This disclosure details a coolant distribution module as used in a thermal management systems for thermally managing electrified vehicle components. An exemplary coolant distribution module includes a module body including a plurality of inlet ports and a plurality of outlet ports, a first manifold valve encompassed within the module body, and a second manifold valve encompassed within the module body. The first manifold valve includes a plurality of first valve inputs wherein each first valve input is in communication with at least one inlet port of the plurality of inlet ports, and a plurality of first valve outputs wherein each first valve output is in communication with at least one outlet port of the plurality of outlet ports. The second manifold valve includes a plurality of second valve inputs wherein each second valve input is in communication with at least one inlet port of the plurality of inlet ports, and a plurality of second valve outputs wherein each second valve output is in communication with at least one outlet port of the plurality of outlet ports.

A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.

The description relates to orientation specific control of computing devices. One example can include an orientation specific actuator for controlling functionality of a computing device. The example can include providing a first functionality related to a first orientation of the computing device in response to engagement of the orientation specific actuator. The example can also include providing a second functionality in response to engagement of the orientation specific actuator in a second orientation of the computing device.

A kit for manufacturing electronic aircraft control units having different specifications, the units including electronic modules of different types, including avionics platform modules comprising at least an electronic monitoring circuit and an electronic control circuit that are segregated from each other; first protection modules for protecting the avionics platform modules; first extended connection modules; and second protection modules for protecting the extended connection modules; the modules of each type being identical with one another.

A computing device is disclosed that includes an organic light-emitting diode (OLED) display. The OLED display has a front surface and a back surface. The computing device includes a moveable display support connected to the back surface of the display. In some implementations, the moveable display support is configured to limit bending in one direction to a first bend radius and to limit bending in another direction to a second bend radius. In some implementations, the moveable display support is formed by a plurality of unit cells.

Electronic packages and related methods are disclosed. An example electronic package apparatus includes a substrate and an electronic component. A protective material is positioned on a first surface, a second surface and all side surfaces of the electronic component to encase the electronic component. An enclosure is coupled to the substrate to cover the protective material and the electronic component.

A base module for a switch-cabinet system, having a plurality of communication units and connection elements for a plurality of functional modules. The connection elements are configured to engage in module-connection elements of functional modules. Each connection element has at least one data connection. Each communication unit is in each case connected to at least one data connection of a connection element. The communication units are connected to one another by a data bus. The base module has a first field-bus connection. The data bus is connected to the first field-bus connection to connect the communication units to a field-bus.

Various embodiments relate to an electronic device including a foldable conducive plate. The electronic device may include: a foldable housing at least partially foldable via a hinge; a display including a flexible display panel viewable through a front surface of the foldable housing and being at least partially foldable, and a conductive plate disposed on a rear surface of the flexible display panel and supporting the flexible display panel; a circuit board disposed to face at least a portion of a border of the conductive plate in the foldable housing; and at least one conductive connection member comprising a conductor disposed between the conductive plate and the circuit board and electrically connecting the conductive plate and a ground of the circuit board.

A structure suitable for a portable information terminal or a wearable device is provided. In addition, an electronic device having a novel structure that can have various forms is provided. It is preferable that a buffer layer which absorbs a difference in the amount of change in form be provided between adjacent film substrates which overlap with each other. As the buffer layer, a gelled resin material, a rubber resin material, a liquid material, an air layer, or the like can be used. Furthermore, an optical film such as a polarizing film or a color filter may be used as the buffer layer. A plurality of buffer layers may be provided in an electronic device.

A solution is provided that can be used in a communication node. A case is provided that supports a card module. The card module includes a circuit board with a front edge and a rear edge and includes a chiclet mounted adjacent the front edge. A housing can be pressed onto the circuit board and chiclet and be retain the housing in place. A transformer box is provided is provided on the circuit board between the housing and the rear edge. A POE card can be mounted on the circuit board between the transformer box and the housing.