H10N30/00

Backing member and ultrasonic probe including leads and spacers embedded in a resin body

A backing member includes: a resin body including a lower surface and an upper surface opposite to each other; a plurality of leads each of which extends in a first direction from the lower surface toward the upper surface, and that are embedded at pitches in the resin body; and a plurality of insulating spacers each of which is provided between adjacent ones of the leads and extends in a second direction intersecting with the first direction, and that contact the leads.

WIDEBAND-ENABLED ELECTROACOUSTIC DEVICE

Certain aspects of the present disclosure can be implemented in an electroacoustic device. The electroacoustic device generally includes a substrate and one or more resonator structures disposed above the substrate. In some cases, each resonator structure of the one or more resonator structures includes a bulk acoustic resonator, an acoustic mirror disposed below the bulk acoustic resonator, and one or more porous material layers disposed below the acoustic mirror and above the substrate.

PIEZOELECTRIC THIN FILM, PIEZOELECTRIC THIN FILM ELEMENT, AND PIEZOELECTRIC TRANSDUCER
20230055097 · 2023-02-23 · ·

A piezoelectric thin film contains a lower layer and a first piezoelectric layer stacked on the lower layer. The first piezoelectric layer contains a tetragonal crystal 1 of a perovskite-type oxide. A (001) plane of the tetragonal crystal 1 is oriented in a normal direction dn of a surface of the first piezoelectric layer. A spacing of (100) planes of the tetragonal crystal 1 is a1. A spacing of (100) planes of a crystal contained in the lower layer is aL. A lattice mismatch rate between the first piezoelectric layer and the lower layer is 100×(aL−a1)/a1. The lattice mismatch rate is 3.0 to 12.1%. A rocking curve of diffracted X-rays of the (001) plane of the tetragonal crystal 1 is measured in an out-of-plane direction of the surface of the first piezoelectric layer. A FWHM of the rocking curve is 1.9 to 5.5°.

FILM PIEZOELECTRIC ACOUSTIC WAVE FILTER AND FABRICATION METHOD THEREOF
20220368310 · 2022-11-17 ·

The present disclosure provides a film piezoelectric acoustic wave filter and a fabrication method. The film piezoelectric acoustic wave filter includes a first substrate; a plurality of acoustic wave resonator units disposed on the first substrate, where each acoustic wave resonator unit includes a piezoelectric induction plate, and a first electrode and a second electrode which are opposite to each other for applying a voltage to the piezoelectric induction plate; and further includes a capping layer on the first substrate, where the capping layer includes a plurality of sub-caps, a sub-cap of the plurality of sub-caps surrounds an acoustic wave resonator unit of the plurality of acoustic wave resonator units to form a first cavity between the acoustic wave resonator unit and the sub-cap, and a separation portion is disposed between adjacent sub-caps to isolate adjacent first cavities.

FLEXIBLE SUBSTRATE
20220359840 · 2022-11-10 ·

According to one embodiment, a flexible substrate includes a line portion including a support plate including a first surface, a flexible insulating base located on the first surface and a wiring layer disposed on the insulating base, a piezoelectric material covering the line portion, a protective member located on the piezoelectric material and an island-shaped first electrode provided on the insulating base.

Piezoelectric member, ultrasonic oscillation element, ultrasonic probe, ultrasound diagnostic system, and method for producing piezoelectric member
11575080 · 2023-02-07 · ·

A piezoelectric member including metal electrodes with improved adhesiveness to piezoelectric elements is to be provided. A piezoelectric member 102 includes a piezoelectric element 21, and a pair of electrodes 41, 42 respectively formed on a pair of opposing surfaces 21b, 21c of the piezoelectric element 21. The electrodes 41, 42 includes: a base film 41a that is formed on the opposing surfaces 21b, 21c of the piezoelectric element 21 and contains a thiol group; a metal adhesive film 41b formed on the base film 41a; and an electrode film 41c that is formed on the metal adhesive film 41b and is for applying voltage to the piezoelectric element 21. The metal adhesive film 41b is formed with a different material from the electrode film 41c, and has a thickness of 1 to 10 nm.

PIEZOELECTRIC ELEMENT AND PIEZOELECTRIC SPEAKER
20230096425 · 2023-03-30 · ·

An object of the present invention is to provide a piezoelectric element capable of improving the sound pressure particularly in a high frequency band by decreasing the impedance in a case of being used as an electroacoustic transducer or the like, and a piezoelectric speaker formed of a piezoelectric film. The object can be achieved by using a piezoelectric film in which a piezoelectric layer containing piezoelectric particles in a polymer matrix is sandwiched between electrode layers, a planar shape is a polygon, the piezoelectric film has a protruding portion protruding from a side of a polygon other that a shortest side, and the protruding portion is provided with connecting portions for connecting an external power supply and an electrode layer or identical connecting portions are provided in the vicinity of end portions on a side other than the shortest side.

PIEZOELECTRIC LAMINATE AND PIEZOELECTRIC ELEMENT
20230098590 · 2023-03-30 · ·

A piezoelectric laminate and a piezoelectric element have, on a substrate in the following order, a lower electrode layer and a piezoelectric film containing a perovskite-type oxide. The lower electrode layer includes a second layer arranged in a state of being in contact with the piezoelectric film and includes a first layer arranged on a side of the second layer from the substrate, where the first layer contains one or more of W, Mo, Nb, and Ta, as a main component, and the second layer contains Ir as a main component, where the thickness of the second layer is 50 nm or less.

Resonator electrode configuration to avoid capacitive feedthrough for vibrating beam accelerometers
11493531 · 2022-11-08 · ·

This disclosure describes techniques of configuring capacitive comb fingers of an accelerometer resonator into discreet electrodes with drive electrodes and at least two sense electrodes. The routing of electrical signals is configured to produce parasitic feedthrough capacitances that are approximately equal. The sense electrodes may be placed on opposite sides of the moving resonator beams such that the changes in capacitance with respect to displacement (e.g. dC/dx) are approximately equal in magnitude and opposite in sign. The arrangement may result in sense currents that are also opposite in sign and result in feedthrough currents of the same sign. The sense outputs from the resonators may be connected to a differential amplifier, such that the difference in output currents may mitigate the effect of the feedthrough currents and cancel parasitic feedthrough capacitance. Parasitic feedthrough capacitance may cause increased accelerometer noise and reduced bias stability.

Self-powered vibration damper based on piezoelectricity and control method thereof

Disclosed is a self-powered vibration damper based on piezoelectricity and a control method. The damper comprises a loading platform, an energy collecting mechanism, a curved leaf spring, a vibration control mechanism and a substrate all connected in sequence, the circuit system comprises a rectifier circuit, a DC-DC voltage conversion circuit, an energy storage circuit, a control circuit and a charging battery, a first piezoelectric stack is connected with the input end of the rectifier circuit, the output end of the rectifier circuit is connected with the input end of the DC-DC voltage conversion circuit, the output end of the DC-DC voltage conversion circuit is connected with the input ends of the energy storage circuit and the charging battery, the output end of the energy storage circuit is connected with the input end of the control circuit, the output end of the control circuit is connected with the second piezoelectric stack.