A coated cutting tool including a substrate and a coating is provided. The coating includes a nano-multilayer of alternating layers of a first nanolayer being Ti.sub.1-xAl.sub.xN, 0.35≤x≤0.70, and a second nanolayer being Ti.sub.1-yAl.sub.yN, 0.12≤y≤0.25. A sequence of one first nanolayer and one second nanolayer forms a layer period. The average layer period thickness in the nano-multilayer is ≤7 nm. The nanomultilayer has a columnar structure with an average column width of ≤70 nm.

A coated mold which can exhibit good sliding properties, and has further reduced droplets and excellent durability. The coated mold has a hard coating on a work surface, the hard coating including layer A in which layer a1 and layer a2 are alternately laminated, wherein the layer a1 is composed of a Cr-based nitride and has a thickness of 100 nm or less, and the layer a2 is composed of a nitride or carbonitride of (V.sub.1-aM.sub.a) (M is at least one selected from Mo and W), has an atomic ratio a of M to the sum of V and M of 0.05 or more and 0.45 or less, and has a thickness of 80 nm or less. Also: a method for manufacturing a coated mold; and a hard coat-forming target which can be used in the method for manufacturing a coated mold.

A method for protecting a watch magnet against corrosion, wherein a magnet is provided, and that a surface preparation operation is carried out on the magnet, before subjecting it to an ion implantation treatment, in order to create an impervious surface layer acting as a barrier against oxidation with all of the surface bonds saturated by the implanted ions, in order to prevent the corrosion of the magnet in a humid environment, under the usual conditions for wearing watches.

A layer of lanthanum boride of stoichiometry LaB.sub.x where x is between 9 and 12 is deposited on substrate, for example a stainless steel watch dial, and subsequently treated with a laser, such that the portion(s) of the layer treated with the laser change colour according to the laser power. This produces multicoloured surfaces having high resistance to corrosion and abrasion. The layer of LaB.sub.x is deposited by PVD and by cathode sputtering, using a LaB.sub.6 target of purple-violet colour, such that the colour of the deposited layer differs from the colour of the target. The laser treatment at specific powers changes the stoichiometry of the layer in the treatment portions, such that the colour of these portions changes according to the stoichiometry obtained. At higher powers, the laser will remove the layer of LaB.sub.x. Thus the colour of the treated portions is determined by the material of the substrate.

An oxide superconducting wire includes a superconducting laminate including an oxide superconducting layer disposed, either directly or indirectly, on a substrate, and a stabilization layer which is a Cu plating layer covering an outer periphery of the superconducting laminate, and a Vickers hardness of the Cu plating layer is in the range of 80 to 190 HV.

A degassing chamber and a semiconductor processing apparatus are provided. The degassing chamber includes a chamber; a substrate container, movable within the chamber in a vertical direction; and a heating component, disposed within the chamber. A substrate transferring opening is formed through a sidewall of the chamber for transferring substrates into or out of the chamber. The heating component includes a first light source component and a second light source component. The chamber is divided into a first chamber and a second chamber by the substrate transferring opening. The first light source component is located in the first chamber, and the second light source component is located in the second chamber. The first light source component and the second light source component are provided for heating a substrate in the substrate container.

The present application relates to methods of preparing a coated substrate and coated substrates which can be optionally prepared from such methods. The methods comprise depositing on the substrate a single abrasion resistant layer by magnetron sputtering or depositing on the substrate a dual layer comprising a first abrasion resistant layer deposited by magnetron sputtering and a second abrasion resistant layer deposited by plasma-enhanced chemical vapor deposition.

The inventive concept provides a method for treating a surface of an object to be treated, in which a part provided and contaminated in an apparatus for treatment of a substrate such as a wafer serves as the object to be treated. In an embodiment, the surface treatment method includes forming a vacuum in an atmosphere in which the object is provided and cleaning the surface of the object by collision of first particles with contaminants on the surface of the object at supersonic speed.

A vacuum deposition facility is provided for continuously depositing on a running substrate coatings formed from metal alloys including a main element and at least one additional element. The facility includes a vacuum deposition chamber and a substrate running through the chamber. The facility also includes a vapor jet coater, an evaporation crucible for feeding the vapor jet coater with a vapor having the main element and the at least one additional element, a recharging furnace for feeding the evaporation crucible with the main element in molten state and maintaining a constant level of liquid in the evaporation crucible, and a feeding unit being fed with the at least one additional element in solid state for feeding the evaporation crucible with the at least one additional element either in molten state, in solid state or partially in solid state. A process is also provided.

Method for forming a metallic component surface to achieve lower electrical contact resistance. The method comprises modifying a surface chemical composition and creating a micro-textured surface structure of the metallic component that includes small peaks and/or pits. The small peaks and pits have a round or irregular cross-sectional shape with a diameter between 10 nm and 10 microns, a height/depth between 10 nm and 10 microns, and a distribution density between 0.4 million/cm.sup.2 and 5 billion cm.sup.2.