Patent classifications
Y10S257/00
HYBRID COMPUTING MODULE
A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a fully integrated power management system that switches DC power at speeds that match or approach processor core dock speeds, thereby allowing the efficient transfer of data between off-chip physical memory and processor die.
HYBRID COMPUTING MODULE
A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a fully integrated power management system that switches DC power at speeds that match or approach processor core clock speeds, thereby allowing the efficient transfer of data between off-chip physical memory and processor die.
HYBRID COMPUTING MODULE
A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a fay integrated power management system that switches DC power at speeds that match or approach processor core clock speeds, thereby allowing the efficient transfer of data between off-chip physical memory and processor die.
HYBRID COMPUTING MODULE
A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a hilly integrated power management system that switches DC power at speeds that match or approach processor core clock speeds, thereby allowing the efficient transfer of data between off-chip physical memory and processor die.