Patent classifications
C22C1/045
METHODS FOR IN ISTU FORMATION OF DISPERSOIDS STRENGTHENED REFRACTORY ALLOY IN 3D PRINTING AND ADDITIVE MANUFACTURING
Methods of fabricating objects using additive manufacturing are provided. The methods create in situ dispersoids within the object. The methods are used with refractory alloy powders which are pretreated to increase the oxygen content to between 500 ppm and 3000 ppm or to increase the nitrogen content to between 250 ppm and 1500 ppm. The pretreated powders are then formed into layers in an environmentally controlled chamber of an additive manufacturing machine. The environmentally controlled chamber is adjusted to have between 500 ppm and 200 ppm oxygen. The layer of pretreated powder is then exposed to a transient moving energy source for melting and solidifying the layer; and creating in situ dispersoids in the layer.
Electrochemical cleaning of an additively manufactured part
A method for removing powder from a component or part produced by metal additive manufacturing systems based on powder beds. The method includes manufacturing a part by additive manufacturing, the part having at least one internal cavity with at least one external opening. The internal cavity is at least partly filled with powder, the powder in the internal cavity having grains agglomerated or connected to each other. The method further including: evacuating gas from the internal cavity; adding liquid electrolyte to the internal cavity, and using an electrochemical process for separating connected powder grains in the cavity.
Heat sink and method for manufacturing same
Provided is a heat sink that has a clad structure of a Cu—Mo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. A heat sink comprises three or more Cu layers and two or more Cu—Mo composite layers alternately stacked in a thickness direction so that two of the Cu layers are outermost layers on both sides, wherein each of the Cu—Mo composite layers has a thickness section microstructure in which flat Mo phase is dispersed in a Cu matrix. The heat sink has a low coefficient of thermal expansion and also has high thermal conductivity in the thickness direction because the thickness of each of the Cu layers which are the outermost layers is reduced, as compared with a heat sink of a three-layer clad structure having the same thickness and density.
Seals and methods of making seals
A tribological and creep resistant system configured to operate at temperatures in excess of 700° C. A seal body extends between a leading edge and a trailing edge. A first component contact surface is adjacent the leading edge and a second component contact surface is adjacent the trailing edge. The seal body is formed from a high entropy alloy.
FUNCTIONALLY GRADED W-CU COMPOSITE
A method for fabricating a functionally graded tungsten-copper composite (W—Cu FGC) may include the following steps. A binder alloy powder may be prepared that may include mechanically alloyed metal powders of nickel (Ni), copper (Cu), and manganese (Mn); the binder alloy powder may be mixed with a pure tungsten (W) powder to obtain a modified W powder; a plurality of W—Cu composite powders may be prepared by mixing the modified W powder with pure copper powder with different ratios; the plurality of W—Cu composite powders may then be stacked inside a die; the stacked plurality of W—Cu composite powders may be pressed inside the die to obtain a W—Cu compact; and the W—Cu compact may be sintered to obtain a W—Cu FGC.
Molybdenum containing targets for touch screen device
The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of titanium, and a third metal element of chromium or tantalum, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in titanium, and a phase that is rich in the third metal element.
SEALS AND METHODS OF MAKING SEALS
A method includes providing a powdered high entropy alloy and forming the powdered high entropy alloy into a seal body with a heat source. The seal body extends between a leading edge and a trailing edge and includes a first component contact surface adjacent the leading edge and a second component contact surface adjacent the trailing edge. The seal body is operable at temperatures in excess of 700° C.
Tungsten alloy, tungsten alloy part, discharge lamp, transmitting tube, and magnetron
According to one embodiment, a tungsten alloy includes a W component and a Hf component including HfC. A content of the Hf component in terms of HfC is 0.1 wt % or more and 3 wt % or less.
ADDITIVE MANUFACTURING OF IRON-BASED AMORPHOUS METAL ALLOYS
Embodiments disclosed herein relate to the production of amorphous metals having compositions of iron, chromium, molybdenum, carbon and boron for usage in additive manufacturing, such as in layer-by-layer deposition to produce multi-functional parts. Such parts demonstrate ultra-high strength without sacrificing toughness and also maintain the amorphous structure of the materials during and after manufacturing processes. Two additive manufacturing techniques are provided: (1) the complete melting of amorphous powder and re-solidifying to amorphous structure to eliminate the formation of crystalline structure therein by controlling a heating source power and cooling rate without affecting previous deposited layers; and (2) partial melting of the outer surface of the amorphous powder, and solidifying powder particles with each-other without undergoing a complete melting stage. Amorphous alloy compositions have oxygen impurities in low concentration levels to optimize glass forming ability (GFA). Specific techniques of additive manufacturing include those based on lasers, electron beams and ultrasonic sources.
Niobium-based alloy that is resistant to aqueous corrosion
In various embodiments, a metal alloy resistant to aqueous corrosion consists essentially of or consists of niobium with additions of tungsten, molybdenum, and one or both of ruthenium and palladium.