A biosensor for single cell analysis is disclosed. The biosensor includes a substrate, an array of electrodes, and a passivation layer. The substrate includes a roughened surface, where the array of electrodes is patterned on the roughened surface. Each electrode includes a distal tip and a proximal end. The passivation layer is deposited on top of the biosensor and includes a microwell around the distal tip of an electrode. A single cell is trapped within the microwell and adhered onto the distal tip of the electrode for further single cell analysis.

An apparatus and method of processing a workpiece is disclosed, where a sacrificial capping layer is created on a top surface of a workpiece. That workpiece is then exposed to an ion implantation process, where select species are used to passivate the workpiece. While the implant process is ongoing, radicals and excited species etch the sacrificial capping layer. This reduces the amount of etching that the workpiece experiences. In certain embodiments, the thickness of the sacrificial capping layer is selected based on the total time used for the implant process and the etch rate. The total time used for the implant process may be a function of desired dose, bias voltage, plasma power and other parameters. In some embodiments, the sacrificial capping layer is applied prior to the implant process. In other embodiments, material is added to the sacrificial capping layer during the implant process.

Prior electrochromic devices frequently suffer from high levels of defectivity. The defects may be manifest as pin holes or spots where the electrochromic transition is impaired. This is unacceptable for many applications such as electrochromic architectural glass. Improved electrochromic devices with low defectivity can be fabricated by depositing certain layered components of the electrochromic device in a single integrated deposition system. While these layers are being deposited and/or treated on a substrate, for example a glass window, the substrate never leaves a controlled ambient environment, for example a low pressure controlled atmosphere having very low levels of particles. These layers may be deposited using physical vapor deposition.

The present invention describes an improved multilayer solar selective coating useful for solar thermal power generation. Solar selective coating of present invention essentially consists of Ti/Chrome interlayer, two absorber layers (AlTiN and AlTiON) an anti-reflection layer (AlTiO). Coating deposition process uses Ti and Al as the source materials, which are abundantly available and easy to manufacture as sputtering targets for industrial applications. The present invention allows deposition of all the layers in a single sputtering chamber on flat and tubular substrates with high absorptance and low emittance, thus making the process simpler and cost effective. The process of the present invention can be up-scaled easily for deposition on longer tubes with good uniformity and reproducibility. The coating of the present invention also displays improved adhesion, UV stability, corrosion resistance and stability under extreme environments.

The method for processing a substrate includes the substrate preparation step of preparing the substrate, the pattern formation step of forming dummy patterns extending in an X-direction on the substrate, the mask arrangement step of arranging a stencil mask having multiple opening patterns on the substrate, the coating formation step of forming a metal film on the substrate through the multiple opening patterns, and the separation step of separating the dummy patterns from the substrate to obtain a submount. The dummy pattern has protrusion formed such that a side surface of the submount is exposed and formed close to the side surface with a clearance.

A carbide tool cleaning and coating production line and a method. The production line includes a cleaning and a coating device. A manipulator is disposed between the devices. The cleaning device includes a support frame, cleaning mechanism, and drying mechanism sequentially disposed under the frame, which is connected to a moving mechanism connected to a lifting mechanism capable of being connected to a tool fixture bracket, which is configured to accommodate the tool fixture. The coating device includes a coating chamber, a plane target mechanism disposed in the coating chamber, a turntable assembly also disposed in the coating chamber, which is capable of being connected to a plurality of tool fixtures, and the tool fixture is capable of rotating around an axial line of the coating chamber under the driving of the turntable assembly, and rotating around an axial line thereof at the same time.

Methods of passivating at least one facet of a multilayer waveguide structure can include: cleaning, in a first chamber of a multi-chamber ultra-high vacuum (UHV) system, a first facet of the multilayer waveguide structure; transferring the cleaned multilayer waveguide structure from the first chamber to a second chamber of the multi-chamber UHV system; forming, in the second chamber, a first single crystalline passivation layer on the first facet; transferring the multilayer waveguide structure from the second chamber to a third chamber of the multi-chamber UHV system; and forming, in the third chamber, a first dielectric coating on the first single crystalline passivation layer, in which the methods are performed in an UHV environment of the multi-chamber UHV system without removing the multilayer waveguide structure from the UHV environment.

Employed is a roller-type continuous vapor-deposited film forming device in which a film-forming section and a preprocessing section provided with a plasma preprocessing device are arranged in series at a distance from each other. With a substrate transported at a high speed, plasma (P) is supplied to the substrate surface side while set to an electrically positive potential by a plasma preprocessing means for supplying the plasma toward the substrate (S) in a space enclosed in a preprocessing roller, and enclosed in a plasma supply means for supplying a plasma-forming gas and in a magnet (21), which is a magnetism formation means. An active preprocessed surface is formed on the surface of the substrate (S). An inorganic oxide vapor-deposited film having as a principal component thereof an aluminum oxide containing AL-C covalent bonds is immediately formed at high speed in succession on the preprocessed surface of the substrate to produce a highly adhesive transparent vapor-deposited film.

The invention relates to a nuclear fuel cladding comprising: i) a substrate containing a zirconium-based inner layer, optionally coated with at least one intermediate layer formed by at least one intermediate material selected from among tantalum, molybdenum, tungsten, niobium, vanadium, hafnium or the alloys thereof; and ii) at least one protective outer layer placed on the substrate and formed by a protective material selected from either chromium or an alloy of chromium. The nuclear fuel cladding produced using the method of the invention has improved resistance to oxidation/hydriding. The invention also relates to the method for the production of the nuclear fuel cladding by ion etching of the surface of the substrate and deposition of the outer layer on the substrate with a high power impulse magnetron sputtering method (HiPIMS), as well as to the use thereof to protect against oxidation and/or hydriding.

Certain example embodiments relate to techniques for improving the uniformity of, and/or conformance to a desired pattern for, metal island layers (MILs) formed on a substrate (e.g., a glass or other substrate), and/or associated products. Certain example embodiments form MILs using a laser or other energy source or magnetic field assisted technique, e.g., to compensate for non-uniformities that otherwise likely would result in the MIL diverging from its desired configuration. For example, a laser or other energy source may introduce heat onto a substrate, enable pulsed laser deposition, raster a target including the MIL metal to be deposited, raster a substrate where the MIL is to be formed, etc. These and/or other techniques may be used to enable the MIL to be formed on the substrate in a desired pattern, e.g., by compensating for implicit non-uniformities of the substrate and/or by selectively creating non-uniformities in how the MIL is formed.