This invention provides a cost-effective hot-dip galvanization process for ferrous metals, which is regardful to the environment and to the health of the personnel.

There is provided an apparatus and method for manufacturing of an infiltrated fiber-based composite film. The apparatus comprises two tool blocks arranged opposite each other enabling a fiber-based film to be arranged between the tool blocks. At least one of the tool blocks comprises a recess so that the recess can form a sealed cavity enclosing a portion of the film when the tool blocks are in contact with each other. At least one of the tool blocks comprises a vacuum channel connecting cavity to a vacuum pump for drawing a vacuum in the cavity; a melt channel connecting the cavity to a source of molten material. The melt channel comprises a valve arrangement controlling delivery of the molten material to the cavity; pressure means to achieve an elevated pressure onto the molten material within the cavity such that a fiber film in the cavity is infiltrated by the molten material; and an ejection piston for ejecting an infiltrated fiber film from the cavity.

It is described a method for changing parameters for controlling a transfer of solder paste onto a printed circuit board (150, 250). The described method comprises (a) identifying first subareas (256, 258) of the printed circuit board (150, 250), which exhibit a first repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), (b) identifying second subareas (252, 254) of the printed circuit board (150, 250), which exhibit a second repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), wherein the first repeatability is smaller than the second repeatability, (c) transferring solder paste onto the printed circuit board (150, 250) at least at the second subareas (252, 254) of the printed circuit board (150, 250), (d) measuring the amount of solder paste which has been transferred to the second subareas (252, 254), and (e) changing the parameters for controlling a transfer of solder paste onto the printed circuit board (150, 250) in response to the measured amount of solder paste which has been transferred to the second subareas (252, 254). It is further described a corresponding processing device, a system comprising such a processing device and a computer program for controlling and/or for carrying out such a method.

A chemical treatment steel sheet includes a steel sheet; a FeSn alloy layer which is formed on at least one surface of the steel sheet; an Sn layer which is formed on the FeSn alloy layer; and a chemical treatment layer that is formed on the Sn layer, and contains a 0.01 to 0.1 mg/m.sup.2 of Zr compounds in terms of an amount of metal Zr and 0.01 to 5 mg/m.sup.2 of phosphate compounds in terms of an amount of P. The total Sn content of the FeSn alloy layer and the Sn layer is 0.1 to 15 g/m.sup.2 of Sn in terms of the amount of metal Sn.

Disclosed are novel metallic nanoparticles coated with a thin protective carbon shell, and three-dimensional nano-metallic sponges; methods of preparation of the nanoparticles; and uses for these novel materials, including wood preservation, strengthening of polymer and fiber/polymer building materials, and catalysis.

The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device includes more than 2.0 mass % to 15.0 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.05 mass % to less than 1.00 mass % of Ni; 0.001 mass % to less than 0.100 mass % of Fe; 0.005 mass % to 0.100 mass % of P; and a remainder comprising Cu and unavoidable impurities, in which 0.002Fe/Ni<1.500, 3.0<(Ni+Fe)/P<100.0, and 0.10<Sn/(Ni+Fe)<5.00 were satisfied by atomic ratio, and a yield ratio YS/TS is more than 90% which is calculated from a strength TS and a 0.2% yield strength YS when a tensile test is performed in a direction parallel to a rolling direction.

The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device includes more than 2.0 mass % to 15.0 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.05 mass % to less than 1.00 mass % of Ni; 0.001 mass % to less than 0.100 mass % of Fe; 0.005 mass % to 0.100 mass % of P; and a remainder comprising Cu and unavoidable impurities, in which 0.002Fe/Ni<1.500, 3.0<(Ni+Fe)/P<100.0, and 0.10<Sn/(Ni+Fe)<5.00 were satisfied by atomic ratio, and a yield ratio YS/TS is more than 90% which is calculated from a strength TS and a 0.2% yield strength YS when a tensile test is performed in a direction parallel to a rolling direction.

A method for coating a coolant metal on a ceramic substrate comprises modification of the substrate surface to provide an oxide free surface upon which the coolant metal is deposited.

A method for coating a coolant metal on a ceramic substrate comprises modification of the substrate surface to provide an oxide free surface upon which the coolant metal is deposited.

We disclose novel metallic nanoparticles coated with a thin protective carbon shell, and three-dimensional nano-metallic sponges; methods of preparation of the nanoparticles; and uses for these novel materials, including wood preservation, strengthening of polymer and fiber/polymer building materials, and catalysis.