A hot-dip Sn—Zn-based alloy-plated steel sheet according to an aspect of the present invention includes: a steel sheet having a predetermined chemical composition; a diffusion alloy layer provided on one surface or both surfaces of the steel sheet; and a Sn—Zn-plated layer provided on the diffusion alloy layer, in which the diffusion alloy layer contains Fe, Sn, Zn, Cr, and Ni, an area ratio of a Sn—Fe—Cr—Zn phase to a Sn—Fe—Ni—Zn phase in the diffusion alloy layer is 0.01 or more and less than 2.5, the diffusion alloy layer has a coverage of 98% or more with respect to the one surface, the Sn—Zn-plated layer contains 1% to 20% of Zn by mass % and a remainder consisting of Sn and impurities, and an adhesion amount of the Sn—Zn-plated layer is 10 to 80 g/m.sup.2 per one surface.

An electrically conducting material including a substrate composed of copper or a copper alloy, and a coating composed of at least one layer. The coating has an outermost layer consisting to an extent of at least 90 Vol % of an intermetallic phase which is or includes Cu.sub.6Sn.sub.5. The surface of the outermost layer that faces away from the substrate has insular, silver-rich precipitations with an area fraction of 7 to 20%.

An electrically conducting material including a substrate composed of copper or a copper alloy, and a coating composed of at least one layer. The coating has an outermost layer consisting to an extent of at least 90 Vol % of an intermetallic phase which is or includes Cu.sub.6Sn.sub.5. The surface of the outermost layer that faces away from the substrate has insular, silver-rich precipitations with an area fraction of 7 to 20%.

A core material has a core 12; a solder layer 16 made of a (Sn—Bi)-based solder alloy provided on an outer side of the core 12; and a Sn layer 20 provided on an outer side of the solder layer 16. The core contains metal or a resin. When a concentration ratio of Bi contained in the solder layer 16 is a concentration ratio (%)=a measured value of Bi (% by mass)/a target Bi content (% by mass), or a concentration ratio (%)=an average value of measured values of Bi (% by mass)/a target Bi content (% by mass), the concentration ratio is 91.4% to 106.7%. The thickness of the Sn layer 20 is 0.215% or more and 36% or less of the thickness of the solder layer 16.

A method of extending the corrosion resistance of a ground anchoring region of a steel or alloy fence or trellis post already having a sacrificial coating or non-sacrificial coating along an entire length of the fence or trellis post, said method including the step of applying at least one additional coating to the ground anchoring region so as to extend the corrosion resistance of the ground anchoring region. The at least one additional coating can be a sacrificial coating and/or non-sacrificial coating.

A copper alloy wire is composed of a copper alloy including indium. of 0.3 mass % or more and 0.65 mass % or less, and has 0.2% proof stress of 300 MPa or more, electrical conductivity of 80% IACS or more, and elongation of 7% or more.

An apparatus for the continuous hot dip coating of a metal strip is provided. The apparatus includes a vessel intended to contain a liquid metal bath, a bottom roller and a displacement casing for the metal strip. The casing includes an upper portion and a lower portion. The lower portion includes a pouring box delimiting at least two liquid metal pouring compartments. Each pouring compartment is inwardly delimited by an inner wall including an upper rim. The casing is provided with the pouring box, is rotatable relative to the metal strip around a first rotation axis and the pouring box is rotatable relative to the upper portion of the casing around a second rotation axis. A method for coating the metal sheet is also provided.

Provided is a process for producing a tinned copper wire. The process comprises subjecting a copper wire sequentially to activation treatment, a first hot tinning treatment, a first cooling, a second hot tinning treatment, and a second cooling to obtain a tinned copper wire. The first hot tinning treatment is carried out at a first temperature and the second hot tinning treatment is carried out at a second temperature. The first temperature is higher than the second temperature. The first temperature is at least 38° C. higher than the melting point of tin. The second temperature is at least 8° C. higher than the melting point of tin.

A hot-dip Sn—Zn-based alloy-plated steel sheet according to an aspect of the present invention includes: a steel sheet having a predetermined chemical composition; a diffusion alloy layer provided on one surface or both surfaces of the steel sheet; and a Sn—Zn-plated layer provided on the diffusion alloy layer, in which the diffusion alloy layer contains Fe, Sn, Zn, Cr, and Ni, an area ratio of a Sn—Fe—Cr—Zn phase to a Sn—Fe—Ni—Zn phase in the diffusion alloy layer is 0.01 or more and less than 2.5, the diffusion alloy layer has a coverage of 98% or more with respect to the one surface, the Sn—Zn-plated layer contains 1% to 20% of Zn by mass % and a remainder consisting of Sn and impurities, and an adhesion amount of the Sn—Zn-plated layer is 10 to 80 g/m.sup.2 per one surface.

A hot-dip Sn—Zn-based alloy-plated steel sheet according to an aspect of the present invention includes: a steel sheet having a predetermined chemical composition; a diffusion alloy layer provided on one surface or both surfaces of the steel sheet; and a Sn—Zn-plated layer provided on the diffusion alloy layer, in which the diffusion alloy layer contains Fe, Sn, Zn, Cr, and Ni, an area ratio of a Sn—Fe—Cr—Zn phase to a Sn—Fe—Ni—Zn phase in the diffusion alloy layer is 0.01 or more and less than 2.5, the diffusion alloy layer has a coverage of 98% or more with respect to the one surface, the Sn—Zn-plated layer contains 1% to 20% of Zn by mass % and a remainder consisting of Sn and impurities, and an adhesion amount of the Sn—Zn-plated layer is 10 to 80 g/m.sup.2 per one surface.