A mechanical connection is provided for a microelectromechanical and/or nanoelectromechanical device for measuring a variation in pressure. The device includes a fixed component extending in a main plane, a mobile component to move or deform in an out-of-plane direction under effect of a variation in pressure, and a detector of movement or deformation having at least one mobile element. The mechanical connection includes: a lever arm; a first connection connecting the mobile component to a first end of the lever arm, the first connection transmitting out-of-plane movement of the mobile component to the first end of the lever arm while allowing out-of-plane rotation of the lever arm about a direction of rotation; a second connection connected to the second end of the lever arm to allow mainly an out-of-plane rotation of the lever arm about an axis of rotation extending in the direction of rotation; a third connection connecting the lever arm to the detector at a given distance from the axis of rotation in the out-of-plane direction, the third connection being designed to convert the rotation of the lever arm about the axis of rotation into a translation in the plane of the at least one mobile element in a direction of translation.

An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.

A product includes an array of cold spray-formed structures. Each of the structures is characterized by having a defined feature size in at least one dimension of less than 100 microns as measured in a plane of deposition of the structure, at least 90% of a theoretical density of a raw material from which the structure is formed, and essentially the same functional properties as the raw material. A product includes a cold spray-formed structure characterized by having a defined feature size in at least one dimension of less than 100 microns as measured in a plane of deposition of the structure, at least 90% of a theoretical density of a raw material from which the structure is formed, and essentially the same functional properties as the raw material.

A piezoelectric element includes a lower electrode layer, an upper electrode layer, an orientation control layer disposed between the lower electrode layer and the upper electrode layer, and a piezoelectric layer formed on an upper surface of the orientation control layer. The piezoelectric layer is oriented in a (001) plane or a (100) plane and has a perovskite structure including Pb(Zn.sub.1/3, Nb.sub.2/3)O.sub.3. The orientation control layer has a perovskite structure, is oriented in the (001) plane or the (100) plane, and contains a part of components forming the piezoelectric layer, as an additive.

A transducer (140) having a mechanical impedance over an operative frequency range and having a desired power coupling (145) to a load over the operative frequency range comprises a piezoelectric device (141) having a frequency distribution of modes in the operative frequency range; and an overmould (143). The overmould (143) is arranged to surround at least part of the piezoelectric device (141); and the parameters of the overmould (143) are selected to provide a required impedance matching between the mechanical impedance of the transducer (140) and the mechanical impedance of the load. An alternative transducer comprises a mounting means for holding a discrete portion of at least a part of the periphery of the piezoelectric device wherein the parameters of the mounting means are selected to provide a required boundary condition for the periphery of the piezoelectric device whereby the desired power coupling between the transducer and the load is provided.

A system for cooling a mobile phone and method for using the system are described. The system includes an active piezoelectric cooling system, a controller and an interface. The active piezoelectric cooling system is configured to be disposed in a rear portion of the mobile phone distal from a front screen of the mobile phone. The controller is configured to activate the active piezoelectric cooling system in response to heat generated by heat-generating structures of the mobile phone. The interface is configured to receive power from a mobile phone power source when the active piezoelectric cooling system is activated.

Disclosed herein is a composition and a method for energy harvesting and the autonomous detection of structural failure. This method can be used to monitor, for example, the structural integrity of unmanned aircraft systems.

In some embodiments, a piezoelectric device is provided. The piezoelectric device includes a semiconductor substrate. A first electrode is disposed over the semiconductor substrate. A piezoelectric structure is disposed on the first electrode. A second electrode is disposed on the piezoelectric structure. A heating element is disposed over the semiconductor substrate. The heating element is configured to heat the piezoelectric structure to a recovery temperature for a period of time, where heating the piezoelectric structure to the recovery temperature for the period of time improves a degraded electrical property of the piezoelectric device.

A display device includes a touch panel; a display panel under the touch panel and displaying an image; a piezoelectric element under the touch panel and including an upper electrode, a lower electrode and a piezoelectric layer; and a rectifying circuit connected to the piezoelectric element.

A force-measuring and touch-sensing integrated circuit device includes a semiconductor substrate, a thin-film piezoelectric stack overlying the semiconductor substrate, piezoelectric micromechanical force-measuring elements (PMFEs), and piezoelectric micromechanical ultrasonic transducers (PMUTs). The thin-film piezoelectric stack includes a piezoelectric layer. The PMFEs and PMUTs are located at respective lateral positions along the thin-film piezoelectric stack, such that each of the PMFEs and PMUTs includes a respective portion of the thin-film piezoelectric stack. Each PMUT has a cavity, the respective portion of the thin-film piezoelectric stack, and first and second PMUT electrodes. Each PMFE has the respective portion of the thin-film piezoelectric stack, and first and second PMFE electrodes. Each PMFE is configured to output voltage signals between the PMFE electrodes in accordance with a time-varying strain at the respective portion of the piezoelectric layer resulting from a low-frequency mechanical deformation.