An electro-optical package. In some embodiments, the package includes: a carrier; a first integrated circuit, on the carrier; a first bonding layer, between the carrier and the first integrated circuit; a thermoelectric cooler, on the carrier; a second integrated circuit, on the thermoelectric cooler; and a first wire bond. The first wire bond may connect a first pad, on the first integrated circuit, to a second pad, on the second integrated circuit, the first pad and the second pad having a height difference less than 100 microns.

An electrically-powered device, structure and/or component is provided that includes an attached electrical power source in a form of a unique, environmentally-friendly energy harvesting element or component. The energy harvesting component provides a mechanism for generating autonomous renewable energy, or a renewable energy supplement, in the integrated circuit system, structure and/or component. The energy harvesting element includes a first conductor layer, a low work function layer, a dielectric layer, and a second conductor layer that are particularly configured in a manner to promote electron migration from the low work function layer, through the dielectric layer, to the facing surface of the second conductor layer in a manner that develops an electric potential between the first conductor layer and the second conductor layer. The energy harvesting component includes a plurality of energy harvesting elements electrically connected to one another to increase an electrical power output.

An electrocaloric module includes an electrocaloric element that includes an electrocaloric film, a first electrode on a first surface of the electrocaloric film, and a second electrode on a second surface of the electrocaloric film. A support is attached along an edge portion of the electrocaloric film, leaving a central portion of the electrocaloric film unsupported film. At least one of the first and second electrodes includes a patterned disposition of conductive material on the film surface. The electrocaloric module also includes a first thermal connection configured to connect to a first thermal flow path between the electrocaloric element and a heat sink, a second thermal connection configured to connect to a second thermal flow path between the electrocaloric element and a heat source, and a power connection connected to the first and second electrodes and configured to connect to a power source.

The integrated circuit (IC) described herein lowers the start-up voltage to, for example, 50 mV, compatible for starting a DC-DC converter from a thermoelectric generator (TEG), even with a small temperature gradient. The IC further improves end-to-end efficiency of the energy harvester by improving power efficiency of the DC-DC converter while ensuring maximum power transfer from the TEG at low voltages. The IC uses a low voltage integrated charge pump that can boost sub-100 mV input voltage. A startup clock is generated by a ring-oscillator that begins operation with low supply (e.g., 50 mV or less), and which allows for one inductor to be used for DC-DC converter and for startup of the converter. The IC can be configured between the TEG and any downstream sensor or communication circuits to provide an acceptable (e.g., greater than 1 V) voltage for powering the downstream circuits from a low-voltage (e.g., less than 200 mV) TEG energy source.

A temperature sensor includes a block body, a first thermocouple, and a second thermocouple. The first thermocouple includes a first strand, a second strand, a first insulator surrounding the first strand and the second strand, and a first metal sheath surrounding the first insulator. The second thermocouple includes a third strand, a fourth strand, a second insulator surrounding the third strand and the fourth strand, and a second metal sheath surrounding the second insulator. An end portion of each of the first thermocouple and the second thermocouple is buried in the block body.

A wireless charger comprises a top cover; a metallic case; and a first thermoelectric cooler chip, disposed between a bottom surface of the top cover and a top surface of the metallic case to form a heat conductive path from the top cover to the metallic case via the first thermoelectric cooler chip for dissipating heat generated by an electronic device disposed on the top cover for wireless charging the electronic device.

The present application relates to EIC-INTEGRATED PICs. More particularly, various embodiments relate to EIC-INTEGRATED PICs enabling effective thermal management temperature control and heat removal.

An apparatus includes a first semiconductor fin and a second semiconductor fin that is parallel to the first semiconductor fin. The first semiconductor fin extends from a first region of a substrate near a circuit that produces thermal energy when a circuit is in operation to a second region of the substrate, which is disposed away from the circuit. The second semiconductor fin extends from the first region to the second region and has a different material composition than the first semiconductor fin. The first and second semiconductor fins collectively exhibit a Seebeck effect when the circuit is in operation. The apparatus includes interconnects to couple the first and second semiconductor fins to a power supply circuit to transfer electricity generated due to the Seebeck effect to the power supply circuit.

Provided is an anticorrosion device that does not require the installation of electrical equipment and has no concern about loss of anticorrosion effect due to deterioration of the anode. An anticorrosion device that prevents corrosion of a metal material in a structure, including a thermoelectric power generation unit 10 configured to generate an electromotive force due to a temperature gradient, an anode unit 20 that is responsible for an anode reaction corresponding to the electromotive force, and a cathode unit 30 that is responsible for a cathode reaction corresponding to the electromotive force, in which the cathode unit 30 is a metal material (target metal) in the structure.

A product includes an array of cold spray-formed structures. Each of the structures is characterized by having a defined feature size in at least one dimension of less than 100 microns as measured in a plane of deposition of the structure, at least 90% of a theoretical density of a raw material from which the structure is formed, and essentially the same functional properties as the raw material. A product includes a cold spray-formed structure characterized by having a defined feature size in at least one dimension of less than 100 microns as measured in a plane of deposition of the structure, at least 90% of a theoretical density of a raw material from which the structure is formed, and essentially the same functional properties as the raw material.