Patent classifications
C09J2469/00
TEMPORARY ADHESIVE, TEMPORARY ADHESIVE ASSEMBLY, AND METHOD OF PROCESSING SUBSTRATE
A temporary adhesive includes: a polar resin of 5 wt % to 50 wt %, a first solvent of 30 wt % to 90 wt %, and a second solvent of 5 wt % to 60 wt %, wherein the polar resin includes at least one selected from a group consisting of a phenoxy resin, a poly(ether-ether-ketone) resin, a polycarbonate resin, a modified epoxy resin, or a polyolefin resin with a modified polar group; the first solvent is used to dissolve the polar resin; and the second solvent is used to improve a leveling property of the temporary adhesive.
Pressure-sensitive adhesive sheet
Provided is a PSA sheet capable of suitably preventing bubble formation caused by outgassing. This invention provides a PSA sheet comprising a PSA layer that forms an adhesive face. In an aging test where the adhesive face is press-bonded to a glass plate and stored at 50° C. for 24 hours, the PSA sheet has at least 5% post-aging non-bonding area Sa, with Sa defined as the ratio of all areas non-bonding to the glass plate relative to the total area of the adhesive face. The non-bonding areas have parts linearly extending along the adhesive face.
PRESSURE-SENSITIVE ADHESIVE SHEET
Provided is a PSA sheet capable of suitably preventing bubble formation caused by outgassing. This invention provides a PSA sheet comprising a PSA layer that forms an adhesive face. In an aging test where the adhesive face is press-bonded to a glass plate and stored at 50° C. for 24 hours, the PSA sheet has at least 5% post-aging non-bonding area Sa, with Sa defined as the ratio of all areas non-bonding to the glass plate relative to the total area of the adhesive face. The non-bonding areas have parts linearly extending along the adhesive face.
SINTER-BONDING COMPOSITION, SINTER-BONDING SHEET AND DICING TAPE WITH SINTER-BONDING SHEET
The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 μm or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 40% by mass and less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).
ADHESIVE PRINTING FORM ATTACHMENT LAYER, METHOD FOR ITS MANUFACTURE, AND PRINTING FORM ATTACHMENT CYLINDER COMPRISING THE SAME
The present disclosure relates to an adhesive printing form attachment layer comprising a support, and a permanently sticky layer suitable for receiving a printing form and fixing a printing form during a printing operation provided on the support, wherein the permanently sticky layer comprises a crosslinked silicone-based material. The present disclosure further relates to a method for preparing an adhesive printing form attachment layer, as well as a printing cylinder comprising it, the use of the an adhesive printing form attachment layer for fixing a flexographic printing plate during a printing operation on a printing cylinder, and a method of operating a printing machine wherein the adhesive printing form attachment layer is used.
Sheet and composite sheet
A problem is to provide a sheet which is such that a sintered body produced following sintering has a small amount of remaining organic substances. Solution means relate to a sheet comprising a pre-sintering layer. The pre-sintering layer comprises polycarbonate.
SINTER-BONDING COMPOSITION, SINTER-BONDING SHEET AND DICING TAPE WITH SINTER-BONDING SHEET
The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 m or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).
Thermal bonding sheet and thermal bonding sheet with dicing tape
A thermal bonding sheet includes a layer, in which hardness of the layer after being heated at a heating rate of 1.5 C./sec from 80 C. to 300 C. under pressure of 10 MPa, and then held at 300 C. for 2.5 minutes is in a range of 1.5 GPa to 10 GPa in measurement using a nanoindenter.
ADHESIVE STRAIN SENSING PODS
An adhesive strain sensing pod includes at least one strain sensor, electronics for electrically sensing at least one strain signal from the at least one strain sensor, and a sensor adhesive for adhering the strain sensor to a surface of a structural element. The pod may have a protective case for protecting the strain sensor and the electronics and for transferring at least part of a force, pressing the pod against the surface, to press the strain sensor against the surface. The sensor adhesive may be a liquid adhesive contained in a fragile pouch that ruptures when the pod is forced against the surface, or may be a thermally activated adhesive film that is activated to bond the strain sensor to the surface. A protective film may protect the sensor adhesive prior to installation of the pod and is removed prior to installation of the pod on the surface.
Thermal bonding sheet and thermal bonding sheet with dicing tape
Provided is a thermal bonding sheet which suppresses a compositional material of the thermal bonding sheet from protruding during bonding and from creeping up onto the surface of an object to be bonded, and provides a strong sintered layer after sintering. A thermal bonding sheet includes a layer. When the layer is analyzed by a differential thermal balance from 23 C. to 500 C. in an air atmosphere at a heating rate of 10 C./min, a value obtained by subtracting a weight decrease amount (%) at 300 C. from a weight decrease amount (%) at 500 C. is in a range of 1% to 0%.