Methods, systems, and apparatuses provide power from multiple input power sources to adjacent outputs efficiently and reliably. Aspects of the disclosure provide a power distribution unit (PDU) that includes a number of power outputs including first and second adjacent power outputs. The PDU includes a printed circuit board having a first conducting layer electrically interconnected to a first power input connection and the first power output, a second conducting layer that is at least partially above the first conducting layer and in facing relationship thereto. The second conducting layer is electrically insulated from the first conducting layer and electrically interconnected with a second power input connection and the second power output, the first and second power outputs thereby connected to different power inputs.

A lower surface of a board arranged at a working position is supported by a board supporter, and heights of a plurality of portions of the lower surface of the board are measured by a plurality of height measuring instruments attached to the board supporter. A component is installed on the board by control of a height of the installation of the component by an installation head and with respect to the board, which has the lower surface supported by the board supporter, being performed based on the height of the plurality of portions of the lower surface of the board measured by the plurality of height measuring instruments.

A module installation assembly for installing a module into a socket of a land grid array includes a tool having a mounting bracket for connecting the tool to an adjacent fixture, an alignment member connected to the mounting bracket, and cavity defined at least partially by the alignment member. The cavity is substantially aligned with a socket of the land grid array such that the module is configured to pass through the cavity when being connected to the socket.

Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.

For a component receiving member provided with a component reception recess shaped according to a component that is a storage target, and side wall section that a component held by suction nozzle contacts when moved in the left-right direction, when the component is released in a state contacting the side wall section, the component is stored in the component reception recess by leads of the component falling along a tapered surface and the component rotating 90 degrees due to its own weight. Therefore, even in a case in which the component is held by suction nozzle with an upper surface facing up, the component is stored in the component reception recess with the upper surface facing up by the component rotating 90 degrees at the component receiving member.

A component mounting machine provided with multiple component transfer devices that each have a mourning nozzle, a movable section, and an XY driving mechanism and perform a component mounting operation, and a control device that controls component mounting operation and performs thermal correction processing that reduces influence of thermal deformation accompanying temperature change of at least one of the movable section and the XY driving mechanism, in which the control device has an implementation period determination section that individually determines an implementation period of the thermal correction processing for each of the component transfer devices based on operation circumstances of each component transfer device, and a thermal correction implementation section that simultaneously performs thermal correction processing for the multiple component transfer devices when it is determined that the implementation period of the thermal correction processing is reached for either of the component transfer devices by the implementation period determination section.

A heat dissipating antenna comprised of a low-attenuating heat spreader bonded to a high frequency antenna or antenna array.

An integrated circuit with a wireless integrated circuit chip, and a heat dissipating antenna coupled to the wireless integrated circuit chip. A method of forming a heat dissipating antenna.

A heat dissipating antenna comprised of a low-attenuating heat spreader bonded to a high frequency antenna or antenna array.

An integrated circuit with a wireless integrated circuit chip, and a heat dissipating antenna coupled to the wireless integrated circuit chip. A method of forming a heat dissipating antenna.

A component mounting system is provided with a plurality of component mounting apparatuses having recognition means (a substrate recognition camera) for reading out the substrate ID of the substrate, state detection means (a cover door sensor) for detecting that the substrate is in a state of being able to be inserted or removed, and an information acquisition portion that acquires the substrate ID of the substrate transmitted from the upstream component mounting apparatus which have delivered the substrate. Then, a prescribed number of the substrate IDs for the substrates on which components are mounted is read out in a case where it is detected that the substrate is in a state of being able to be inserted or removed.

A method for equipping printed circuit boards on an equipping machine, the printed circuit boards being of a first length, and the equipping machine being realized to equip printed circuit boards of a second length, the second length being more than twice as great as the first length. The equipping machine has an input section (1) and an equipping section (2), the equipping section (2) being disposed after the input section (1) in a direction of conveyance (F) of the printed circuit boards, disposed after the input section (1) in a direction of conveyance of the printed circuit boards, the printed circuit boards of the first length and the printed circuit boards of the second length being transportable, in their longitudinal direction, from the input section (1) into the equipping station (2).