A device for gripping an object includes a base element and at least two gripping arms held on the base element. The at least two gripping arms are movable relative to one another and the base element into a configuration suitable for gripping and picking up the object. Preferably at least three gripping arms are provided, with each arm being able to move independently of one another relative to the base element, and a sensor such as a camera provides signals to electronics which can determine the position of the at least three gripping arms and control movement of the gripping arms into position to grip and pick up the object. A method for gripping and picking up an object using the gripping device is also provided.

Systems, devices, apparatus and methods for cleaning contaminated tanks without introducing large amounts of free water or liquefier into the tanks. A gathering arm assembly and a bucket assembly is used to remove and break up waste debris from a contaminated tank.

A system and method directed for a tumbler insert which secures a tumbler from the inside without contacting any exterior surfaces, the insert having a plurality of flexible members or claws that may be bent or contracted when pressed into the tumbler, which creates sufficient tension to secure the holder within the vessel.

In an embodiment, a method includes determining a given material to manipulate to achieve a goal state. The goal state can be one or more deformable or granular materials in a particular arrangement. The method further includes, for the given material, determining, a respective outcome for each of a plurality of candidate actions to manipulate the given material. The determining can be performed with a physics-based model, in one embodiment. The method further can include determining a given action of the candidate actions, where the outcome of the given action reaching the goal state is within at least one tolerance. The method further includes, based on a selected action of the given actions, generating a first motion plan for the selected action.

A method and apparatus for dispensing and retrieving products is provided. A system may include: a grasping head; first and second grasping members, each grasping member comprising: a top member; a post member; and first and second grasping fingers, where the first and second grasping fingers extend from the post member and are spaced apart from the top member by a predetermined distance, where the first and second grasping members are connected to the grasping head, where at least one of the first and second grasping members is movably connected to the grasping head, where the at least one of the first and second grasping members is movable relative to the other of the first and second grasping members.

A connection of two adapter parts of a modularly-constructed supporting apparatus includes a first adapter part which has an end-side attachment with a partially spherical recess, a second adapter part which has an end-side spherical attachment for insertion into the partially spherical recess in the first adapter part and has a clamping ring which bears against the spherical attachment, on its half which is averted from the partially spherical recess, and a connecting clamp which engages behind the attachment and the clamping ring on sides which are averted from one another and also fixes the attachment and the clamping ring axially and radially in relation to one another, wherein the attachment and the clamping ring each have at least one weakening region for deforming the attachment and the clamping ring when the connecting clamp acts on the attachment and the clamping ring. The connection is secure when tools, workpieces or the like of a relatively high weight are held by the supporting apparatus.

In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

A first robot for handling at least one first workpiece in a first processing operation of the apparatus, a second robot cooperating with the first robot for processing the at least one first workpiece in the first processing operation, and at least one first workpiece holder for holding the at least one first workpiece during the first processing operation. In order to improve robot-assisted processing of workpieces which differ from one another, the first robot handles at least one second workpiece and the second robot processes the at least one second workpiece in a second processing operation of the apparatus. The first robot or the second robot in order, in a changeover operation of the apparatus, to replace the at least one first workpiece holder automatically by at least one second workpiece holder for holding the at least one second workpiece during the second processing operation.

A multiaxial robot of multitasking includes a base, a plurality of arms, at least one wrist, a first engaging structure, and a second engaging structure. The arms are sequentially connected from the base, and any adjacent two of the base and the arms are configured to rotate relative to each other. The wrist is connected to the farthest arm arranged relative to the base and configured to rotate relative to the connected arm. The first engaging structure is disposed on the wrist and configured to connect a first tool. The second engaging structure is disposed on one of the arms and configured to connect a second tool.