Enclosures and corresponding magnetic joints. An apparatus includes an enclosure. The enclosure includes a magnetic panel joint formed by: an alignment bore disposed in one of the first end face and the second end face, an alignment dowel disposed in the other of the first end face and the second end face, a face magnet disposed in one of the first end face and the second end face, a face ferromagnetic segment disposed in the other of the first end face and the second end face, and a shield that extends from the second panel and is received in the first pocket, when the first panel and the second panel are removably secured to one another.

A method for managing electromagnetic interference (EMI) includes: obtaining electromagnetic radiation from a device, disposed in an internal volume of a data processing device, while the internal volume is EMI isolated and after the device performs a function; making a determination that the device disposed in the internal volume has an optical state associated with the electromagnetic radiation; and performing a first action set based on the determination, in which the electromagnetic radiation is obtained through a boundary of the internal volume.

A texture recognition device and a display device are provided. The texture recognition device includes a backlight element, configured to provide first backlight; a light constraint element, configured to perform a light divergence angle constraint process on the first backlight to obtain second backlight with a divergence angle within a preset angle range, the second backlight being transmitted to a detection object; and a photosensitive element, configured to detect the second backlight reflected by a texture of the detection object to recognize a texture image of the texture of the detection object.

A technique for an AMR-based sensing circuit allows current measurements over a wide frequency range. This is accomplished by folding the current carrying trace around the AMR sensor to concentrate and normalize the magnetic field generated by the current over a wide frequency range. Experimental results show that the sensor, when implemented with the proposed method, has an improved bandwidth of >10 MHz and enhanced sensitivity to high frequency currents evinced by the sensor output at DC or lower frequencies. The method is applicable for example in high frequency power converters where inductor current is used to control the ripple and transient response.

The display assembly includes a display module, a flexible printed board, an integrated circuit chip, and a composite tape. The integrated circuit chip and a binding portion of the flexible printed board are respectively in binding connection with the display module. The composite tape includes: a conductive fabric layer comprising a first part and a second part, the first part covering the integrated circuit chip and the binding portion, and the second part covering at least part of a grounding portion of the flexible printed board; and an insulating film layer on a side of the conductive fabric layer facing the integrated circuit chip and the flexible printed board, and including a third part, which is at the first part of the conductive fabric layer and covering the integrated circuit chip and the binding portion, and the insulating film layer avoiding the at least part of the grounding portion.

A wire harness unit including: a conduction path that conducts electricity between in-vehicle devices; and a cooling tube that cools the conduction path, wherein: the conduction path has a hollow tubular conductor having conductivity, and a first insulating layer covered by the tubular conductor, the cooling tube is configured to circulate a refrigerant therethrough and is separate from the tubular conductor, and the cooling tube passes through the first insulating layer.

An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.

Provided is an electromagnetic wave shielding film capable of easily adhering to an object, excellent in electrical connection stability, and excellent in transparency, shielding performance, and environmental resistance. The electromagnetic wave shielding film of the present invention has a first insulating layer, a transparent metal layer, a second insulating layer, and a conductive adhesive layer laminated in this order, in which a thickness of the second insulating layer is 10 to 500 nm, the conductive adhesive layer contains a binder component and spherical conductive particles, a median size of the spherical conductive particles is 3 to 50 μm, and a content ratio of the spherical conductive particles is 5 to 20 mass % with respect to 100 mass % of the conductive adhesive layer.

An IC package includes a substrate, a first monolithic die, a second monolithic die and a third monolithic die. A processing unit circuit is formed in the first monolithic die. A plurality of SRAM arrays are formed in the second monolithic die, wherein the plurality of SRAM arrays include at least 5-20 G Bytes. A plurality of DRAM arrays are formed in the third monolithic die, wherein the plurality of DRAM arrays include at least 64-512 G Bytes. The first monolithic die, the second monolithic die and the third monolithic die are vertically stacked above the substrate. The third monolithic die is electrically connected to the first monolithic die through the second monolithic die.

The present disclosure provides a method of manufacturing a conductive pattern and applications thereof, the method including: a step of preparing a laminate including a transparent substrate, a light shielding pattern that is formed on the transparent substrate, and a negative tone photosensitive resin layer that is disposed on the transparent substrate and the light shielding pattern and is in contact with the transparent substrate; a step of irradiating a surface of the transparent substrate opposite to a surface facing the light shielding pattern with light; a step of developing the negative tone photosensitive resin layer to form a resin pattern in a region defined by the transparent substrate and the light shielding pattern; and a step of forming a conductive pattern on the light shielding pattern.