A heat exchanger is characterized by having two or more fluid flow circuits, each formed by multiple small cross-section “micro-tubes” contained within a surrounding metal structure, or “metal matrix.” Its function is to efficiently transfer heat from one fluid to another in a highly compact assembly. Most any metal or metal alloy can be considered for the micro-tubes. The micro-tubes, while typically arranged in alternating layers of alternating flow circuits, may be organized in any number of arrangements including co-linear and at cross angles to provide for co-flow, counter flow and cross flow. The metal matrix, is provided in one embodiment by a metal or metal alloy powder consolidated in a hot isostatic pressing (HIP) process. This process also joins the tubes together and to the matrix itself, producing a monolithic structure.

A heat exchanger is characterized by having two or more fluid flow circuits, each formed by multiple small cross-section “micro-tubes” contained within a surrounding metal structure, or “metal matrix.” Its function is to efficiently transfer heat from one fluid to another in a highly compact assembly. Most any metal or metal alloy can be considered for the micro-tubes. The micro-tubes, while typically arranged in alternating layers of alternating flow circuits, may be organized in any number of arrangements including co-linear and at cross angles to provide for co-flow, counter flow and cross flow. The metal matrix, is provided in one embodiment by a metal or metal alloy powder consolidated in a hot isostatic pressing (HIP) process. This process also joins the tubes together and to the matrix itself, producing a monolithic structure.

A micro-roughened electrodeposited copper foil and a copper foil substrate are provided. The micro-roughened electrodeposited copper foil includes a micro-rough surface. The micro-rough surface has a plurality of peaks, a plurality of grooves and a plurality of micro-crystal clusters. Each of the grooves has a U-shaped or V-shaped cross-section profile, and the grooves have an average maximum width between 0.1 μm and 4 μm and an average depth less than or equal to 1.5 μm. Each of the micro-crystal clusters is composed of a plurality of micro-crystals each having an average diameter less than or equal to 0.5 μm grouped together. The micro-rough surface of the micro-roughened electrodeposited copper foil has an Rlr value less than 1.3. The micro-rough surface has good bonding strength relative to a substrate, and the copper foil substrate has good insertion loss performance to significantly reduce signal loss.

A stainless steel foil having a chemical composition comprising, by mass %, C: 0.015% or less, Si: 0.50% or less, Mn: 0.50% or less, P: 0.040% or less, S: 0.010% or less, Cr: 10.0% or more and less than 16.0%, Al: 2.5 to 4.5%, N: 0.015% or less, Ni: 0.05 to 0.50%, Cu: 0.01 to 0.10%, Mo: 0.01 to 0.15%, at least one selected from the group consisting of Ti: 0.01 to 0.30%, Zr: 0.01 to 0.20%, Hf: 0.01 to 0.20%, and REM: 0.01 to 0.20%, where Ti+Zr+Hf+2REM≥0.06 and 0.30≥Ti+Zr+Hf are satisfied.

A method for manufacturing a copper foil with a rough surface in a plating tank includes causing an electrolyte solution to flow between an anode and a cathode with a current density of 5 ASF-40 ASF. The copper foil with a rough surface including dense nodules of single copper crystals is deposited on the cathode. The electrolyte solution includes chloride ions (20 ppm-80 ppm), polyethylene glycol (PEG) with a molecular weight of 400-8000 (100 ppm-700 ppm), sulfuric acid (20 g/L-200 g/L), copper sulfate pentahydrate (70 g/L-320 g/L) and a sulfur compound (1 ppm-60 ppm).

A micro-roughened electrodeposited copper foil and a copper foil substrate are provided. The micro-roughened electrodeposited copper foil includes a micro-rough surface. The micro-rough surface has a plurality of peaks, a plurality of V-shaped grooves and a plurality of micro-crystal clusters. Each of the V-shaped grooves is defined by adjacent two of the peaks and has an average depth less than 1 m. The micro-crystal clusters are correspondingly located on the tops of the peaks and each thereof has an average height less than 1.5 m. The micro-rough surface of the micro-roughened electrodeposited copper foil has an Rlr value less than 1.06.

There is provided a copper foil provided with a carrier providing excellent chemical resistance against the copper flash etching solution during the formation of the wiring layer on the surface of the coreless support and excellent visibility of the wiring layer due to high contrast to the antireflective layer in image inspection after copper flash etching. The copper foil provided with a carrier comprises a carrier; a release layer provided on the carrier; an antireflective layer provided on the release layer and composed of at least one metal selected from the group consisting of Cr, W, Ta, Ti, Ni and Mo; and an extremely-thin copper layer provided on the antireflective layer; wherein at least the surface adjacent to the extremely-thin copper layer of the antireflective layer comprises an aggregate of metal particles.

Disclosed is a surface treated copper foil, which is capable of favorably reducing the transmission loss even when used in a high frequency circuit substrate, and after laminating with a resin, heating at a predetermined temperature for a predetermined time (at 180 C. for 10 days), the peel strength of the surface treated copper foil and the resin is favorable. Also disclosed is a surface treated copper foil, comprising a copper foil, and a surface treatment layer on one or both sides of the copper foil, wherein the surface treatment layer has a primary particle layer, or has a primary particle layer and s secondary particle layer in this order from the side of the copper foil; the surface treatment layer contains Zn, a deposition amount of Zn in the surface treatment layer is 150 g/dm.sup.2 or more; the surface treatment layer does not contain Ni, or in the case where the surface treatment layer contains Ni, a deposition amount of Ni in the surface treatment layer is 800 g/dm.sup.2 or less; the surface treatment layer does not contain Co, or in the case where the surface treatment layer contains Co, a deposition amount of Co in the surface treatment layer is 3000 g/dm.sup.2 or less; and a ten point average roughness Rz of an outermost surface of the surface treatment layer is 1.5 m or less.

Surface-treated copper foils that exhibit a material volume (Vm) less than 1.90 m.sup.3/m.sup.2. Where the surface-treated copper foil is treated on the drum side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.

Surface-treated copper foils that exhibit a material volume (Vm) in a range of 0.05 to 0.6 m.sup.3/m.sup.2 and a yellowness index (YI) in a range of 17 to 52 are reported. Where the surface-treated copper foil is treated on the deposited side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.