Patent classifications
B41M3/00
Method of printing stealth white image, set of substrate and stealth ink, and printing device
A method of printing a stealth white image includes applying a stealth ink containing a red coloring material that emits visible light at exposure to ultraviolet radiation and a green coloring material that emits visible light at exposure to ultraviolet radiation to a substrate which contains a fluorescent brightener to form the stealth white image thereon, wherein the stealth white image demonstrates an a* value of from −2.0 to 2.0 and a b* value of from −10.0 to 0 at exposure to ultraviolet radiation having a wavelength of 370 nm according to CIE 1976 L*a*b* colorimetric system.
DECORATIVE OBJECT AND METHOD FOR MANUFACTURING DECORATIVE OBJECT
There are provided a decorative object and a manufacturing method thereof, which includes: an object to be decorated; a printed layer covering at least a part of a surface of the object to be decorated; and a color clear layer covering the printed layer. In accordance with changes in a transmission distance by which light is transmitted through the color clear layer, a slight change in appearances of the decorative object can be caused.
Liquid guiding boundaries for porous substrates providing increased biodegradability
The present invention relates to a method for manufacturing structural layers for guiding liquid flow on a porous substrate, by printing onto at least one area of at least one surface of the substrate a printing solution containing an aqueous dispersion of a poly(lactic acid)-based copolymer.
INKJET PRINTING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME
An inkjet printing device includes a chamber having an imaginary centerline that divides a length of the chamber in the first direction into two halves, and a plurality of inkjet nozzles coupled to the chamber and receiving ink from the chamber, the inkjet nozzles being arranged in a plurality of columns along a first direction. The inkjet nozzles include a center column nozzle disposed adjacent to the centerline of the chamber and an outer column nozzle disposed farther from the centerline than the center column nozzle. The chamber includes a bump portion disposed farther from the centerline than the outer column nozzle, the bump portion including a bump on an inner surface of the chamber.
Shape-forming packaging material, and method for producing power storage device with surface printing
The shape-forming packaging material is a shape-forming packaging material including a heat resistant resin layer as an outer layer, a heat fusible resin layer as an inner layer, and a metal foil layer disposed between both the layers, and is configured such that a print improving resin layer is laminated on a further outer side of the heat resistant resin layer.
Shape-forming packaging material, and method for producing power storage device with surface printing
The shape-forming packaging material is a shape-forming packaging material including a heat resistant resin layer as an outer layer, a heat fusible resin layer as an inner layer, and a metal foil layer disposed between both the layers, and is configured such that a print improving resin layer is laminated on a further outer side of the heat resistant resin layer.
Methods for printing solder paste and other viscous materials at high resolution
Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.
APPARATUS FOR MANUFACTURING DISPLAY APPARATUS, METHOD OF MEASURING DROPLET, AND METHOD OF MANUFACTURING DISPLAY APPARATUS
A method of manufacturing a display apparatus, the method includes supplying, from an ejector, a droplet onto a plane, capturing an image of the droplet, calculating a first luminance of a first area of the plane, the first area including a planar area of the droplet, and calculating a concentration of particles contained in the droplet based on the first luminance.
WINDOW, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE WINDOW
A window including a base substrate, which includes a transmission region and a bezel region in a plan view and includes a front surface and a rear surface that are opposite to each other in a thickness direction, a light-blocking layer, which is disposed on the rear surface of the base substrate and is overlapped with the bezel region, and a printing layer, which is disposed on the light-blocking layer and has a target surface, in which a barcode pattern is formed. The printing layer may have a chromatic color, and a width of the printing layer may be less than a width of the light-blocking layer.
TRANSFER PRINTING HIGH-PRECISION DEVICES
A device source wafer includes a wafer substrate, devices formed on or in the wafer substrate at a location on the wafer substrate, and test structures disposed on the wafer substrate connected to some but not all of the devices. The devices include a first device disposed at a first location and a second device disposed at a second different location on the wafer substrate. The test structures include at least a first test structure connected to the first device and a second test structure connected to the second device. The first test structure is adapted to measuring a characteristic of the first device and the second test structure is adapted to measuring the characteristic of the second device. An estimated characteristic of unmeasured devices is derived from the first and second device locations and measured characteristics and the device is selected based on the estimated characteristic.