The present invention discloses a non-reactive PVD coating process for producing an aluminium-rich Al.sub.xTi.sub.1−xN-based thin film having an aluminium content of >75 at-% based on the total amount of aluminium and titanium in the thin film, a cubic crystal structure, and a columnar microstructure, wherein ceramic targets are used as a material source for the aluminium-rich Al.sub.xTi.sub.1−xN-based thin film.

A coated member, an electronic device, and a method for manufacturing the coated member are provided. The coated member comprises a substrate, a color layer formed on a surface of the substrate, and an interference layer formed on a surface of the color layer. A coordinate L* corresponding to a color space presented by the color layer in a CIE LAB color system is within a preset range. When the coordinates of L* are within the preset range, the color of the coated member may be the same or may be different from the color of the color layer. Light passes through the interference layer and then enters the color layer. The color layer reflects and refracts the light. The reflected light enters the interference layer. The interference layer interferes with the reflected light, so that the coated member appears to be a target color.

The present invention discloses a high-temperature stable ceramic coating structure including a microalloy comprising the elements Al, V and N producible by a gas phase deposition process.

The present invention discloses a PVD coating process for producing a multifunctional coating structure comprising the steps of producing a HEA ceramic matrix on a substrate and the targeted introduction of a controlled precipitate structure into the HEA ceramic matrix to generate a desired specific property of the coating structure.

An electronic device such as a wristwatch may include a conductive housing. A corrosion-resistant coating may be deposited on the conductive housing. The coating may include transition layers and an uppermost alloy layer. The transition layers may include a chromium seed layer on the conductive housing and a chromium nitride layer on the chromium seed layer. The uppermost alloy layer may include TiCrCN or other alloys and may provide the coating with desired optical reflection and absorption characteristics. The transition layers may include a minimal number of coating defects, thereby eliminating potential sites at which visible defects could form when exposed to salt water. This may allow the electronic device to exhibit a desired color and to be submerged in salt water without producing undesirable visible defects on the conductive housing structures.

A bioactive coated substrate includes a base substrate, an outermost bioactive layer disposed over the base substrate, and a topcoat layer disposed on the outermost bioactive layer. Characteristically, the topcoat layer defines a plurality of pinholes that expose the outermost bioactive layer. A method for forming the bioactive coated substrate is also provided.

A nanopore cell includes a conductive layer. The nanopore cell further includes a titanium nitride (TiN) working electrode disposed above the conductive layer. The nanopore cell further includes insulating walls disposed above the TiN working electrode, wherein the insulating walls and the TiN working electrode form a well into which an electrolyte may be contained. In some embodiments, the TiN working electrode comprises a spongy and porous TiN working electrode that is deposited by a deposition technique with conditions tuned to deposit sparsely-spaced TiN columnar structures or columns of TiN crystals above the conductive layer.

A method to deposit a coating including a material with highly oriented microstructure, the method including at least the following sequence of process steps: providing a flat substrate into a first vacuum processing chamber; etching one surface of the substrate by physical vapor etching; depositing a first metallic layer on the etched substrate surface by sputtering in a first metal deposition step; annealing the first metallic layer at an annealing temperature at least 50° C. higher than a compound deposition temperature of the subsequent compound deposition step; depositing a first compound layer at the compound deposition temperature on the outer surface of the first metallic layer by reactive sputtering in a first compound deposition step; and depositing a second metallic layer on the outer surface of the first compound layer by sputtering in a second metal deposition step.

A coated tool may include a base member and a coating layer located on the base member. The coating layer may include a plurality of AlTi layers and a plurality of AlCr layers. The AlTi layers may include at least one kind selected from nitride, carbide or carbonitride, each including aluminum and titanium. The AlCr layers may include at least one kind selected from nitride, carbide or carbonitride, each including aluminum and chromium. The coating layer may include a laminate structure in which the AlTi layers and the AlCr layers are alternately laminated one upon another. The AlCr layers may include a first AlCr layer and a second AlCr layer located farther away from the base member than the first AlCr layer. A content ratio of chromium in the second AlCr layer may be higher than a content ratio of chromium in the first AlCr layer.

A multilayer film structure, and method of making such a multilayer film structure, which includes a first layer consisting essentially of a first material and a second layer consisting essentially of a second material. In embodiments, the multilayer film structure includes a plurality of first layers alternating with a plurality of second layers. The layers are constructed by applying a N.sub.2-based reactive sputtering methodology so that the layers maintain a largely amorphous microstructure and a stable and high reflectivity upon annealing at temperatures up to 800° C. for 1 hour.