This application relates to semiconductor manufacturing, and more particularly to an interconnect structure for semiconductors with an ultra-fine pitch and a forming method thereof. The forming method includes: preparing copper nanoparticles using a vapor deposition device, where coupling parameters of the vapor deposition device are adjusted to control an initial particle size of the copper nanoparticles; depositing the copper nanoparticles on a substrate; invertedly placing a chip with copper pillars as I/O ports on the substrate; and subjecting the chip and the substrate to hot-pressing sintering to enable the bonding.

A sintered friction material is formed by pressure sintering mixed powder at 800° C. or above, the mixed powder consisting of, in mass %, Cu and/or Cu alloy: 40.0 to 80.0%, Ni: 0% or more and less than 5.0%, Sn: 0 to 10.0%, Zn: 0 to 10.0%, VC: 0.5 to 5.0%, Fe and/or Fe alloy: 2.0 to 40.0%, lubricant: 5.0 to 30.0%, metal oxide and/or metal nitride: 1.5 to 30.0%, and the balance being impurity.

A process for forming extruded products using a device having a scroll face configured to apply a rotational shearing force and an axial extrusion force to the same preselected location on material wherein a combination of the rotational shearing force and the axial extrusion force upon the same location cause a portion of the material to plasticize, flow and recombine in desired configurations. This process provides for a significant number of advantages and industrial applications, including but not limited to extruding tubes used for vehicle components with 50 to 100 percent greater ductility and energy absorption over conventional extrusion technologies, while dramatically reducing manufacturing costs.

A sputtering target-backing plate assembly obtained by bonding a sputtering target and a backing plate using a brazing material, wherein a braze bonding layer which bonds the sputtering target and the backing plate contains a material having thermal conductivity that is higher than that of the brazing material in an amount of 5 vol % or more and 50 vol % or less, and a thickness of the braze bonding layer is 100 μm or more and 700 μm or less. An object is to prevent the seepage of the brazing material while maintaining the thickness of the braze bonding layer.

Fine particles that can be sintered and grow to 100 nm or larger without oxidation even when retained at a baking temperature in an oxygen-containing atmosphere and that can suppress oxidation in a long-term preservation in the air or other oxygen-containing atmospheres, a method of producing the fine particles, and a method of producing fine particles that can suppress oxidation in a collecting process after the production of the fine particles. A fine particle production method for producing fine particles using feedstock powder by means of a gas-phase process includes a step of producing fine particle bodies by converting the feedstock powder into a mixture in a gas phase state using a gas-phase process and cooling the mixture in a gas phase state with a quenching gas containing an inert gas and a hydrocarbon gas having 4 or less carbon atoms, and a step of supplying an organic acid to the produced fine particle bodies.

Provided is a fine particle production apparatus and a fine particle production method capable of easily obtaining surface treated fine particles. The fine particle production apparatus produces fine particles using feedstock by means of a gas-phase process. The apparatus includes a treatment section configured to transform the feedstock into a mixture in a gas phase state by means of the gas-phase process, a feedstock supply section configured to supply the feedstock to the treatment section, a cooling section configured to cool the mixture in a gas phase state in the treatment section using a quenching gas containing an inert gas, and a supply section configured to supply a surface treating agent to fine particle bodies in a temperature region in which the surface treating agent is not denatured, the fine particle bodies being produced by cooling the mixture in the gas phase state with the quenching gas.

A method of making a metal-polymer composite includes dealloying metallic powder to yield porous metal particles, monitoring a temperature of the mixture, controlling the rate of combining, a maximum temperature of the mixture, or both, and combining the porous metal particles with a polymer to yield a composite. Dealloying includes combining the metallic powder with an etchant to yield a mixture. A metal-polymer composite includes porous metal particles having an average particle size of about 0.2 μm to about 500 μm and a thermoplastic or thermoset polymer. The polymer composite comprises at least 10 vol % of the porous metal particles. A powder mixture includes porous metal particles having an average particle size of about 0.2 μm to about 500 μm and a metal powder. The powder mixture includes about 1 wt % to about 99 wt % of the porous metal particles.

A method of making a metal-polymer composite includes dealloying metallic powder to yield porous metal particles, monitoring a temperature of the mixture, controlling the rate of combining, a maximum temperature of the mixture, or both, and combining the porous metal particles with a polymer to yield a composite. Dealloying includes combining the metallic powder with an etchant to yield a mixture. A metal-polymer composite includes porous metal particles having an average particle size of about 0.2 μm to about 500 μm and a thermoplastic or thermoset polymer. The polymer composite comprises at least 10 vol % of the porous metal particles. A powder mixture includes porous metal particles having an average particle size of about 0.2 μm to about 500 μm and a metal powder. The powder mixture includes about 1 wt % to about 99 wt % of the porous metal particles.

Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

A metal foam ball, several millimeters in diameter, is manufactured to have an open-pore structure to absorb fluid (e.g., gas and liquid) such as water or lubricant. As an example, a copper foam ball is manufactured via a freeze casting method using prepared oxide powder slurry where a spherical silica gel mold is used to freeze the slurry, which is subsequently dried at low temperature in vacuum and then sintered at high temperature. For improved oxidation, copper alloy foam ball or copper foam ball coated with tin can also be manufactured through the same method. For improved strength, steel, copper-nickel alloy, or titanium foam ball can also be manufactured through the same method.