any of the plurality of plates can include physical ports. The physical ports can be pluggable modules. Each type of the physical ports can be a same type on a given plate.

A light-emitting diode (LED) tube lamp and an electric leakage protection circuit are provided. The LED tube lamp. The LED tube lamp includes a leakage detecting module and a driving module comprising a Type A+B driving circuit. The leakage detecting module is connected with a power supply. The driving module is electrically connected with the leakage detecting module. The leakage detecting module detects a signal related to the output current of the power supply, and when the signal related to the output current of the power supply exceeds a reference signal, the leakage detecting module limits the current on a power loop connected to the power supply by periodically turning off a switch electrically connected to the power loop in series.

A light-emitting diode (LED) tube lamp and an electric leakage protection circuit are provided. The LED tube lamp. The LED tube lamp includes a leakage detecting module and a driving module comprising a Type A+B driving circuit. The leakage detecting module is connected with a power supply. The driving module is electrically connected with the leakage detecting module. The leakage detecting module detects a signal related to the output current of the power supply, and when the signal related to the output current of the power supply exceeds a reference signal, the leakage detecting module limits the current on a power loop connected to the power supply by periodically turning off a switch electrically connected to the power loop in series.

A device having a color photo resist pattern includes a 3D substrate, at least one color photo resist layer and at least one circuit pattern layer. The at least one color photo resist layer is formed on said 3D substrate and forms a visual pattern together. The at least one circuit pattern layer is formed on said visual pattern formed by said at least one color photo resist layer.