An OLED panel may include a substrate including a first region and a second region disposed along a first direction. A plurality of first pixels are disposed in the first region on the substrate, the first pixels each having a first area, the first pixels each comprising a first unit pixel, a second unit pixel disposed along a second direction from the first unit pixel, and a transmission portion disposed along the first direction from the first unit pixel and the second unit pixel. A plurality of second pixels are disposed in the second region on the substrate, the second pixels each having a second area less than the first area, the second pixels each comprising a third unit pixel. The first unit pixel, the second unit pixel, and the third unit pixel may have substantially the same shape as each other.

A white light emitting material having a chemical structural formula represented by formula (I), a preparation method thereof and application thereof. The preparation method comprises subjecting tris(4-iodophenyl)amine and 4-methoxyphenylacetylene or tris(4-iodophenyl)amine and methyl 4-ethynylbenzoate to a coupling reaction under protection of a protective gas and catalysis of a Pd/Cu mixed catalyst, to obtain the white light emitting material. A novel temperature-sensitive light emitting material is synthesized through a one-step method. The material is applied to the field of diode luminescence based on the temperature-sensitive characteristic. White light luminescence can be finally realized only by reasonably controlling the temperature and duration time during heating a substrate. Compared with the existing art, the method greatly saves raw material costs and manufacturing process costs, and provides a novel idea and strategy for use of a white organic light emitting diode.

Disclosed are a probe integrated with an organic light source and a manufacturing method thereof. An organic light source integration method includes forming a first thin film encapsulation layer on a probe shank, depositing a first electrode in a first region on the first thin film encapsulation layer, depositing an insulating layer in a second region on the first thin film encapsulation layer, depositing a light emitting layer on the first electrode and the insulating layer, depositing a second electrode on the light emitting layer, and forming a second thin film encapsulation layer on the second electrode.

A display panel includes a base layer, a signal line which is disposed on the base layer and includes a first layer including aluminum and a second layer disposed directly on the first layer and consisting of niobium, a first thin film transistor connected to the signal line, a second thin film transistor disposed on the base layer, a capacitor electrically connected to the second thin film transistor, and a light emitting element electrically connected to the second thin film transistor.

Provided is a light-emitting diode and a method for preparing the same. The light-emitting diode includes an anode, a hole transport layer, a perovskite light-emitting layer, an electron transport layer and a cathode stacked in sequence, in which the perovskite light-emitting layer includes a first sublayer and a second sublayer stacked in sequence, with a material for forming the first sublayer including an inorganic perovskite material, and with a material for forming the second sublayer being an organic perovskite material.

An opto-electronic device includes: (1) a substrate including a first region and a second region; and (2) a conductive coating covering the second region of the substrate. The first region of the substrate is exposed from the conductive coating, and an edge the conductive coating adjacent to the first region of the substrate has a contact angle that is greater than about 20 degrees.

An opto-electronic device includes: (1) a substrate including a first region and a second region; and (2) a conductive coating covering the second region of the substrate. The first region of the substrate is exposed from the conductive coating, and an edge the conductive coating adjacent to the first region of the substrate has a contact angle that is greater than about 20 degrees.

The fine metal mask provided in the present disclosure includes at least one mask pattern portion, and at least one protective portion that is disposed on and connected with at least one side edge of the at least one mask pattern portion, wherein a thickness of the at least one protective portion is less than a thickness of the at least one mask pattern portion.

A heat radiation member for a flexible display having a bending panel fixing member is disclosed, and an electronic device using the same is disclosed, wherein the heat radiation member includes a heat radiation sheet portion including a metal layer; a bending panel fixing member attached to a first area in one surface of the heat radiation sheet portion; a spacer attached to a second area in the one surface of the heat radiation sheet portion; a dummy double sided tape attached to the spacer; an upper delamination film covering an entire area of the other surface of the heat radiation sheet portion; and a lower delamination film covering an entire area of the dummy double sided tape and an entire area of the bending panel fixing member.

A display device includes pixels connected to scan lines and data lines intersecting the scan lines, wherein each of the pixels includes a light-emitting element, a driving transistor to control a driving current supplied to the light-emitting element according to a data voltage applied from the data lines, and a switching transistor to apply the data voltage of the data line to the driving transistor according to a scan signal applied from the scan lines. The driving transistor includes a first active layer having an oxide semiconductor and a first gate electrode below the first active layer. The switching transistor includes a second active layer having a same oxide semiconductor as the oxide semiconductor of the first active layer and a second gate electrode below the second active layer. At least one of the driving transistor and the switching transistor includes an oxide layer above each of the active layers.