A fluid thermal conditioning (heating/cooling) system including a housing containing a fluid holding tank and having an inlet pipe and an outlet pipe. A drive shaft rotatably supports either of a conductive plate or a plurality of spaced apart magnetic or electromagnetic plates positioned within the housing. The conductive plate can be reconfigured as an elongated conductive component supported within the housing and including a plurality of individual plates which alternate in arrangement with axially spaced and radially supported magnetic/electromagnetic plates. Upon rotation of the shaft, an oscillating magnetic field is generated for thermally conditioning the fluid.

Apparatus and method for establishing a temperature gradient, comprising at least one gas-tight working space having a first boundary layer that is connected to a first electrode and a second boundary layer that is connected to a second electrode, wherein when an electric voltage is applied between the first electrode and the second electrode in the working space, an electric field can be produced between the first boundary surface and the second boundary surface, and wherein a distance between the first boundary surface and the second boundary surface is less than 5000 nm, wherein the first boundary surface comprises at least one field-enhancement device, in particular a peak, so that if an electric voltage is applied to the electrodes, a field strength of the electric field in a region of the field-enhancement device is greater than an average field strength of the electric field in the working space.

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.

A laminated glazing includes a first transparent sheet intended, in the mounting position of the glazing, to constitute the exterior face thereof, a second transparent sheet bonded to the first by an adhesive interlayer, a heating layer supplied with electric current by leads positioned at the periphery of the glazing, and a mask also positioned at the periphery of the glazing between the first transparent sheet and the leads so as to hide the latter from view from the outside in the mounting position of the laminated glazing, wherein the heating layer and the mask are on the same plane of the laminated structure of the glazing.

A heating panel includes a lower panel mounted on the floor and an upper panel serving as a cover of the lower panel. The lower panel includes: a plurality of first guides protruding upward from the bottom surface to guide installation of a heating hose; and a first air passage formed as a groove on the bottom surface and the surface of the first guide, and further includes a plurality of second guides protruding upward from the bottom surface, having the first air passage on the surface thereof, and disposed between the plurality of first guides to guide installation of the heating hose. The upper panel is coupled to the lower panel and includes: a second air passage formed on the bottom surface in a groove form; and a second fastening member coupled with the first fastening member.

A heater 1a includes: a substrate 10 made of a resin; a conductive film 20 being a heating element; and a power supply electrode 30. The power supply electrode 30 is electrically connected to the conductive film 20 and is arranged along a surface of the conductive film 20. The power supply electrode 30 includes a conductive filler 30p and a binder 30m. The binder 30m binds the conductive filler 30p. The power supply electrode 30 has a specific resistance of 100 .Math.Ω•cm or less. The heater 1a satisfies a relation |Rd ― Ri|/Ri ≤ 0.2. Rd is an electrical resistance [Ω] of the heater 1a, the electrical resistance being obtained after an environment of the heater 1a is maintained at a temperature of 85° C. and a relative humidity of 85% for 1000 hours. Ri is an initial electrical resistance Ri of the heater 1a.

A solid-state refrigeration apparatus includes a plurality of solid refrigerators, a heating medium circuit with the plurality of solid refrigerators connected, and a conveying mechanism to convey a heating medium in the heating medium circuit. Each of the solid refrigerators includes a solid refrigerant substance having a caloric effect on an external energy and an induction section to cause the solid refrigerant substance to produce the caloric effect. The heating medium circuit includes first and second channels in which the solid refrigerators are connected in series and through which the heating medium is supplied to first and second heat exchange sections. At least one bypass mechanism is connected to the first and/or second channel. The bypass mechanism switches between an action of making the heating medium flow through the solid refrigerator and an action of making the heating medium bypass the solid refrigerator.

The present invention discloses a heat dissipation table made of an alloy material and with a special waterway design, comprising a sample placing table, a graphene heating structure abutted against the sample placing table, a heat dissipation structure abutted against the graphene heating structure and a protective cover for wrapping the heat dissipation structure. The heat dissipation structure comprises a heat dissipation table abutted against the graphene heating structure and a heat dissipation pipeline communicated with the heat dissipation table; a water pipe through groove is formed in the middle part of the heat dissipation table; and the heat dissipation pipeline is embedded into the water pipe through groove. A plurality of waterway annular grooves are formed in the heat dissipation table and communicated with the water pipe through groove. According to the present invention, the demand of diamonds on heat dissipation with high power can be met, and the cost is low.

The present invention relates to a heating paint which can be used to generate a surface heating device on a wall. The invention further relates to a surface heating device which is suitable in particular for heating a room, and also to a kit for producing a surface heating device on a wall. The invention relates, moreover, to uses of the subjects of the invention, especially for producing a surface heating device and, respectively, for heating a room, and to corresponding methods.

A radiant ceiling panel for air conditioning of a room, including a radiating surface on which a tube system for conducting a fluid, in particular water, along the radiating surface is fixed, preferably directly. The length of the radiating surface exceeds its width by a multiple. The tube system includes at least two portions fluidically connected in parallel, in particular arranged in parallel. The radiant ceiling panel has a fastening system, in particular a rope-like fastening system, for freely suspended fastening to a ceiling, or at least elements for interacting with said fastening system. The at least two portions are guided together and back apart again in an assembly region of the radiating surface.