A silver powder containing: silver particles; and an adherent that is attached to surfaces of the silver particles and contains a metal oxide that has a melting point lower than a melting point of silver.

Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

The invention includes apparatus and methods for instantiating precious metals in a nanoporous carbon powder.

A method of synthesis of silver nanoparticles (AgNP's) using an orange peel extract is described. The method includes preparing an orange peel extract by cutting a portion of an orange peel into smaller pieces and washing the cut orange peel pieces with de-ionized water to form a washed orange peel. The method further includes boiling the washed orange peel in de-ionized water for at least 3 minutes to form an extract solution and filtering the extract solution from the orange peel to obtain the orange peel extract. The method further includes forming a synthesis mixture of at least one silver salt and the orange peel extract and reacting the silver salt and the orange peel extract to form the silver nanoparticles within 1 minute. The silver nanoparticles find application in detection of mercury ions in an aqueous solution.

A three-dimensional chiral nanostructure according to an embodiment of the present invention comprises: metal nanoparticles having a chiral structure: and a coating layer enclosing the metal nanoparticles. The metal nanoparticle is formed in a polyhedral structure having an R region and an S region in which atoms are arranged clockwise and counterclockwise, respectively, in the order of (111), (100), and (110) crystal faces on the basis of the chiral center, wherein at least a portion of the edges form a curve tilting and extending from the R or S region so that the metal nanoparticle has a chiral structure.

A three-dimensional chiral nanostructure according to an embodiment of the present invention comprises: metal nanoparticles having a chiral structure: and a coating layer enclosing the metal nanoparticles. The metal nanoparticle is formed in a polyhedral structure having an R region and an S region in which atoms are arranged clockwise and counterclockwise, respectively, in the order of (111), (100), and (110) crystal faces on the basis of the chiral center, wherein at least a portion of the edges form a curve tilting and extending from the R or S region so that the metal nanoparticle has a chiral structure.

In the porous substrate loaded with porous nano-particles structure and one-step micro-plasma production method thereof, since the micro-plasma system enhances the electron density and promotes reaction speed in the reaction without generating thermal effect, the method may be performed at an atmosphere environment. The nano-particles also can be quickly obtained by aforementioned micro-plasma system. The electromagnetic field generated by the micro-plasma can drive the nano-particles to be loaded onto the porous substrate in a one step, rapid and low cost process to improve the conventional techniques which require a relatively long procedure time and a complicated process.

This invention relates to a silver sintering composition. In particular, the present invention relates to a silver sintering composition containing a copper alloy, which is capable of being stably sintered on various metal substrates such as copper, gold or silver with good adhesion and sintering strength.

Molded solder includes first metal powder and second metal powder. The first metal powder has a first solidus temperature and a first liquidus temperature and includes an alloy containing metal elements. The second metal powder has a melting temperature or a second solidus temperature and a second liquidus temperature and includes single metal element or an alloy containing metal elements. The melting temperature and the second liquidus temperature are higher than the first liquidus temperature. The molded solder is so constructed that a mixture of the first metal powder and the second metal powder are press-molded. The molded solder is so constructed that a first solidus temperature of a solder becomes higher when the molded solder becomes the solder after the first metal powder has been melted by heating the molded solder at a temperature equal to or higher than the first liquidus temperature.

Molded solder includes first metal powder and second metal powder. The first metal powder has a first solidus temperature and a first liquidus temperature and includes an alloy containing metal elements. The second metal powder has a melting temperature or a second solidus temperature and a second liquidus temperature and includes single metal element or an alloy containing metal elements. The melting temperature and the second liquidus temperature are higher than the first liquidus temperature. The molded solder is so constructed that a mixture of the first metal powder and the second metal powder are press-molded. The molded solder is so constructed that a first solidus temperature of a solder becomes higher when the molded solder becomes the solder after the first metal powder has been melted by heating the molded solder at a temperature equal to or higher than the first liquidus temperature.