A production method for a gold sputtering target includes: producing a gold sputtering target which is made of gold and inevitable impurities and in which an average value of Vickers hardness is 40 or more and 60 or less, an average value of crystal grain size is 15 μm or more and 200 μm or less, and the {110} plane of gold is preferentially oriented to a surface to be sputtered of the gold sputtering target.

A production method for a gold sputtering target includes: producing a gold sputtering target which is made of gold and inevitable impurities and in which an average value of Vickers hardness is 40 or more and 60 or less, an average value of crystal grain size is 15 μm or more and 200 μm or less, and the {110} plane of gold is preferentially oriented to a surface to be sputtered of the gold sputtering target.

A black plated steel sheet includes a steel sheet and an Al—Mg—Si-based plating layer disposed on one surface or both surfaces of the steel sheet; in which the plating layer includes a black layer on the outermost surface thereof, and the black layer has a weight ratio of O to (Al+Mg+Si+O) of 0.01 to 0.6.

The method includes placing a wafer in a chamber body of a plasma processing tool; moving a first movable jig along an arc path to comb a spiral-shaped radio frequency (RF) coil over the chamber body, the first movable jig having a plurality of first confining slots penetrated by a plurality of coil segments of the spiral-shaped RF coil, respectively; and generating plasma in the chamber body through the spiral-shaped RF coil.

Methods of making catalyst electrodes comprising sputtering at least Pt and Ir onto nanostructured whiskers to provide multiple alternating layers comprising, respectively in any order, at least Pt and Ir. In some exemplary embodiments, catalyst electrodes described, or made as described, herein are anode catalyst, and in other exemplary embodiments cathode catalyst. Catalysts electrodes are useful, for example, in generating H.sub.2 and O.sub.2 from water.

A process of forming a thin film photoactive layer of an optoelectronic device comprising: providing a substrate having a surface comprising or coated with a metal M selected from at least one of Pb, Sn, Ge, Si, Ti, Bi, or In; and converting the metal surface or metal coating of the substrate to a perovskite layer.

A process of forming a thin film photoactive layer of an optoelectronic device comprising: providing a substrate having a surface comprising or coated with a metal M selected from at least one of Pb, Sn, Ge, Si, Ti, Bi, or In; and converting the metal surface or metal coating of the substrate to a perovskite layer.

A macroparticle filter device for cathodic arc evaporation, to be placed between at least one arc evaporation source and at least one substrate exhibiting at least a surface to be coated with material evaporated from a cathode of the arc evaporation source in a vacuum coating chamber. The macroparticle filter device includes one or more filter components that can prevent macroparticles emitted by the cathode during cathodic arc evaporation to arrive the substrate surface to be coated. The at least one component is provided as one or more flexible sheets that block the lineal way of the macroparticles from the cathode to the substrate surface to be coated. Further a method for utilizing the macroparticle filter device is presented.

A macroparticle filter device for cathodic arc evaporation, to be placed between at least one arc evaporation source and at least one substrate exhibiting at least a surface to be coated with material evaporated from a cathode of the arc evaporation source in a vacuum coating chamber. The macroparticle filter device includes one or more filter components that can prevent macroparticles emitted by the cathode during cathodic arc evaporation to arrive the substrate surface to be coated. The at least one component is provided as one or more flexible sheets that block the lineal way of the macroparticles from the cathode to the substrate surface to be coated. Further a method for utilizing the macroparticle filter device is presented.

A film forming apparatus for forming a thin film on a flexible substrate. The film forming apparatus forms a thin film on a flexible substrate under vacuum. The film forming apparatus includes a first zone into which a first gas is introduced and a second zone into which a second gas is introduced in a vacuum chamber. Zone separators have openings through which the flexible substrate passes. The film forming apparatus includes a mechanism that reciprocates the flexible substrate between the zones. Further, the film forming apparatus includes a mechanism that supplies a raw material gas containing metal or silicon to the first zone, and a mechanism that performs sputtering of a material containing metal or silicon as a target material in the second zone.