A method of manufacturing a hot dip coated steel strip, wherein coating takes place by leading the strip through a bath of molten metal including Al, the remainder of the metal being Zn, inevitable impurities and optionally a maximum of 0.3% of one or more additional elements, wherein the composition of the bath is controlled so as to have an aluminium content of more than 0.50%.

In a metal coated steel sheet, a chemical composition contains, in mass %, at least C: 0.03% to 0.70%, Si: 0.25% to 2.50%, Mn: 1.00% to 5.00%, P: 0.100% or less, S: 0.010% or less, sol. Al: 0.001% to 2.500, N: 0.020% or less, and a balance composed of iron and impurities, a metal structure contains greater than 5.0 vol % of retained austenite and greater than 5.0 vol % of tempered martensite, and satisfies a C content in the retained austenite being 0.85 mass % or more.

A cold rolled, coated and post batch annealed steel sheet produced by a method is provided. The method includes cold rolling a steel sheet; coating the cold rolled steel sheet with a zinc or zinc alloy coating, the cold rolled, coated steel sheet having an initial hole expansion and an initial yield strength and post batch annealing the cold rolled, coated steel sheet at a tempering temperature in a range from 150 to 650° C., the post batch annealed steel sheet having a final hole expansion and a final yield strength. The steel sheet includes (in wt. %) C-0.1-0.3%, Mn-1-3%, Si-0.5-3.5%, Al-0.05-1.5% and Mo+Cr being between 0-1.0%. The final hole expansion is at least 80% greater than the initial hole expansion and the final yield strength is at least 30% greater than the initial yield strength.

A semiconductor device manufacturing method includes forming a ring-shaped rib at an outer circumferential edge of a semiconductor wafer by grinding a center of a back surface of the semiconductor wafer, so that the rib has a thickness greater than a thickness of the center of the semiconductor wafer, pasting a first protective film on the back surface of the semiconductor wafer, pasting a second protective film so as to cover an outer circumferential edge of the first protective film and an outer circumference of the rib, positioning the back surface of the semiconductor wafer so as to face a heating surface of a hot plate and directly heating the first protective film and the second protective film by using the hot plate, and performing a plating treatment on a surface of the semiconductor wafer.

A galvannealed steel sheet according to one aspect of the present invention has a hot-dip galvannealed layer on at least one surface of the steel sheet, and the steel sheet has a predetermined chemical composition, in which the steel sheet contains 10% or more and 90% or less of ferrite, and 10% or more of tempered martensite and tempered bainite in terms of an area ratio, a sum of the ferrite, the tempered martensite, and the tempered bainite is 90% or more, carbides having a major axis of 50 nm or more and 300 nm or less are contained in grains of the ferrite in a number density of 20/μm.sup.2 or more, and a two-dimensional homogeneous dispersion ratio S of Mn is 0.75 or more and 1.30 or less.

Provided is a hot-dip galvanized steel sheet to be used for home appliances, vehicles, and the like, and having excellent surface appearance and low-temperature bonding brittleness. The hot-dip galvanized steel sheet includes: a base steel sheet; and a hot-dip galvanized layer formed on the base steel sheet. A surface of the base steel sheet has a centerline average roughness (Ra) of 0.3 or more, a roughness skewness (Rsk) of −1 or less, and a roughness kurtosis (Rku) of 6 or more.

The present invention provides: a plated steel sheet for hot press forming having excellent impact properties after hot press forming; a hot press formed member manufactured using the plated steel sheet for hot press forming; and manufacturing methods thereof. The plated steel sheet comprises: a base steel sheet containing, by weight, 0.15-0.4% of C, 0.1-1% of Si, 0.6-8% of Mn, 0.001-0.05% of P, 0.0001-0.02% of S, 0.01-0.1% of Al, 0.001-0.02% of N, and 0.01-0.5% of Cr, with the remainder comprising Fe and miscellaneous impurities; and a plating layer formed on the surface of the base steel sheet and composed of zinc, aluminum, or an alloy containing zinc and aluminum, wherein the ratio (C S/C B) of the content (C S) of C in a surface layer to the content (C B) of C in the base steel sheet is 0.6 or less, and the ratio ((Mn S+Cr S)/(Mn B+Cr B)) of the total content (Mn S+Cr S) of Mn and Cr in the surface layer to the total content (Mn B+Cr B) of Mn and Cr in the base steel sheet is 0.8 or more.

A method for monitoring a manufacturing of a metal product, the metal product being manufactured according to a manufacturing process, is implemented by an electronic monitoring device. This method includes acquiring (100) a measured value of at least one representative parameter, each representative parameter being a parameter relating to the metal product or a parameter relating to the manufacturing process, determining (130) a status of the metal product among a compliant status and an analysis status, depending on the at least one acquired value and on at least one target, and when the determined status is the analysis status, computing (150) a corrective action to be applied to the product, among a set of corrective actions and depending on the at least one acquired value, the set of corrective actions including a product repair, a product downgrading, a product expertise and a product acceptance.

A plated steel sheet includes: a steel sheet; and a plating layer that is formed on at least a part of a surface of the steel sheet, in which a chemical composition of the plating layer includes, b mass %, Al: 6.00% to 35.00 %, Mg: 3.00% to 15.00%, La+Ce: 0.0001% to 0.5000% in total, and Zn, and in a surface of the plating layer, the area ratio of a lamellar structure in which an (Al—Zn) phase and a MgZn.sub.2 phase are arranged in layers is 10% to 95%, the lamellar spacing of the lamellar structure is 2.5 μm or less, and the area ratio of an (Al—Zn) dendrite is 10% or less.

Disclosed is a steel sheet for hot press forming, which includes: a base steel sheet; and a plating layer disposed on the base steel sheet and including a diffusion layer and a surface layer that are sequentially laminated, wherein the diffusion layer includes an Fe—Al alloy layer and an Fe—Al intermetallic compound layer that are sequentially disposed on the base steel sheet and each include silicon, and an area fraction of the Fe—Al intermetallic compound layer with respect to the diffusion layer is 84.5% to 98.0%.