C22C1/0425

METHOD FOR PREPARING SILVER-COPPER MIXTURE POWDER OF CORE-SHELL STRUCTURE USING WET PROCESS

Disclosed is a method for preparing silver-copper mixed powder having a core-shell structure. The method includes: dissolving silver (Ag) and copper (Cu) in an aqueous nitric acid solution; adding a reducing agent to the solution; and preparing silver-copper mixed powder having a core-shell structure by performing plasma post-treatment, after performing the adding the reducing agent to the solution.

METHOD FOR PREPARING SILVER-COPPER MIXTURE POWDER OF CORE-SHELL STRUCTURE USING WET PROCESS

Disclosed is a method for preparing silver-copper mixed powder having a core-shell structure. The method includes: dissolving silver (Ag) and copper (Cu) in an aqueous nitric acid solution; adding a reducing agent to the solution; and preparing silver-copper mixed powder having a core-shell structure by performing plasma post-treatment, after performing the adding the reducing agent to the solution.

METHOD FOR PRODUCING BONDING COMPOSITION
20230137716 · 2023-05-04 ·

A method is provided for producing a bonding composition containing copper particles and a second liquid medium. In this production method, the copper particles are produced in a first liquid medium using a wet reduction method, and thus a dispersion of the copper particles is prepared. Subsequently, the first liquid medium in the dispersion is ultimately, finally or eventually replaced with the second liquid medium while the dispersion is kept wet. It is also preferable that the first liquid medium is replaced with another liquid medium one or more times, and the second liquid medium is used in the final replacement. The liquid media are preferably replaced at a temperature of lower than 100° C. The second liquid medium preferably includes one or more of water, alcohol, ketone, ester, ether, and hydrocarbon.

METHOD FOR PRODUCING BONDING COMPOSITION
20230137716 · 2023-05-04 ·

A method is provided for producing a bonding composition containing copper particles and a second liquid medium. In this production method, the copper particles are produced in a first liquid medium using a wet reduction method, and thus a dispersion of the copper particles is prepared. Subsequently, the first liquid medium in the dispersion is ultimately, finally or eventually replaced with the second liquid medium while the dispersion is kept wet. It is also preferable that the first liquid medium is replaced with another liquid medium one or more times, and the second liquid medium is used in the final replacement. The liquid media are preferably replaced at a temperature of lower than 100° C. The second liquid medium preferably includes one or more of water, alcohol, ketone, ester, ether, and hydrocarbon.

ALLOY FOR RESISTOR AND USE OF RESISTOR ALLOY IN RESISTOR
20230133344 · 2023-05-04 ·

Provided is a copper-manganese-nickel based alloy having characteristics (in particular, specific resistance) close to those of a nickel-chromium based alloy. It is also an objective to provide an alloy having high processability compared to a nickel-chromium based alloy. An alloy for a resistive body includes copper, manganese, and nickel, wherein the manganese is 33 to 38% by mass, and the nickel is 8 to 15% by mass.

STRUCTURED POWDER PARTICLES FOR FEEDSTOCK IMPROVEMENT FOR LASER BASED ADDITIVE MANUFACTURING
20170368603 · 2017-12-28 ·

A process comprising providing a metallic first powder having a plurality of first particles. The process includes adding a second material to the first powder, the second material having a plurality of second particles. The process includes combining the first powder with the second material to form a modified powder including modified powder particles having an interior portion containing an interior composition, and an outer surface portion with an outer composition different from the interior composition.

ELECTRONIC DEVICE, ROTATING SHAFT, LAMINATED COMPOSITE MATERIAL, AND METHOD FOR MANUFACTURING LAMINATED COMPOSITE MATERIAL
20230202139 · 2023-06-29 ·

Embodiments of this application provide an electronic device, a rotating shaft, a laminated composite material, and a method for manufacturing a laminated composite material. The laminated composite material includes at least two material layers that are laminated, and the at least two material layers include a first material layer and a second material layer adjacent to each other. The first material layer uses a first metal material, yield strength of the first metal material is greater than 200 Mpa, and an elongation rate of the first metal material is greater than 6%. The second material layer uses a first composite material, and the first composite material includes a second metal material and diamond particles. In this way, heat conduction performance and heat dissipation performance of the rotating shaft are improved while fracture-resistant performance and wear-resistant performance of the rotating shaft are ensured, thereby improving user experience.

EQUIPMENT AND METHOD FOR MANUFACTURING COPPER ALLOY MATERIAL

A copper alloy material manufacturing equipment for manufacturing a copper alloy material by continuously casting molten copper. The equipment includes an element adding means for adding a metal element to the molten copper, a tundish for holding the molten copper containing the metal element, a pouring nozzle connected to the tundish to feed the molten copper from the tundish, and a trapping member arranged inside the tundish and including a same type of material as at least one of an oxide of the metal element, a nitride of the metal element, a carbide of the metal element and a sulfide of the metal element.

Method of producing a Cu-based sintered sliding member

A Cu-based sintered sliding member that can be used under high-load conditions. The sliding member is age-hardened, including 5 to 30 mass % Ni, 5 to 20 mass % Sn, 0.1 to 1.2 mass % P, and the rest including Cu and unavoidable impurities. In the sliding member, an alloy phase containing higher concentrations of Ni, P and Sn than their average concentrations in the whole part of the sliding member, is allowed to be present in a grain boundary of a metallic texture, thereby achieving excellent wear resistance. Hence, without needing expensive hard particles, there can be obtained, at low cost, a Cu-based sintered sliding member usable under high-load conditions. Even more excellent wear resistance is achieved by containing 0.3 to 10 mass % of at least one solid lubricant selected from among graphite, graphite fluoride, molybdenum disulfide, tungsten disulfide, boron nitride, calcium fluoride, talc and magnesium silicate mineral powders.

Nano dispersion copper alloy with high air-tightness and low free oxygen content and brief manufacturing process thereof

Disclosed is a nano dispersion copper alloy with high air-tightness and low free oxygen content and a brief manufacturing process thereof, wherein alloy comprises the following components: Al.sub.2O.sub.3, Ca and La. The manufacturing process comprises the following steps of: preparing Cu—Al.sub.2O.sub.3 alloy powder by an internal oxidation method; mixing the Cu—Al.sub.2O.sub.3 alloy powder with Cu—Ca—La alloy powder; sheathing the mixed powder under protection of argon; performing hot extrusion and then rotary forging; vacuumizing the sheath after the rotary forging; and sealing and placing the sheath in a nitrogen atmosphere with a temperature of 450° C. to 550° C. and a pressure intensity of 40 Mpa to 60 Mpa for 3 hours to 5 hours. The dispersion copper prepared by the present disclosure has the advantages of low free oxygen content (≤15 ppm), high dimensional stability, good air-tightness and an air leakage rate≤1.0×10.sup.−10 Pa m.sup.3/s after hydrogen annealing.