Proposed are a mask-integrated frame and a method of manufacturing the same. The mask-integrated frame used to deposit organic light-emitting diode (OLED) pixels on a semiconductor wafer includes a frame including an opening, a grid sheet connected onto the frame, having a circular edge, and including grids provided on at least the opening of the frame, and a mask connected onto the grid sheet, having a circular shape, and including mask patterns.

A display device includes a first substrate including a display area and a non-display area, a display element disposed on the first substrate in the display area, a first sealing portion disposed on the first substrate in the non-display area, a second substrate facing the first substrate in a thickness direction, a hole defined through the first substrate and the second substrate along the thickness direction in the display area, and a second sealing portion disposed between the first substrate and the second substrate and enclosing the hole.

A deposition apparatus includes a chamber, a mask assembly disposed in the chamber and including an open sheet including a first area in which a first deposition hole is defined and a second area in which a second deposition hole spaced apart from the first deposition hole is defined, a first mask including multiple deposition openings that overlap the first area, and a second mask including multiple deposition openings that overlap the second area, a deposition substrate disposed on the mask assembly, and a deposition source spraying a deposition material to the mask assembly.

A mask and a method of manufacturing the same are disclosed. The method of manufacturing a mask includes forming a conductive layer on a pattern region and an auxiliary region around the pattern region of a substrate, placing the substrate including the conductive layer in a plating bath, forming a plating layer on the conductive layer, and separating the substrate and the conductive layer from the plating layer.

The current invention describes a method of manufacturing a porous dielectric material, the method comprising (a) providing a porous template, (b) coating the porous template with an inorganic dielectric material or a precursor of an inorganic dielectric material to form a coated porous template, (c) treating the coated porous template to remove the porous template and to form a porous structure of dielectric material from the coating of inorganic dielectric material or precursor of an inorganic dielectric material, and (d) combining the formed porous structure of dielectric material with a coating polymer to form the porous dielectric material. The invention also relates to RF components on a substrate material, with a conductive material deposited on a porous dielectric material.

Provided is a mask having a plurality of cell areas, each of which has a plurality of through-portions defined therein. The mask includes a mask film including a polymer and a conductive layer disposed on at least one surface of the mask film and including conductive metal or a conductive metal oxide. Accordingly, precision of a deposition process is enhanced while reducing process time and costs in a manufacturing process of the mask, and thus the yield in manufacturing a display panel using the mask is improved. Therefore, the display panel manufactured using the mask may have improved reliability.

One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, process chamber is provided that includes a lid plate having a plurality of cooling channels formed therein, a pedestal, the pedestal having a plurality of cooling channels formed therein, and a showerhead, wherein the showerhead comprises a plurality of segments and each segment is at least partially surrounded by a shield.

According to one or more embodiments, a mask assembly includes a mask frame including an opening and a portion surrounding the opening, and a mask arranged on the mask frame and including a first region and a second region, and a deposition material is passable through the first region corresponding to the opening, and the second region is around the first region, and the first region includes deposition openings, and the second region includes dummy openings, at least some of the dummy openings including centers arranged to deviate from a straight line connecting centers of the deposition openings, and a width of each of the deposition openings is the same as a width of each of the dummy openings.

A thin walled balloon formed in polymer tubing has a patterned metal layer on its outer surface, created by physical vapor deposition (PVD). The pattern is defined by a stencil mask assembled around the balloon, with the balloon inflated therein. The PVD occurs without deforming or degrading the polymer material of the balloon, by actively pulling heat away from the balloon a) by forming the stencil mask out of metal; b) by providing a metal heat conduction path away from the balloon to a heat sink, such as outside the vacuum chamber, and/or c) by flow of a cooling fluid within the balloon during the PVD process. Proper PVD process parameters are selected to minimize heat generation, such as having argon pressure in the range of 0.8 to 1.2 milli-torr and generating the plasma at a power of less than about 200 watts/ square inch of effective target surface area.

A deposition mask assembly for manufacturing a plurality of display devices includes a frame having an opening area, a first open mask disposed on the frame and having a first body portion defining a plurality of patterns overlapping the opening area, and a second open mask disposed on the first open mask and having a second body portion defining a plurality of opening portions overlapping the patterns of the first open mask, in which each of the patterns includes an auxiliary pattern spaced apart from the first body portion and a first bridge pattern connecting the first body portion and the auxiliary pattern.