Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a roller device may include a carriage or housing and one or more rollers coupled or integrated with the housing, configured to apply a protective material to a surface of the electronic device in a first orientation, and configured to function as a device stand in a second orientation. In addition or alternatively, a roller guide apparatus and/or a wedge may be utilized to assist the roller device in applying the protective material to the surface of the electronic device.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a roller device may include a carriage or housing and one or more rollers coupled or integrated with the housing, configured to apply a protective material to a surface of the electronic device in a first orientation, and configured to function as a device stand in a second orientation. In addition or alternatively, a roller guide apparatus and/or a wedge may be utilized to assist the roller device in applying the protective material to the surface of the electronic device.

In the component mounting system, when an electronic component having a positioning target is held and mounted onto the upper face of a board, the positioning target is aligned to a predetermined position of the board. The component mounting system detects a positional deviation of the positioning target on the upper face of the electronic component and performs an arrangement operation of arranging a positioning material on the board by correcting the arrangement position in accordance with the detected positional deviation. The component mounting system then performs a mounting operation for mounting the electronic component on the board by aligning the positioning target to the predetermined position of the board on which the positioning material has been arranged.

A mounting machine management system in which a management server, a terminal device, and a mounting machine are connected via a communication network such that communication is possible. The management server is provided with an authorization ID transmitting device configured to transmit an authorization ID that allows operation required for adjustment of the mounting machine to the terminal device and the mounting machine. The mounting machine is provided with an authorization ID acquiring device configured to acquire the authorization ID that the terminal device received from the management server, and an operation permitting device configured to allow the operation required for adjustment of the mounting machine in a case in which the authorization ID acquired by the authorization ID acquiring device matches the authorization ID that the mounting machine received from the management server.

A component mounting device includes a component supply device that supplies a component to a component supply position by using a component housing tape, a head unit provided with a suction nozzle that can be moved up and down, a first image capturing unit that captures the component supplied to the component supply position, and a component posture determination unit that determines the posture of the component supplied to the component supply position. Based on a captured image captured by the first image capturing unit, the component posture determination unit determines whether the component takes an abnormal posture protruding from a component housing part in a direction intersecting the vertical direction on a horizontal plane in the component housing tape.

A carrier assembly configured to facilitate manufacture of a printed circuit board assembly includes a bottom frame defining a generally rectangular configuration and having a length and a width. The bottom frame is adjustable to vary at least one of the length or the width thereof. The assembly further includes a core releasably positionable on the bottom frame and configured to support a circuit board thereon. A carrier assembly system includes the bottom frame and a plurality of cores. Methods of manufacturing printed circuit board assemblies utilizing carrier assemblies are also provided.

A device for handling components that is designed and equipped to handle components with multiple lateral surfaces and/or edges of the lateral surfaces. The device has at least one receiving tool, which is arranged on a turning device, for a respective component of the components, where the receiving tool is designed and equipped to receive the respective component on one of the component cover surfaces. The turning device is designed and equipped to rotate the receiving tool on a turning plane about a turning axis, and in the process optionally convey a component located on the receiving tool from a receiving position to one or more orientation positions, optionally one or more inspecting positions, a setting-down position, and optionally an ejecting position. The device also has a holding and supplying device, which faces the receiving position, for a component supply, and a discharge device.

A method of manufacturing an electronic component includes temporarily fixing an electronic component body to a support with a temporary fixation material having an area smaller than that of the electronic component body interposed therebetween, disposing a shield resin layer having an area larger than that of an upper surface of the electronic component body on the upper surface of the electronic component body, and applying pressure to the shield resin layer via an elastic layer and causing the shield resin layer to adhere such that the shield resin layer extends from the upper surface that is the surface of the electronic component body opposite to the temporary fixation material to a bottom surface that is a surface of the electronic component body that faces the temporary fixation material via side surfaces of the electronic component body.

A display cover to housing interface system includes a display screen fronted by a display cover having front and obverse faces and a distal edge between the faces around a circumference thereof (i.e., edge thickness), and also an outer housing that provides support for the display cover. A portion of the display cover distal edge or thickness is fully exposed to outside, such that the display cover is exposed and substantially visible when viewed directly from the front and at least one side while installed. The display cover can be glass, while the housing is metal. A protective layer located between the housing and display cover protects the display cover from the housing. Various support components hold the display cover in place, and can include magnets and/or a stabilizer assembly affixed along a bottom edge of the display cover and adapted to couple to a bottom chin of the housing.

A substrate work machine for repeatedly performing substrate work, the substrate work machine including a data storing section configured to store component data used in the substrate work, the component data including shape data related to a shape of an electronic component to be mounted on a substrate, a reference value and a tolerance; a data determining section configured to determine whether a difference between measurement data acquired by measuring the electronic component during the substrate work and the reference value of the component data is within a range of the tolerance; a quality information acquiring section configured to acquire work quality information related to a performance condition of a second substrate work machine; and a data correcting section configured to correct at least one of the reference value and the tolerance in accordance with the work quality information.