A method for passivating a metal surface including, generating an atmospheric plasma beam by electrical discharge in a working gas, introducing an acid-containing passivating agent into the plasma beam, applying the plasma beam containing the passivating agent to the metal surface, and depositing a passivating salt on the metal surface by a reaction between the acid-containing passivating agent and the metal surface. This method simplifies the process for passivating a metal surface and renders it more effective.

A method for passivating a metal surface including, generating an atmospheric plasma beam by electrical discharge in a working gas, introducing an acid-containing passivating agent into the plasma beam, applying the plasma beam containing the passivating agent to the metal surface, and depositing a passivating salt on the metal surface by a reaction between the acid-containing passivating agent and the metal surface. This method simplifies the process for passivating a metal surface and renders it more effective.

An apparatus for generating energetic particles and application of coatings in a vacuum comprising a plasma duct surrounded by a magnetic deflecting and focusing system communicating with a primary cathodic arc plasma source in a cathode chamber and a distal anode in a coating chamber. A coating chamber comprises a substrate holder off of an optical axis of the plasma source. A set of baffles are installed along the walls of cathode chambers and the plasma duct not occupied with plasma sources and in some embodiments across the plasma stream to trap macroparticles and neutrals. A plasma duct has a deflecting portion with attached cathode chamber and a tunnel portion attached to the coating chamber. The deflecting system comprises a deflecting coil surrounding the cathode chamber having an off-set deflecting conductor spaced from the plasma duct. In one embodiment a magnetron source is magnetically coupled with cathodic arc source.

Provided is a solder material which enables a growth of an oxide film to be inhibited. A solder ball which is a solder material is composed of a solder layer and a covering layer covering the solder layer. The solder layer is spherical and is composed of a metal material containing an alloy including Sn content of 40% and more. Otherwise the solder layer is composed of a metal material including Sn content of 100%. In the covering layer, a S.sub.nO film is formed outside the solder layer, and a S.sub.nO.sub.2 film is formed outside the S.sub.nO film. A thickness of the covering layer is preferably more than 0 nm and equal to or less than 4.5 nm. Additionally, a yellow chromaticity of the solder ball is preferably equal to or less than 5.7.

A method of coating a medical implant with hydroxyapatite comprises steps of: (a) plasma treating said medical implant by a plasma electrolytic oxidation bath within an electrolyte; (b) hydroxyapatite coating a plasma treated medical implant in a hydrothermal pressurized reactor; (c) washing a hydroxyapatite coated medical implant; and (d) drying a washed medical implant. At least one of steps a and b further comprises a sub-step of forming crystallization seeds on a surface of said medical implant.

A method of coating a medical implant with hydroxyapatite comprises steps of: (a) plasma treating said medical implant by a plasma electrolytic oxidation bath within an electrolyte; (b) hydroxyapatite coating a plasma treated medical implant in a hydrothermal pressurized reactor; (c) washing a hydroxyapatite coated medical implant; and (d) drying a washed medical implant. At least one of steps a and b further comprises a sub-step of forming crystallization seeds on a surface of said medical implant.

The invention relates to a workpiece carrier device (1) for holding and moving workpieces (15), having: a workpiece carrier (2) for receiving workpieces (15), which is mounted on a main frame (4) so as to rotate about an axis (3); a drive part, which can likewise rotate about the axis (3) relative to the workpiece carrier (2); and multiple workpiece holders (5), which are arranged on the workpiece carrier (2) in a ring around the drive axis and are mounted on the workpiece carrier (2) so as to rotate about holder axes (6) which are spaced from the drive axis. The holder axes (6) run in such a way in relation to the axis (3) that the workpiece holders (5) form a conical crown arrangement (7). The invention further relates to a coating method using the workpiece carrier device (1) according to the invention and to workpieces or substrates (15) coated by means of the coating method (e.g, pins, pen injectors, balls, ball pins, pistons, nozzle needles etc.).

A device, for example a medical implant, and a method of making the same, the device having a metal or metal alloy substrate, for example cobalt chrome, and a diffusion hardened metallic surface, for example a plasma carburized surface, contacting a non-diffusion hardened surface or a diffusion hardened surface having a diffusion hardening species different from that of the opposing surface.

A device, for example a medical implant, and a method of making the same, the device having a metal or metal alloy substrate, for example cobalt chrome, and a diffusion hardened metallic surface, for example a plasma carburized surface, contacting a non-diffusion hardened surface or a diffusion hardened surface having a diffusion hardening species different from that of the opposing surface.

A method for treating a metal material to make a surface portion hydrophobic. The method includes oxidizing an untreated surface portion of the metal material to form an oxidized surface portion. The untreated surface portion has metal atoms. The oxidizing step forming bonds between the metal atoms and oxygen atoms. The method further includes doping the oxidized surface portion with a liquid containing a fluorine-containing salt to form a fluorinated surface portion. The doping step forming bonds between fluorine atoms and at least a portion of the metal atoms and the oxygen atoms. The fluorinated surface portion is hydrophobic.