Multiple degenerately-doped silicon layers are implemented within resonant structures to control multiple orders of temperature coefficients of frequency.

A display device includes a touch panel; a display panel under the touch panel and displaying an image; a piezoelectric element under the touch panel and including an upper electrode, a lower electrode and a piezoelectric layer; and a rectifying circuit connected to the piezoelectric element.

A force-measuring and touch-sensing integrated circuit device includes a semiconductor substrate, a thin-film piezoelectric stack overlying the semiconductor substrate, piezoelectric micromechanical force-measuring elements (PMFEs), and piezoelectric micromechanical ultrasonic transducers (PMUTs). The thin-film piezoelectric stack includes a piezoelectric layer. The PMFEs and PMUTs are located at respective lateral positions along the thin-film piezoelectric stack, such that each of the PMFEs and PMUTs includes a respective portion of the thin-film piezoelectric stack. Each PMUT has a cavity, the respective portion of the thin-film piezoelectric stack, and first and second PMUT electrodes. Each PMFE has the respective portion of the thin-film piezoelectric stack, and first and second PMFE electrodes. Each PMFE is configured to output voltage signals between the PMFE electrodes in accordance with a time-varying strain at the respective portion of the piezoelectric layer resulting from a low-frequency mechanical deformation.

Provided herein is a modulating retroreflective multilayer film comprising retroreflective elements, a piezoelectric layer, a photovoltaic layer, and an energy storage device. The stacked and transparent layered configuration of the film allows the retroreflective elements and the photovoltaic layer to be simultaneously illuminated by a narrow beam. The low power piezoelectric layer and the energy harvesting of the photovoltaic layer allow the retroreflector to be energetically self-sufficient and suitable for remote deployment. The flexible properties of the component layers allow the retroreflector to be adhered to nonplanar or irregular surfaces for the purpose of labeling and tagging.

Provided herein is a modulating retroreflective multilayer film comprising retroreflective elements, a piezoelectric layer, a photovoltaic layer, and an energy storage device. The stacked and transparent layered configuration of the film allows the retroreflective elements and the photovoltaic layer to be simultaneously illuminated by a narrow beam. The low power piezoelectric layer and the energy harvesting of the photovoltaic layer allow the retroreflector to be energetically self-sufficient and suitable for remote deployment. The flexible properties of the component layers allow the retroreflector to be adhered to nonplanar or irregular surfaces for the purpose of labeling and tagging.

Ultrasonic sensing approaches are described with integrated MEMS-CMOS implementations. Embodiments include ultrasonic sensor arrays for which PMUT structures of individual detector elements are at least partially integrated into the CMOS ASIC wafer. MEMS heating elements are integrated with the PMUT structures by integrating under the PMUT structures in the CMOS wafer and/or over the PMUT structures (e.g., in the protective layer). For example, embodiments can avoid wafer bonding and can reduce other post processing involved with conventional manufacturing of PMUT ultrasonic sensors, while also improving thermal response.

A device for determining information of a substance in a matter comprising a substrate layer; an inter-layer dielectric disposed on the substrate layer; an electronic circuitry substantially formed in the inter-layer dielectric and includes a plurality of metal layers with at least one metal layer being used as an inner electrode, a sensing instrument having at least one sensing component that includes a piezoelectric layer and the inner electrode that is positioned adjacent to an inner surface of the piezoelectric layer, and at least one binding layer disposed on the inter-layer dielectric for binding the substance, wherein the sensing component allows the device to determine the information of the substance upon detecting presence of the substance at the binding layer.

A method of manufacturing a piezoelectric element array board includes fabricating a plurality of piezoelectric element control circuits including one or more thin-film transistors on a substrate, fabricating a plurality of piezoelectric elements on the substrate, and poling a piezoelectric material by applying an electric field to a piezoelectric material layer of the plurality of piezoelectric elements while maintaining the one or more thin-film transistors in a state of generating higher leakage current, after fabricating the plurality of piezoelectric elements and the plurality of piezoelectric element control circuits.

The present invention relates to an electrical component for a microelectromechanical systems (MEMS) device, in particular, but not limited to, an electromechanical actuator. In one aspect, the present invention provides an electrical component for a microelectromechanical systems device comprising: i) a substrate layer; ii) a plurality of adjacent electrical elements arranged over the substrate layer, where each electrical element is separated from a neighbouring electrical element by an intermediate region, each of the plurality of electrical elements comprising: a) a ceramic member; and b) first and second electrodes disposed adjacent the ceramic member such that a potential difference may be established between the first and second electrodes and through the ceramic member during operation; iii) a passivation layer, or a laminate of multiple passivation layers, at least partially overlying each of the plurality of electrical elements so as to provide electrical passivation between the first and second electrodes of each of the plurality of electrical elements; wherein the passivation layer, or at least an innermost layer of the laminate of passivation layers which is disposed adjacent each underlying electrical element, is discontinuous over at least one intermediate region between neighbouring electrical elements of the electrical component.

The present invention relates to an electrical component for a microelectromechanical systems (MEMS) device, in particular, but not limited to, an electromechanical actuator. In one aspect, the present invention provides an electrical component for a microelectromechanical systems device comprising: i) a substrate layer; ii) a plurality of adjacent electrical elements arranged over the substrate layer, where each electrical element is separated from a neighbouring electrical element by an intermediate region, each of the plurality of electrical elements comprising: a) a ceramic member; and b) first and second electrodes disposed adjacent the ceramic member such that a potential difference may be established between the first and second electrodes and through the ceramic member during operation; iii) a passivation layer, or a laminate of multiple passivation layers, at least partially overlying each of the plurality of electrical elements so as to provide electrical passivation between the first and second electrodes of each of the plurality of electrical elements; wherein the passivation layer, or at least an innermost layer of the laminate of passivation layers which is disposed adjacent each underlying electrical element, is discontinuous over at least one intermediate region between neighbouring electrical elements of the electrical component.