A product-sum calculation with high power efficiency is performed while maintaining a small area of a memory cell. A semiconductor device includes a memory cell array in which a plurality of memory cells is arranged in a matrix. Then, each memory cell of the plurality of memory cells includes a flip-flop circuit including two inverter circuits in each of which a load field effect transistor and a drive field effect transistor are connected in series, input portions and output portions of the two inverter circuits being cross-joined to each other, two transfer field effect transistors each having a gate electrode connected to a word line, and a pair of first and second main electrode regions, the first main electrode regions being respectively connected to the output portions of the two inverter circuits, and two resistance elements of which one end sides are respectively connected to the second main electrode regions of the two transfer field effect transistors and other end sides are respectively connected to a bit line and a bit line bar.

A semiconductor device, the device comprising: a first silicon layer comprising first single crystal silicon; an isolation layer disposed over said first silicon layer; a first metal layer disposed over said isolation layer; a second metal layer disposed over said first metal layer; a first level comprising a plurality of transistors, said first level disposed over said second metal layer, wherein said isolation layer comprises an oxide to oxide bond surface, wherein said plurality of transistors comprise a second single crystal silicon region; and a plurality of capacitors, wherein said plurality of capacitors comprise functioning as a decoupling capacitor to mitigate power supply noise.

A method includes specifying a target memory macro, and determining failure rates of function-blocks in the target memory macro based on an amount of transistors and area distributions in a collection of base cells. The method also includes determining a safety level of the target memory macro, based upon a failure-mode analysis of the target memory macro, from a memory compiler, based on the determined failure rate.

A semiconductor device including: a first silicon level including a first single crystal silicon layer and a plurality of first transistors; a first metal layer disposed over the first silicon level; a second metal layer disposed over the first metal layer; a third metal layer disposed over the second metal layer; a second level including a plurality of second transistors, the second level disposed over the third metal layer; a fourth metal layer disposed over the second level; a fifth metal layer disposed over the fourth metal layer, where the fourth metal layer is aligned to the first metal layer with a less than 40 nm alignment error; a via disposed through the second level, where each of the second transistors includes a metal gate, where a typical thickness of the second metal layer is greater than a typical thickness of the third metal layer by at least 50%.

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin comprising silicon, the fin having a lower fin portion and an upper fin portion. A first insulating layer is directly on sidewalls of the lower fin portion of the fin, wherein the first insulating layer is a non-doped insulating layer comprising silicon and oxygen. A second insulating layer is directly on the first insulating layer directly on the sidewalls of the lower fin portion of the fin, the second insulating layer comprising silicon and nitrogen. A dielectric fill material is directly laterally adjacent to the second insulating layer directly on the first insulating layer directly on the sidewalls of the lower fin portion of the fin.

A semiconductor device includes fin patterns on a substrate, at least one gate electrode intersecting the fin patterns, source/drain regions on upper surfaces of the fin patterns, and at least one blocking layer on a sidewall of a first fin pattern of the fin patterns, the at least one blocking layer extending above an upper surface of the first fin pattern of the fin patterns, wherein a first source/drain region of the source/drain regions that is on the upper surface of the first fin pattern has an asymmetric shape and is in direct contact with the at least one blocking layer.

An integrated circuit device includes a fin-type active region protruding from a top surface of a substrate and extending in a first direction parallel to the top surface of the substrate, a gate structure intersecting with the fin-type active region and extending on the substrate in a second direction perpendicular to the first direction, a source/drain region on a first side of the gate structure, a first contact structure on the source/drain region, and a contact capping layer on the first contact structure. A top surface of the first contact structure has a first width in the first direction, a bottom surface of the contact capping layer has a second width greater than the first width stated above in the first direction, and the contact capping layer includes a protruding portion extending outward from a sidewall of the first contact structure.

A semiconductor structure is provided. The semiconductor structure includes a first dielectric fin and a second dielectric fin over a substrate, a first semiconductor fin between the first dielectric fin and the second dielectric fin, and an insulating liner surrounding a lower portion of the first dielectric fin, a lower portion of the first semiconductor fin, and a lower portion of the second dielectric fin. The semiconductor structure also includes a first gate electrode surrounding an upper portion of the first dielectric fin and an upper portion of the first semiconductor fin.

A multiport memory cell for register files is disclosed. Vertically stacked top and bottom tier of the memory cell are electrically interconnected through a pair of vias and comprise each an active device layer and a metal layer stack. The memory cell is partitioned to have a latching circuit and at least one write port located in the bottom tier and at least two read ports in the top tier. A word line trace for controlling the at least one write port is formed in the bottom tier metal layer stack and comprises two terminal sections and one intermediate section oriented perpendicularly to the terminal sections. The intermediate section is arranged between the pair of vias in a height direction of the memory cell.

Configurations of metal layers of interconnect structures, and methods of fabrication thereof, are disclosed for memories, such as a static random-access memory (SRAM). For example, bit lines are placed in a metal one (M1) layer, which is a lowest metallization level of an interconnect structure of a memory cell, to minimize bit line capacitance, and configure bit lines as the widest metal lines of the metal one layer to minimize bit line resistance. In some embodiments, the interconnect structure has a double word line structure to reduce word line resistance. In some embodiments, the interconnect structure has a double voltage line structure to reduce voltage line resistance. In some embodiments, jogs are added to a word line and/or a voltage line to reduce its respective resistance. In some embodiments, via shapes of the interconnect structure are configured to reduce resistance of the interconnect structure.