C07D233/00

Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

Method of making a functionalized elastomer

The present invention is directed to a method of making a functionalized elastomer, comprising the step of polymerizing monomers comprising a conjugated diene monomer in the presence of a lathanide-based coordination polymerization catalyst activated with a magnesium compound of formula 1 ##STR00001## where R.sup.1 is phenylene, or a linear or branched alkane diyl group containing 2 to 10 carbon atoms, or a combination of one or more phenylene groups and one or more linear or branched alkane diyl groups containing 1 to 10 carbon atoms; Q is of formula 2 or 3 ##STR00002## where R.sup.2 is phenyl, or a linear or branched alkyl group containing 2 to 10 carbon atoms; ##STR00003## where R.sup.3 and R.sup.4 are independently phenyl or a linear or branched alkyl group containing 1 to 10 carbon atoms, or R.sup.2 and R.sup.3 taken together with the nitrogen atom represent a nitrogen containing heterocyclic group containing from 4 to 12 carbon atoms.

Substituted spirocyclic inhibitors of autotaxin

The present invention relates to compounds according to Formula I and pharmaceutically acceptable salts, synthesis, intermediates, formulations, and methods of disease treatment therewith, including cancer, lymphocyte homing, chronic inflammation, neuropathic pain, fibrotic diseases, thrombosis, and cholestatic pruritus, mediated at least in part by ATX. ##STR00001##

METHOD OF MAKING A FUNCTIONALIZED ELASTOMER

The present invention is directed to a method of making a functionalized elastomer, comprising the step of polymerizing monomers comprising a conjugated diene monomer in the presence of a lanthanide-based coordination polymerization catalyst activated with a magnesium compound of formula 1


Q-R.sup.1MgR.sup.1-Q1

where R.sup.1 is phenylene, or a linear or branched alkane diyl group containing 2 to 10 carbon atoms, or a combination of one or more phenylene groups and one or more linear or branched alkane diyl groups containing 1 to 10 carbon atoms; Q is of formula 2 or 3


SR.sup.22

where R.sup.2 is phenyl, or a linear or branched alkyl group containing 2 to 10 carbon atoms;

##STR00001##

where R.sup.3 and R.sup.4 are independently phenyl or a linear or branched alkyl group containing 1 to 10 carbon atoms, or R.sup.2 and R.sup.3 taken together with the nitrogen atom represent a nitrogen containing heterocyclic group containing from 4 to 12 carbon atoms.

Substituted [1,2,4]triazole and imidazole compounds as fungicides

The present invention relates to compounds of the formula I ##STR00001##
wherein the variables are defined in the claims and the specification, to their preparation and their use as fungicides.

Substituted [1,2,4]triazole and imidazole compounds as fungicides

The present invention relates to compounds of the formula I ##STR00001##
wherein the variables are defined in the claims and the specification, to their preparation and their use as fungicides.

Processes for the preparation of compounds, such as 3-arylbutanals, useful in the synthesis of medetomidine

There is provided a process for the preparation of a compound of formula (I) as defined herein, wherein said process comprises reacting a compound of formula (II) as defined s herein with one or more suitable Vilsmeier reagent. ##STR00001##

Substituted spirocyclic inhibitors of autotaxin

The present invention relates to compounds according to Formula 1 and pharmaceutically acceptable salts, synthesis, intermediates, formulations, and methods of disease treatment therewith, including cancer, lymphocyte homing, chronic inflammation, neuropathic pain, fibrotic diseases, thrombosis, and cholestatic pruritus, mediated at least in part by ATX. ##STR00001##

Surface treatment solutions for gold and gold alloys

A composition containing a cationic polymer obtained from a reaction product of nitrogen-containing heterocyclic compound and epihalohydrin; and a phosphorus compound. The composition can be used as a surface treatment for gold or gold alloy. The composition can seal pinholes on the surface of the gold or gold alloy.