An electronic rack includes a condensing unit to be coupled to a first distribution manifold to circulate single-phase cooling fluid received from a first cooling fluid source. The electronic rack further includes a server chassis unit positioned underneath the condensing unit, and the server chassis unit is coupled to a second distribution manifold to receive two-phase cooling fluid from a second cooling fluid source. The second distribution manifold fills the server chassis which contains one or more electronic devices to at least partially submerged the electronics devices in the two-phase cooling fluid, wherein the two-phase cooling fluid is to extract heat from the electronic devices and to evaporate into vapor upwardly into the condensing unit, and wherein the condensing unit is to condense the vapor into a fluid phase and to return the fluid downwardly back into the server chassis unit.

Aspects of the disclosure provide a printed circuit board (PCB) system that includes an integrated circuit (IC) package, a first PCB and a PCB module. The IC package has a package substrate and an IC chip that is coupled to a top surface of the package substrate. The first PCB is configured to electrically couple with first contact structures that are disposed on a bottom surface of the package substrate. The PCB module includes a second PCB and one or more electronic components electrically coupled to the second PCB. The PCB module is configured to electrically couple with second contact structures that are disposed on the top surface of the package substrate.

Aspects of the present disclosure relate to modular expansion systems for use in head-worn computing systems. In an head-worn computer, an electrical connector is adapted to electrically connect with a modular expansion module, wherein the modular expansion module adds a capability to the head-worn computer and is removeably mounted to the head-worn computer, and a mount is adapted to physically secure the modular expansion module to the head-worn computer.

Implantable medical devices that include a battery to power circuitry utilize a battery connector to electrically interconnect the battery to the circuitry. The battery connector may be mounted directly to a device housing to have the battery connector a fixed position within the device. Battery terminals of the battery are electrically connected to terminals on the battery connector, and the terminals on the battery connector are electrically connected to power terminals of the circuitry. The battery connector may include various features such as mounting grooves formed in a connector body, tapered pins to connect to power terminals on a circuit board, as well as plates to engage the battery terminals. The device housing may provide mounting features that allow the battery connector to be affixed directly to the device housing.

Embodiments are disclosed of a cooling apparatus with one or more cold plates, each adapted to be thermally coupled to a heat-generating electronic component on a piece of IT equipment. A fluid control module is mounted to the substrate and fluidly coupled to the cold plates. The fluid control module includes a fluid inlet with an inlet mechanism adapted to enable and disable the fluid inlet; the inlet mechanism enables the fluid inlet when energized and disables the fluid inlet when de-energized. The fluid control module also includes a fluid outlet with an outlet mechanism adapted to enable and disable the fluid outlet; the outlet mechanism enables the fluid outlet when energized and disables the fluid outlet when de-energized. A dedicated power supply is electrically coupled to the inlet mechanism and the outlet mechanism, and when the inlet mechanism is de-energized, the outlet mechanism is also de-energized after a delay.

A device is described for ensuring the installation of a component at the designated installation location of said component in a system, made up of two parts, the first part of the device being attached to the component, and the second part of the device being attached to the system to which the component will be attached, and, during installation of the component into the system at the designated installation location of said component, the first part of the device and the second part of the device interlock precisely and enable assembly, in that the first part of the device and the second part of the device interact exclusively mechanically and exclusively enable the ensuring of the installation of the component at the designated installation location of the component in the system. When installing the component at a non-designated installation location on the system, the interaction of the first part of the device and the second part of the device, which form a poka-yoke system with each other, prevents installation.

A cold worked stainless steel bezel for a portable electronic device is provided. The bezel is secured flush to a housing to form part of the case of the portable electronic device. A brace that includes a slot for receiving a wall extending from the bezel is fixed to the housing. When the bezel engages the housing, the wall of the bezel is inserted in the slot of the brace and releasably held by a spring that engages both the brace and the wall. The bezel can be released by disengaging the spring, (e.g., using a special tool or a magnetic field). Because the bezel is manufactured from cold worked stainless steel, it is hard and resistant to impacts. Cold worked steel also facilitates manufacturing within design constraints and tolerances, and requires very little machining after manufacturing to comply with those constraints.

An electronic device includes one or more multinode pads having two or more conductive segments spaced from one another on a semiconductor die. A conductive stud bump is selectively formed on portions of the first and second conductive segments to program circuitry of the semiconductor die or to couple a supply circuit to a load circuit. The multinode pad can be coupled to a programming circuit in the semiconductor die to allow programming a programmable circuit of the semiconductor die during packaging. The multinode pad has respective conductive segments coupled to the supply circuit and the load circuit to allow current consumption or other measurements during wafer probe testing in which the first and second conductive segments are separately probed prior to stud bump formation.

A connection structure for attaching a first electronic device onto a second electronic device is disclosed. The connection structure comprises an action unit and an assist unit, wherein the action unit and the assist unit are particularly designed to be cooperated to each other in case of connecting the first electronic device to the second electronic device. After the first electronic device is attached to the second electronic device through the connection structure, a first electrical connection portion of an electronic card is inserted into an electronic card slot in the first electronic device, and a second electrical connection portion of the electronic card is inserted into an electronic card slot in the second electronic device, thereby making the two electronic devices communicate with to each other through the electronic card. As a result, the function(s) of the first electronic device is expended.

An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused along the edge of a planar glass member to enhance the thickness of the edge. A rounded edge feature may be formed by machining the thickened edge. Raised fused glass features may surround openings in the planar glass member. Multiple planar glass members may be fused together to form a five-sided box in which electronic components may be mounted. Raised support structure ribs may be formed by fusing glass structures to a planar glass member. Opaque masking material and colored glass may be used to create portions of the glass housing structures that hide internal device components from view.