A superconducting flexible interconnecting cable connector for supercomputing systems is provided. The cable connector includes a base with a recessed area defined therein to receive superconducting flexible interconnecting cables and superconducting connecting chips to electrically connect the superconducting flexible interconnecting cables to each other. A cover is provided to cover the superconducting flexible interconnecting cables and the superconducting connecting chips when the cover is in a closed position. A compression device compresses the superconducting connecting chips together to secure the superconducting flexible interconnecting cables and the superconducting connecting chips inside the recessed area of the base when the cover is in the closed position.

A modular superconducting quantum processor includes a first superconducting chip including a first plurality of qubits each having substantially a first resonance frequency and a second plurality of qubits each having substantially a second resonance frequency, the first resonance frequency being different from the second resonance frequency, and a second superconducting chip including a third plurality of qubits each having substantially the first resonance frequency and a fourth plurality of qubits each having substantially the second resonance frequency. The quantum processor further includes an interposer chip connected to the first superconducting chip and to the second superconducting chip. The interposer chip has interposer coupler elements configured to couple the second plurality of qubits to the fourth plurality of qubits.

A technique relates to a superconducting microwave combiner. A first filter through a last filter connects to a first input through a last input, respectively. The first filter through the last filter each has a first passband through a last passband, respectively, such that the first passband through the last passband are each different. A common output is connected to the first input through the last input via the first filter through the last filter.

The various embodiments described herein include methods, devices, and circuits for reducing or minimizing current crowding effects in manufactured superconductors. In some embodiments, a superconducting circuit includes: (1) a first component having a first connection point, the first connection point having a first width; (2) a second component having a second connection point, the second connection point having a second width that is larger than the first width; and (3) a connector electrically connecting the first connection point and the second connection point, the connector including: (a) a first taper having a first slope and a non-linear shape; (b) a second taper having a second slope; and (c) a connecting portion connecting the first taper to the second taper, the connecting portion having a third slope that is less than the first slope and less than the second slope.

The various embodiments described herein include methods, devices, and circuits for reducing or minimizing current crowding effects in manufactured superconductors. In some embodiments, a superconducting circuit includes: (1) a first component having a first connection point, the first connection point having a first width; (2) a second component having a second connection point, the second connection point having a second width that is larger than the first width; and (3) a connector electrically connecting the first connection point and the second connection point, the connector including: (a) a first taper having a first slope and a non-linear shape; (b) a second taper having a second slope; and (c) a connecting portion connecting the first taper to the second taper, the connecting portion having a third slope that is less than the first slope and less than the second slope.

A system and method of operation embeds a three-dimensional structure in a topology of an analog processor, for example a quantum processor. The analog processor may include a plurality of qubits arranged in tiles or cells. A number of qubits and communicatively coupled as logical qubits, each logical qubit which span across a plurality of tiles or cells of the qubits. Communicatively coupling between qubits of any given logical qubit can be implemented via application or assignment of a first ferromagnetic coupling strength to each of a number of couplers that communicatively couple the respective qubits in the logical qubit. Other ferromagnetic coupling strengths can be applied or assigned to couplers that communicatively couple qubits that are not part of the logical qubit. The first ferromagnetic coupling strength may be substantially higher than the other ferromagnetic coupling strengths.

A superconducting coil according to the present disclosure includes: a substrate having a first surface and a second surface; a superconducting layer having a third surface and a fourth surface; respective stabilization layers; and respective protective layers. The second surface is opposite to the first surface. The fourth surface is opposite to the third surface. The superconducting layer is disposed on the substrate such that the third surface faces the second surface. The respective stabilization layers are disposed on the first surface and the fourth surface. The respective protective layers are disposed on the stabilization layers. Adhesion strength between each of the stabilization layers and each of the protective layers is lower than strength of the superconducting layer.

A calibration method, a calibration apparatus, and a program capable of estimating a degree of signal loss of an input signal supplied to an oscillator are provided. The calibration method includes: outputting an input signal to be input to an oscillator to be calibrated that includes a resonator and performs parametric oscillation, from a signal generator connected to the resonator via a transmission path while sweeping a frequency or a power of this input signal; acquiring distribution data of an intensity of a reflection signal based on measurement of the intensity of the reflection signal from the oscillator in response to the input signal; and estimating a degree of signal loss by comparing the distribution data acquired by the measurement with the distribution data theoretically obtained in which a value of the degree of the signal loss of the transmission path is assumed.

A superconducting flexible interconnecting cable connector for supercomputing systems is provided. The cable connector includes a base with a recessed area defined therein to receive superconducting flexible interconnecting cables and superconducting connecting chips to electrically connect the superconducting flexible interconnecting cables to each other. A cover is provided to cover the superconducting flexible interconnecting cables and the superconducting connecting chips when the cover is in a closed position. A compression device compresses the superconducting connecting chips together to secure the superconducting flexible interconnecting cables and the superconducting connecting chips inside the recessed area of the base when the cover is in the closed position.

A modular superconducting quantum processor includes a first superconducting chip including a first plurality of qubits each having substantially a first resonance frequency and a second plurality of qubits each having substantially a second resonance frequency, the first resonance frequency being different from the second resonance frequency, and a second superconducting chip including a third plurality of qubits each having substantially the first resonance frequency and a fourth plurality of qubits each having substantially the second resonance frequency. The quantum processor further includes an interposer chip connected to the first superconducting chip and to the second superconducting chip. The interposer chip has interposer coupler elements configured to couple the second plurality of qubits to the fourth plurality of qubits.