An object of the present invention is to provide a polymer film having a small anisotropy of linear expansion factor. Another object of the present invention is to provide a substrate for communication including the polymer film.

The polymer film of the present invention is a polymer film including a liquid crystal polymer, in which, in a case of observing a surface of the polymer film under a crossed nicol environment with a polarization microscope, a plurality of bright portions are observed in an observation region, and in the plurality of bright portions, an equivalent circle diameter of a bright portion having a maximum equivalent circle diameter is 10 μm or less.

The present invention provides a thermally conductive material having excellent thermal conductivity. Furthermore, the present invention provides a device with a thermally conductive layer that has a thermally conductive layer containing the thermally conductive material and a composition for forming a thermally conductive material that is used for forming the thermally conductive material. The thermally conductive material according to an embodiment of the present invention contains a cured substance of a disk-like compound, which has one or more reactive functional groups selected from the group consisting of a hydroxyl group, a carboxylic acid group, a carboxylic acid anhydride group, an amino group, a cyanate ester group, and a thiol group, and a crosslinking compound which has a group reacting with the reactive functional groups.

A curable particulate silicone composition is disclosed. The composition comprises: (A) hot-melt silicone fine particles having a specific reactive functional group; (B) an inorganic filler; and (C) a curing agent. The content of component (B) is in the range of from 87 to 95 vol. % of the total composition. The curable particulate silicone composition provides a cured product having an average linear expansion coefficient of not greater than 15 ppm/° C. in a range of from 25° C. to 200° C. The curable particulate silicone composition provides a cured product having a very low average linear expansion coefficient over a wide temperature range when cured and is particularly suitable for overmold molding and the like.

A polymer composition includes a poly(para-phenylene sulfide) (PPS), at least one poly(aryl ether sulfone) (PAES), and at least one alkali metal carbonate. Preferably, the polymer composition is free or substantially free of solvent. A method includes melt mixing a poly(para-phenylene sulfide) (PPS), at least one poly(aryl ether sulfone) (PAES), and at least one alkali metal carbonate.

An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.

The invention provides a composition comprising the following: A) a first polymer composition comprising an anhydride functionalized ethylene-based polymer, and optionally, an ethylene-based polymer; B) a filler; and
wherein the anhydride functionalized ethylene-based polymer has a density from 0.855 g/cc to 0.900 g/cc and a melt viscosity, at 177° C., from 1000 to 50,000 cP.

The invention provides a composition comprising the following: A) a first polymer composition comprising an anhydride functionalized ethylene-based polymer, and optionally, an ethylene-based polymer; B) a filler; and
wherein the anhydride functionalized ethylene-based polymer has a density from 0.855 g/cc to 0.900 g/cc and a melt viscosity, at 177° C., from 1000 to 50,000 cP.

The invention provides a composition comprising the following: A) a first polymer composition comprising an anhydride functionalized ethylene-based polymer, and optionally, an ethylene-based polymer; B) a filler; and
wherein the anhydride functionalized ethylene-based polymer has a density from 0.855 g/cc to 0.900 g/cc and a melt viscosity, at 177° C., from 1000 to 50,000 cP.

Provided is a semiconductor nanoparticle-containing composition capable of forming a wavelength conversion layer that efficiently converts the wavelength of excitation light and exhibits sufficient luminescence intensity. An aspect of the semiconductor nanoparticle-containing composition of the present invention contains semiconductor nanoparticles (A) and a coloring matter (B) and further contains a polymerizable compound (C), in which the semiconductor nanoparticles (A) have a maximum emission wavelength in the range of 500 to 670 nm over a wavelength range of 300 to 780 nm, and the coloring matter (B) contains at least one selected from coloring matters (B1) to (B5) having specific structures.

A problem to be solved by the present invention is that there is no method for forming a dense structure on a porous structure at low cost. In addition, another object is to provide a high quality and inexpensive structure of a brittle material and a laminate thereof as an intermediate layer for facilitating formation of a dense structure on a porous structure. A structure is provided having a brittle particle assembly having a plurality of brittle particles, wherein the brittle particle assemblies are arranged adjacently to each other, and the brittle particles having a brittle material region in the periphery are crosslinked (connected) by the brittle material region to bond the brittle particles to each other, and thereby form a brittle material crosslinked structure region preventing the mobility of the brittle particles.