An epoxy resin compound is provided. The epoxy resin compound includes a hardener, an inorganic based filler, a catalyst, and a conductive additive. The amount of inorganic based filler is greater than 80 weight percent (wt %) of the epoxy resin compound. The catalyst is to accelerate curing of the epoxy resin compound. The amount of conductive additive is 0.1 to 5 wt % of the epoxy resin compound.

According to the present invention, there is provided an insert molded article comprising: a first member having gold plating formed at the surface; a surface layer of a porous silica film or an amorphous silica film, formed on at least a part of the surface of the gold plating; and a resin part molded on at least a part of the surface layer such that the resin part adheres tightly to the surface layer.

Provided are: a composition for forming an underlayer film for imprinting, which contains a high-molecular-weight compound having a polymerizable group, a chelating agent, and a solvent, and a method for producing the same; a kit including the composition for forming an underlayer film; a pattern producing method using the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, which includes the pattern producing method as a step.