A semiconductor device includes functional circuits electrically coupled to each other and each coupled to a different thermal circuit. The different thermal circuits are configured to maintain different operating temperatures targeted for each corresponding functional circuit. One of the thermal circuits may use a cryogenic liquid to cool the corresponding functional circuit.

A constant density heat exchanger and system for energy conversion is provided. The constant density heat exchanger includes a housing extending between a first end and a second end and defining a chamber having an inlet and an outlet. A first flow control device is positioned at the inlet of the chamber and movable between an open position in which a working fluid is permitted into the chamber and a closed position in which the working fluid is prevented from entering the chamber. A second flow control device is positioned at the outlet of the chamber and movable between an open position in which the working fluid is permitted to exit the chamber and a closed position in which the working fluid is prevented from exiting the chamber. A heat exchange fluid imparts thermal energy to the volume of working fluid as the first flow control device and the second flow control device hold the volume of working fluid at constant density within the chamber.

Devices for radiative cooling and optical waveguiding are provided, wherein the devices comprise a fabric including one or more fibers extending for a length in a longitudinal direction and a plurality of void structures positioned within each of the one or more fibers and extended over the length of each of the one or more fibers. Each of the plurality of void structures is configured to scatter at least a portion of an electromagnetic radiation received thereon to thereby radiatively cool the object.

A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.

A once-through dry adiabatic cooler having an integrated factory installed air pre-cooler system that is mechanized to move from a shipping position to an operational position.

A heat exchange device comprising phase change material-impregnated heat conductive foam disposed between fluid stream channels in a heat exchanger element.

A 2-in-1 power electronics assembly includes a frame with a lower dielectric layer, an upper dielectric layer spaced apart from the lower dielectric layer, and a sidewall disposed between and coupled to the lower dielectric layer and the upper dielectric layer. The lower dielectric layer includes a lower cooling fluid inlet and the upper dielectric layer includes an upper cooling fluid outlet. A first semiconductor device assembly and a second semiconductor device assembly are included and disposed within the frame. The first semiconductor device is disposed between a first lower metal inverse opal (MIO) layer and a first upper MIO layer, and the second semiconductor device is disposed between a second lower MIO layer and a second upper MIO layer. An internal cooling structure that includes the MIO layers provides double sided cooling for the first semiconductor device and the second semiconductor device.

A heat exchanger with a monocoque structure transfers heat between a first fluid and a second fluid. The heat exchanger in has a plurality of tubes through which the first fluid may flow in a direction, each of the plurality of tubes has a first mouth end, an N opposing second mouth end and a waist region between the first mouth end and the second mouth end. The heat exchanger also has one or more interconnected fluid channels through which the second fluid may flow, the one or more fluid channels lay generally in a plane, the plurality of tubes and the one or more fluid channels interleave such that heat may be transferred between the plurality of tubes and the one or more fluid channels, and the direction of flow of the first fluid is generally perpendicular to the plane of the one or more fluid channels.

Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.

Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.