A carbon fiber reinforced plastic structure has a low surface roughness and has reduced deformation due to residual stress, changes in temperature, etc., and a processing apparatus that uses the structure, are disclosed. The carbon fiber reinforced plastic structure (CFRP structure) includes a carbon fiber reinforced plastic member (CFRP member), and a resin layer formed on a first surface of the carbon fiber reinforced plastic member, the resin layer including an opposite surface that is opposite to a surface facing the first surface, the opposite surface having a surface roughness that is less than a surface roughness of the first surface of the carbon fiber reinforced plastic member.

According to an example aspect of the present invention, there is provided a composition comprising colloidal lignin particles and an epoxy compound.

The present disclosure provides a method of enhancing the shelf-life of an activated surface of a thermoplastic material, including: coating at least a portion of a surface of the thermoplastic material with at least one adhesion promoter to provide a coated surface; and treating the coated surface with plasma to provide the activated surface of the thermoplastic material; wherein the activated surface has a contact angle in the range of from about 0 to about 40°; and wherein the presence of the at least one adhesion promoter is effective to maintain the contact angle in the range of from about 0 to about 40° for a time of about 10 days or greater.

The present disclosure provides an epoxy molding compound composition, a preparation method and use thereof. The epoxy molding compound composition includes the following ingredients in mass percentage: epoxy resin: 4-9 wt %; a curing agent: 4-9 wt %; PN phenolic resin: 1-3 wt %; a curing accelerator: 0.02-0.5 wt %; filler: 70-90 wt %; a coupling agent: 0.2-0.6 wt %; and auxiliary additives: 1-2 wt %. By adding the PN phenolic resin to an epoxy resin system of the epoxy molding compound composition, reducing the mass percentage of the coupling agent and removing a plasticizer, the thermal deformation of the molding compound composition can be effectively reduced, and the stability of a packaged product is improved.

A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations. ##STR00001##

The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.

An object of the present invention is to provide an epoxy resin composition excellent in elastic modulus and strength, and a prepreg and a fiber reinforced composite material with the epoxy resin composition. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: aromatic diamine [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin

(1): at least a part of the component [C] satisfies that the sum of the polar component and the hydrogen bond component in the Hansen solubility parameters is 10.0 or more.

(2): at least a part of the component [C] satisfies that the Hansen solubility parameter distance L to the component [A] is 20.0 or less.

(3): the ratio H/E between the amount by mole, E, of the epoxy group of the component [A] and the amount by mole, C, of the component [C] satisfying both the condition (1) and the condition (2) is 0.01 or more and 0.20 or less.

(4): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

A fiber-reinforced resin molding material includes at least components (A) to (D), wherein the fiber-reinforced resin molding material has a weight loss on heating, when heated at 300° C. for 10 minutes either in a nitrogen atmosphere or in an air atmosphere, of 1.5% or less, and components (A) to (D) are:

(A) an amorphous thermoplastic resin: 100 parts by weight
(B) a reinforcement fiber: 4 to 60 parts by weight
(C) a phosphorus-based flame retardant: 20 to 60 parts by weight
(D) an antioxidant (D): 1.0% by weight or more.

The present invention relates to a method for preparing a foamed thermoplastic polyurethane elastomer product, comprising the steps of: 1) coating a binder: coating the binder on the surfaces of expandable thermoplastic polyurethane elastomer particles; 2) curing and molding: adding the product obtained from step 1) to a mold and then placing it in a vulcanizing machine for curing and molding; and 3) cooling and setting: cooling the mold after the molding in step 2) to obtain the product of the present invention. By means of pre-coating the binder on the surfaces of expanded thermoplastic polyurethane elastomer particles according to the present invention, the weight of the binder can be reduced, and the properties of the expanded thermoplastic polyurethane elastomer particles can be utilized to the maximum extent.