SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.

The present invention relates, in general terms, to piezoelectric thin films with an empirical formula (K.sub.1xNa.sub.x).sub.yNbO.sub.3, wherein 0≤x≤1 and 0.64≤y≤0.95. In particular, the piezoelectric thin film comprises at least two adjacent NbO.sub.2 planes in an antiphase boundary, the at least two adjacent NbO.sub.2 planes displaced from each other by about half a lattice length in either the (100), (010) or (100) crystallographic plane. The present invention also relates to methods of fabricating the piezoelectric thin films.

A film structure comprises a substrate and a buffer film formed on the substrate. The substrate is a 36° to 48° rotated Y-cut Si substrate, or the substrate is a SOI substrate including a base substance made of the 36° to 48° rotated Y-cut Si substrate, an insulating layer on the base substance, and a SOI layer made of a Si film on the insulating layer, and a mirror index of a crystal plane of an upper surface of the SOI layer is equal to a mirror index of a crystal plane of an upper surface of the base substance. The buffer film includes ZrO.sub.2 epitaxially grown on the substrate.

The acoustic wave device includes a crystal substrate cut from a quartz crystal boule cut by a rotational angle specified by a right-handed Euler angle (ϕ, θ, Ψ), and at least one comb-shape excitation electrode to excite the crystal substrate to make a plate waves. The rotational angle specified by the right-handed Euler angle (ϕ, θ, Ψ) is within ranges of ϕ=0±2°, θ=16.0° to 20.0°, and Ψ=0±2°. A plate wave, among the plate waves, having a phase velocity in a range of from 3500−4000 m/s, is selected as a vibration mode of the crystal substrate. When H represents a substrate-thickness of the crystal substrate and λ represents a wavelength of the plate wave, a normalized plate thickness H/λ is in a range of 1.5<H/λ<2.0.

A method for manufacturing a composite material, a sensor element or an active component of a sensor element. The sensor element is applied in a field device of automation technology. At least two materials with different physical and chemical properties are predetermined depending on a functionality of the sensor element or the active component of the sensor element. An outer shape, into which the at least two materials should be formed, is predetermined. The outer shape is divided into a plurality of virtual spatial regions, wherein in each virtual spatial region the material distribution of the at least two materials occurs homogeneously and periodically according to predetermined rules corresponding to a microstructure. The predetermined rules are ascertained via a computer supported method depending on the predetermined functionality of the sensor element or the active component of the sensor element, wherein digital data, which describe the ascertained distribution of the at least two materials, are transferred to at least one 3D printer. As a printed product the sensor element or the active component of the sensor element is created by the 3D printer based on the digital data.

In accordance with embodiments of the present disclosure, systems and methods for improving performance of ultrasonic transducers, particularly those used in borehole environments, are provided. The disclosed ultrasonic transducers all feature a backing element that is a ceramic backing material. The ceramic backing material may include a solid piece of ceramic material that is disposed on a back end of a piezoelectric element used in the ultrasonic transducer. The disclosed ceramic backing material may be used to mechanically match the backing element to the piezoelectric source element, while minimizing the amplitude of reflections of the ultrasonic pulse generated by the piezoelectric element and reflected at the far end of the backing element. This ceramic backing material may provide consistent performance regardless of the surrounding pressure and temperature, making it particularly useful in borehole applications.

A cordierite-based sintered body according to the present invention contains cordierite as a main component and silicon nitride or silicon carbide. The cordierite-based sintered body preferably has a thermal expansion coefficient less than 2.4 ppm; ° C. at 40° C. to 400° C., an open porosity of 0.5% or less, and an average grain size of 1 μm or less.

A piezoelectric fiber composite and a magnetoelectric laminate composite including the same are disclosed. The piezoelectric fiber composite includes a first protective layer having a first electrode, a second protective layer having a second electrode, and a piezoelectric fiber layer formed between the first and the second electrode and having piezoelectric fibers arranged in the longitudinal direction of the composite, wherein the piezoelectric fibers include a single-crystal piezoelectric material and are configured such that a <011> direction of the single crystal is identical to a thickness direction of the composite and a <001> direction of the single crystal is identical to a longitudinal direction of the composite, thus exhibiting superior piezoelectric strain properties and sensing properties. Also, the magnetoelectric laminate composite includes the piezoelectric fiber composite and a magnetostrictive layer including a magnetostrictive material such as nickel (Ni) or Metglas (FeBSi alloy), thus ensuring significantly improved magnetoelectric properties.

A piezoelectric cooling chamber and method for providing the cooling system are described. The cooling chamber includes a piezoelectric cooling element, an array of orifices and a valve. A vibrational motion of the piezoelectric cooling element causes an increase or decrease in a chamber volume as the piezoelectric cooling element is deformed. The array of orifices is distributed on at least one surface of the chamber. The orifices allow escape of fluid from within the chamber during the decrease in the chamber volume in response to the vibration of the piezoelectric element. The valve is configured to admit fluid into the chamber when the chamber volume increases and to substantially prevent fluid from exiting the chamber through the valve when the chamber volume decreases.

A connection method includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.