A hot foil stamping press (10) comprises a platen press (16), with a supporting plate (22) comprising a base plate (26) and a compensating plate (28) being rotatably attached to the base plate (26) for switching between an operating position and a makeready position and a hook element (38) comprising a base part and a top part being arranged at an angle relative to the base part. The hook element (38) is rotatably attached to a door (30) of the platen press (16) by a fixation axle for switching between a releasing position and a securing position of the hook element, wherein the top part retains the compensating plate (28) in its makeready position when the hook element (38) is in its securing position.

A method of making a surface-mountable pixel engine package comprises providing an array of spaced-apart conductive pillars and an insulating mold compound laterally disposed between the conductive pillars on a substrate together defining a planarized surface. Pixel engines comprising connection posts are printed to the conductive pillars so that each of the connection posts is in electrical contact with one of the conductive pillars. The pixel engines are tested to determine known-good pixel engines. An optically clear mold compound is provided over the planarized surface and tested pixel engines. Optically clear mold compound is adhered to a tape and the substrate is removed. The optically clear mold compound, the insulating mold compound, the conductive pillars, the optically clear mold compound, and the tested pixel engines are singulated to provide pixel packages that comprise the pixel engines and the known-good pixel engines are transferred to a reel or tray.

A method of making a surface-mountable pixel engine package comprises providing an array of spaced-apart conductive pillars and an insulating mold compound laterally disposed between the conductive pillars on a substrate together defining a planarized surface. Pixel engines comprising connection posts are printed to the conductive pillars so that each of the connection posts is in electrical contact with one of the conductive pillars. The pixel engines are tested to determine known-good pixel engines. An optically clear mold compound is provided over the planarized surface and tested pixel engines. Optically clear mold compound is adhered to a tape and the substrate is removed. The optically clear mold compound, the insulating mold compound, the conductive pillars, the optically clear mold compound, and the tested pixel engines are singulated to provide pixel packages that comprise the pixel engines and the known-good pixel engines are transferred to a reel or tray.

An ink film construction consisting: (a) a printing substrate; and (b) at least one ink film, fixedly adhered to a top surface of the printing substrate, the ink film having an upper film surface distal to the top surface of the substrate, wherein a surface concentration of nitrogen at the upper film surface exceeds a bulk concentration of nitrogen within the film, the bulk concentration measured at a depth of at least 30 nanometers below the upper film surface, and wherein a ratio of the surface concentration to the bulk concentration is at least 1.1 to 1.

A foil transfer device includes a foil transfer film cartridge, a housing, a display, a detector, and a controller. The foil transfer film cartridge includes a supply reel on which a foil film is wound. The housing allows the foil transfer film cartridge to be removably installed therein. The display is provided on the housing to display information. The detector detects foil film information in a state where the foil transfer film cartridge is installed in the housing. The foil film information includes at least one item selected from a group comprising a color of the foil, a width of the foil film, and a widthwise position of the foil film in a direction of the width of the foil film. The controller causes the foil film information detected by the detector to be shown on the display.

In a foil transfer device, a controller causes a sheet to be conveyed by conveyor rollers to reach a transfer position in which a foil film and the sheet are to be nipped between a heating roller and a pressure roller (of which one is called “first roller”, and the other is called “second roller”), while the first roller is positioned in a release position, separated from the second roller, and a state of transport of the foil film is kept in a restricted state by a film-transport regulator. The first roller is moved and positioned in a nipping position while the sheet is laid on the transfer position and before a foil transfer area of the sheet reaches the transfer position. The state of transport of the foil film is changed from the restricted state to a release state after the first roller gets positioned in the nipping position.

The present disclosure relates to a heat press, especially knee lever-transfer press with at least one socket, with at least one base plate and with at least one heatable counter plate pivotable towards the base plate, wherein the knee lever-transfer press further has a control unit, by which the knee lever-transfer press is controllable in an open-loop manner and/or closed-loop manner and wherein the control unit constitutes a first modular unit of the knee lever-transfer press and wherein the socket constitutes at least one second modular unit, and the base plate and the counter plate constitute at least one third modular unit and wherein at least the first modular unit and the second modular unit and/or the third modular unit are separable from each other and/or are formed to be replaceable for functional comparable modular units.

Pattern transfer sheets, methods of monitoring pattern transfer printing, and pattern transfer printing systems are provided, for monitoring and adjusting laser illumination used for transferring paste patterns from trenches on the sheets onto a substrate such as electronic circuitry and/or solar cell substrates. Pattern transfer sheets comprise, outside the pattern, (i) trace mark(s) configured to receive the printing paste, aligned to the trenches and are wider than the width of the illuminating laser beam—to detect misalignment of paste release from within the trace mark(s) and/or (ii) working window marks configured to receive the printing paste, set at specified offsets with respect to specific trenches, with different working window marks set at different offsets—to correct the effective working window by adjusting the power of the laser beam.

Described herein is a die-to-wafer bonding process that utilizes micro-transfer printing to transfer die from a source wafer onto an intermediate handle wafer. The resulting intermediate handle wafer structure can then be bonded die-down onto the target wafer, followed by removal of only the intermediate handle wafer, leaving the die in place bonded to the target wafer.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.