Through-hole mounted semiconductor assemblies are described. A printed circuit board (“PCB”) has first and second PCB sides and has a through hole therein. The through hole defines a hole area. A semiconductor package may be disposed in the hole area such that the semiconductor package is at least partially exposed on one or more of the first and the second PCB sides. Package contacts on the semiconductor package may be electrically coupled to PCB contacts disposed on one or more of the PCB sides. In some embodiments, one or more support structures may be coupled to the PCB and may touch the semiconductor package. In some embodiments, cooling devices may be placed in thermal communication with the semiconductor package on both sides of the PCB.

A micro-optical connector holder with an integrated mating system for an optical assembly, typically on a modem PCBA. The integrated mating system is used to hold the micro-optical connectors together during assembly and to apply constant pressure keeping the connectors fully mated. The invention also uses a spring-pin mechanism to keep the holder lid and connectors in place without the use of screws or glue to make assembly easier. The integrated mating system allows the micro-optical connectors to be easily installed and uninstalled for manufacturing and testing purposes. The connector plugs and connector receptacles are aligned and secured by the integrated connector holder.

This electronic circuit, includes a set of electronic boards intended to support components and linked together by joining elements. The joining elements include curved flexible printed circuits linking two opposing ends of two electronic boards running side by side, the said curved flexible printed circuits being foldable for erecting the electronic circuit into a volume so that the electronic circuit comprises electronic boards placed opposite one another.

According to an aspect, a display device includes: a substrate including a pixel portion and a terminal portion that are provided on a first surface of the substrate, a flexible printed circuit board that is bonded to the terminal portion, a polarizing plate that is bonded to a region facing the pixel portion in a second surface opposite to the first surface of the substrate, a support member that is bonded to a region facing the terminal portion in the second surface, and a covering member that is bonded to the polarizing plate and the support member.

A flexible printed circuit and printed circuit board soldered structure is provided. The structure includes signal transmission lines which dispense with any through hole, thereby enhancing integrity of high-frequency signals. The special design of the signal line structure of the flexible printed circuit and the printed circuit board together provides a satisfactory high-frequency signal transmission interface and enables a soldering technique which is highly practicable and compatible with the flexible printed circuit and printed circuit board soldered structure.

A method for manufacturing a multilayer coil includes preparing a first substrate by forming a first conductor pattern on a first insulating base material layer, preparing a second substrate by forming a second conductor pattern on a second insulating base material layer, and joining a surface of the first substrate on which the first conductor pattern is formed and a surface of the second substrate on which the second conductor pattern is formed together with only a joining layer made of a thermoplastic resin interposed therebetween. Amounts of deformation of the first and second insulating base material layers are less than that of the joining layer at a fusion temperature. The first and second conductor patterns are each a coil pattern having a coil axis that extends in a lamination direction in which the first substrate and the second substrate are laminated together.

Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein a surface of the inductor is substantially coplanar with a surface of the substrate. One or more thermal interconnect structures are on the surface of the inductor. A conductive feature is embedded within a board, where a surface of the conductive feature is substantially coplanar with a surface of the board. One or more thermal interconnect structures are on the surface of the conductive feature of the board, where the thermal interconnect structures provide a thermal pathway for cooling for the inductor.

An interface circuit having releasable electrical connectors and as little as a single relay providing a standardized connection between panel controls intended for three-wire, two-wire or combination three-wire/two-wire control and a motor drive or motor controller. In this way, greatly simplified manufacturing of control cabinets may be provided with variations in control strategy being implemented simply by the provision of different panel controls having prewired harnesses and connectors.

A multilayer resin substrate includes resin substrates laminated together, an overlapping portion in which a signal line as a conductor pattern and another conductor pattern overlap each other in a laminating direction of the resin substrates, and a non-overlapping portion in which the signal line and the other conductor pattern do no overlap each other in the laminating direction. A thin portion is provided at a position in the non-overlapping portion near the overlapping portion. The thin portion is a portion of the multilayer resin substrate which has a thickness smaller than the thickness in the overlapping portion in the laminating direction of the resin substrates.

There are included: a step of adjusting, on a surface of a base plate, the position of a housing which is made of a resin and is placed on the base plate so as to partially cover that base plate, to an extent that a contact portion of the housing with the base plate is kept straddling a groove that is formed on the surface of the base plate and has a width smaller than a width of the contact portion; a step of heating the base plate or the contact portion of the housing with the base plate while pressing the housing against the base plate; and a step of cooling the thus-heated base plate or contact portion of the housing with the base plate. This makes it possible to significantly improve the accuracy of the position adjustment.