Described is a technique for uniformly doping a silicon substrate having a Fin structure with a dopant. A method of manufacturing a semiconductor device may includes: (a) forming a dopant-containing film containing a dopant on a silicon film by performing a cycle a predetermined number of times, the, cycle including: (a-1) forming a first dopant-containing film by supplying a first dopant-containing gas containing the dopant and a first ligand to a substrate having thereon the silicon film and one of a silicon oxide film and a silicon nitride film; and (a-2) forming a second dopant-containing film by supplying a second dopant-containing gas containing the dopant and a second ligand different from and reactive with the first ligand to the substrate; and (b) forming a doped silicon film by annealing the substrate having the dopant-containing film thereon to diffuse the dopant into the silicon film.

A method comprising the steps of: distributing a titanium alloy or pure titanium powder layer on a work table inside a vacuum chamber, directing at least one electron beam from at least one electron beam source over the work table causing the powder layer to fuse in selected locations, distributing a second powder layer on the work table of a titanium alloy or pure titanium inside the build chamber, directing the at least one electron beam over the work table causing the second powder layer to fuse in selected locations, and releasing a predefined concentration of the gas from the metal powder into the vacuum chamber when at least one of heating or fusing the metal powder layer, wherein at least one gas comprising hydrogen is absorbed into or chemically bonded to the titanium or titanium alloy powder to a concentration of 0.01-0.5% by weight of the hydrogen.

A method for forming a three-dimensional article through successive fusion of parts of a metal powder bed is provided, comprising the steps of: distributing a first metal powder layer on a work table inside a build chamber, directing at least one high energy beam from at least one high energy beam source over the work table causing the first metal powder layer to fuse in selected locations, distributing a second metal powder layer on the work table, directing at least one high energy beam over the work table causing the second metal powder layer to fuse in selected locations, introducing a first supplementary gas into the build chamber, which first supplementary gas comprising hydrogen, is capable of reacting chemically with or being absorbed by a finished three-dimensional article, and releasing a predefined concentration of the gas which had reacted chemically with or being absorbed by the finished three dimensional article.

A method for forming a three-dimensional article through successive fusion of parts of a metal powder bed is provided, comprising the steps of: distributing a first metal powder layer on a work table inside a build chamber, directing at least one high energy beam from at least one high energy beam source over the work table causing the first metal powder layer to fuse in selected locations, distributing a second metal powder layer on the work table, directing at least one high energy beam over the work table causing the second metal powder layer to fuse in selected locations, introducing a first supplementary gas into the build chamber, which first supplementary gas comprising hydrogen, is capable of reacting chemically with or being absorbed by a finished three-dimensional article, and releasing a predefined concentration of the gas which had reacted chemically with or being absorbed by the finished three dimensional article.

The present invention is directed to methods for formation of refractory carbide, nitride, and boride coatings without use of a binding agent. The present invention is directed to methods of creating refractory coatings with controlled porosity. Refractory coatings can be formed from refractory metal, metal oxide, or metal/metal oxide composite refractory coating precursor of the 9 refractory metals encompassed by groups 4-6 and periods 4-6 of the periodic table; non-metallic elements (e.g. Si & B) and their oxides (i.e. SiO.sub.2 & B.sub.2O.sub.3) are also pertinent. The conversion of the refractory coating precursor to refractory carbide, nitride or boride is achieved via carburization, nitridization, or boridization in the presence of carbon-containing (e.g. CH.sub.4), nitrogen containing (e.g. NH.sub.3), and boron-containing (e.g. B.sub.2H.sub.6) gaseous species. Any known technique of applying the refractory coating precursor can be used. The porosity of resultant refractory coatings is controlled through compositional manipulation of composite refractory coating precursors.

Provide a metal surface reforming method enabling metallic products with superior characteristics such as surface hardness, heat resistance, corrosion resistance, high temperature oxidation, high temperature corrosion, and environmental corrosion and the like.

Halogenation treatment of heating and retaining a base material in an atmosphere containing a halogen based gas is performed on a base material of iron based metal or nickel based metal, then nitride processing of heating and retaining the halogenated base material described above in an atmosphere containing a nitrogen source gas is performed, then chromizing treatment is performed by placing the nitrided base material in a powder containing metal chromium powder to form a surface reformed layer on the base material described above. These metallic products obtained have high hardness, superior heat resistance and corrosion resistance, and exhibit superior performance in high temperature oxidation, high temperature corrosion, erosion, and cavitation and the like environments. Further, the metallic products described above exhibit superior performance in acid or alkali environments, neutral environments, and corrosive environments such as chlorides like salt water.

A method of increasing a roughness of coiled tubing injector blocks that includes providing a pair of gripper blocks each having a gripper surface configured to grip coiled tubing within an injector head and increasing a first roughness on the gripping surfaces to a second roughness. A coating may be applied to the gripping surfaces to increase the roughness. The coating may be chromium carbide, molybdenum boride, iron boride, titanium boride, or a transitional metal boride. The gripping surfaces may be treated to increase the roughness to a second roughness. The gripping surfaces may be blasted by abrasives or shot peened to increase the roughness. The second roughness may be greater than 20 μm. A system to inject coiled tubing into a wellbore may include an injector head, coiled tubing, and at least two gripper blocks having a gripping surface with a roughness of at least 20 μm.

A method of increasing a roughness of coiled tubing injector blocks that includes providing a pair of gripper blocks each having a gripper surface configured to grip coiled tubing within an injector head and increasing a first roughness on the gripping surfaces to a second roughness. A coating may be applied to the gripping surfaces to increase the roughness. The coating may be chromium carbide, molybdenum boride, iron boride, titanium boride, or a transitional metal boride. The gripping surfaces may be treated to increase the roughness to a second roughness. The gripping surfaces may be blasted by abrasives or shot peened to increase the roughness. The second roughness may be greater than 20 μm. A system to inject coiled tubing into a wellbore may include an injector head, coiled tubing, and at least two gripper blocks having a gripping surface with a roughness of at least 20 μm.

An aluminum alloy member forms a fluoride film thereon, which does not form a black dot-shaped bulged portion and, therefore, has excellent smoothness and excellent corrosion resistance against a corrosive gas, plasma, and others. An aluminum alloy member for forming a fluoride film thereon, consists of: Si: 0.01 mass % to 0.3 mass %; Mg: 0.5 mass % to 5.0 mass %; Fe: 0.05 mass % to 0.5 mass %; Cu: 0.5 mass % or less; Mn: 0.30 mass % or less; Cr: 0.30 mass % or less, and the balance being Al and inevitable impurities, wherein when an average major diameter of Fe-based crystallized products in the aluminum alloy member is “D” (μm), and an average crystalline particle diameter in the aluminum alloy member is “Y” (μm), a relational expression: Log.sub.10 Y<−0.320D+4.60 . . . (1) is satisfied. A fluoride film is formed on at least a part of a surface of the aluminum alloy.

A laminate including a metallic base material, a first nickel-containing plating film layer formed on the metallic base material, a gold plating film layer formed on the first nickel-containing plating film layer, a second nickel-containing plating film layer formed on the gold plating film layer, and a nickel fluoride film layer formed on the second nickel-containing plating film layer. Also disclosed is a method for producing the laminate as well as a constituent member of a semiconductor production device including the laminate.