The present disclosure relates to a tunable slow-wave transmission line. The tunable slow-wave transmission line is formed in a multi-layer substrate and includes an undulating signal path. The undulating signal path includes at least two loop structures, wherein each loop structure includes at least two via structures connected by at least one intra-loop trace. The undulating signal path further includes at least one inter-loop trace connecting the at least two loop structures. The tunable slow-wave transmission line includes a first ground structure disposed along the undulating signal path. Further, the tunable slow-wave transmission line includes one or more circuits that may alter a signal transmitted in the tunable slow-wave transmission line so as to tune a frequency of the signal.

The present disclosure relates to a tunable slow-wave transmission line. The tunable slow-wave transmission line is formed in a multi-layer substrate and includes an undulating signal path. The undulating signal path includes at least two loop structures, wherein each loop structure includes at least two via structures connected by at least one intra-loop trace. The undulating signal path further includes at least one inter-loop trace connecting the at least two loop structures. The tunable slow-wave transmission line includes a first ground structure disposed along the undulating signal path. Further, the tunable slow-wave transmission line includes one or more circuits that may alter a signal transmitted in the tunable slow-wave transmission line so as to tune a frequency of the signal.

The present disclosure relates to a slow-wave transmission line for transmitting slow-wave signals with reduced loss. In this regard, the slow-wave transmission line is formed in a multi-layer substrate and includes an undulating signal path. The undulating signal path includes at least two loop structures, wherein each loop structure includes at least two via structures connected by at least one intra-loop trace. The undulating signal path further includes at least one inter-loop trace connecting the at least two loop structures. Additionally, the slow-wave transmission line includes a first ground structure disposed along the undulating signal path. In this manner, a loop inductance is formed by each of the at least two loop structures, while a first distributed capacitance is formed between the undulating signal path and the ground structure.

The present disclosure relates to a slow-wave transmission line for transmitting slow-wave signals with reduced loss. In this regard, the slow-wave transmission line is formed in a multi-layer substrate and includes an undulating signal path. The undulating signal path includes at least two loop structures, wherein each loop structure includes at least two via structures connected by at least one intra-loop trace. The undulating signal path further includes at least one inter-loop trace connecting the at least two loop structures. Additionally, the slow-wave transmission line includes a first ground structure disposed along the undulating signal path. In this manner, a loop inductance is formed by each of the at least two loop structures, while a first distributed capacitance is formed between the undulating signal path and the ground structure.

There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an assembled flexible display.

The described technology includes a side emitting light emitting diode (LED) package with a bevel light emitting surface, and LED displays including the disclosed LED packages. The LED package can include a substrate, an LED chip, a light converter, and a cap. The LED chip can be positioned over the substrate, and the light converter can comprise a transparent material also positioned over the substrate and surrounding the LED chip. The cap can be positioned over the light converter to inhibit emission of light perpendicular to the surface of the substrate. The outer side surfaces of the light converter can be inclined, so that the light converter is wider at the base than at the top. The incline angle can be selected to collimate emitted light. LED displays including the disclosed LED packages can include multiple LED packages affixed to a printed circuit board (PCB) along with other components.

Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.

A transparent conductor includes a base layer, and a transparent conductive film on one or both sides of the base layer, the transparent conductive film including a metal nanowire, where the base layer includes a retardation film. An optical display apparatus includes the transparent conductor. The transparent conductor may compensate for a viewing angle of the optical display apparatus.

A module for a networking node is disclosed. The module includes a Printed Circuit Board (“PCB”), one or more circuits mounted to the PCB and a faceplate. The faceplate includes a middle plate, a first side plate, and a second side plate. The first side plate extends from the middle plate at an obtuse angle relative to the middle plate towards a first side and back of the module. The second side plate extends from the middle plate, opposite to the first side plate, at an obtuse angle relative to the middle plate towards a second side and the back of the module.

A module for a networking node is disclosed. The module includes a Printed Circuit Board (“PCB”), one or more circuits mounted to the PCB and a faceplate. The faceplate includes a middle plate, a first side plate, and a second side plate. The first side plate extends from the middle plate at an obtuse angle relative to the middle plate towards a first side and back of the module. The second side plate extends from the middle plate, opposite to the first side plate, at an obtuse angle relative to the middle plate towards a second side and the back of the module.