An electronic component module includes a substrate having a main surface, an electronic component mounted on the main surface, a sealing resin having an insulation property and covering the electronic component and the main surface, and a conductive film that covers an outer surface of the sealing resin. The electronic component includes a housing whose outer surface has an insulation property, and a first external electrode arranged at one end of the housing. The electronic component module includes a conductive auxiliary layer that covers a part of the first external electrode and a part of the housing on a side of the electronic component opposite to the substrate. The sealing resin has a recessed portion that exposes the conductive auxiliary layer. A conductive portion is formed in the recessed portion and is connected to the conductive film and the conductive auxiliary layer.

An information handling system with a cooling system may include a processor; a memory; a power management unit (PMU); a cooling system including: a fan; and a cooling system heat pipe; a detachable thermal module including: a first heat conductive element to be operatively coupled to a heat producing components such as a processor, a radio module, or other component; a second heat conductive element to be operatively coupled to the cooling system heat pipe of the cooling system; and a detachable thermal module heat pipe formed between the first heat conductive element and the second heat conductive element.

The present disclosure provides an electromagnetic wave absorbing material, including a core containing iron oxide having a first thermal expansion coefficient; and a shell layer covering the core, which has a second thermal expansion coefficient less than the first thermal expansion coefficient, and the shell layer contains an inorganic compound selected from a group consisting of oxides, nitrides or any combination thereof. The present disclosure further provides a composite structure for suppressing electromagnetic interference including the electromagnetic wave absorbing material as claimed.

The present invention is directed at electromagnetic shielding that is particularly suitable for applications in electric vehicles. The electromagnetic shielding is relatively lightweight and can be integrated into a carpet or textile type construction.

A module that improves heat-dissipation efficiency and can prevent a warp and a deformation of the module is provided. A module includes a substrate, a first component mounted on an upper surface of the substrate, a heat-dissipation member, and a sealing resin layer that seals the first component and the heat-dissipation member. The heat-dissipation member is formed to be larger than the area of the first component when viewed in a direction perpendicular to the upper surface of the substrate and prevents heat generation of the module by causing the heat generated from the first component to move outside the module. The heat-dissipation member has through holes, and the through holes are packed with a resin, which can prevent the sealing resin layer from peeling off.

According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.

According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.

An electromagnetic shield member that includes a pressing mechanism with: a cylinder provided on one of a bottom wall of the groove and an opposing wall of the cover opposing the bottom wall of the groove; a piston provided so as to be capable of reciprocal movement in the cylinder; a spring that is provided in the cylinder, and is configured to bias the piston toward one end of the cylinder; and a piston rod that is coupled to the piston, protrudes from the one end of the cylinder, and has a leading end configured to press the electrical wire.

A housing wall includes at least one air grid having at least a first layer with a first mesh structure and a second layer with a second mesh structure. The first mesh structure is coextensively arranged with the second mesh structure. The first layer and the second layer are electrically conductively coupled. The first mesh structure includes a first plurality of through-holes. The second mesh structure includes a second plurality of through-holes. The through-holes of the first plurality of through-holes are misaligned compared to through-holes of the second plurality of through-holes such that a nonuniform total through-hole configuration of the air grid is provided.

An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.