The present invention provides a liquid crystal display device and a manufacturing method thereof. The liquid crystal display device uses a quantum rod orientation layer (2) to conduct parallel alignment of a quantum rod layer (3) so that the aligned quantum rod layer (3) may replace a conventional lower polarizer. The liquid crystal display device manufacturing method applies an inclined vapor deposition process to form a quantum rod orientation layer (2). The quantum rod orientation layer (2) includes a plurality of grooves (21) that has an extension direction substantially perpendicular to a transmission axis direction of an upper polarizer (7). A quantum rod layer (3) is then formed on the quantum rod orientation layer (2). The quantum rod layer (3) so formed includes a plurality of quantum rods (31) that has a long axis direction substantially parallel to the extension direction of the grooves (21), namely parallel alignment of the quantum rod layer (3). The aligned quantum rod layer (3) may replace a conventional lower polarizer to improve light transmission rate and utilization of backlighting, increasing displaying brightness and reducing manufacturing cost.

An apparatus with a deposition source and a substrate holder having a source mounting portion, which is rotatable about a first axis, a shielding element, which is disposed between the deposition source and the substrate holder, and a drive arrangement. The deposition source has a material outlet opening from which material is emitted. A longitudinal axis of an elongate central region of the material outlet opening extends parallel and centrally between the edges of the material outlet opening. The deposition source is mounted to the source mounting portion such that the longitudinal axis of the central region is parallel to the first axis. The shielding element has an aperture. The drive arrangement controls rotation of the source mounting portion, adjustment of a width of the aperture, and relative movement between the substrate holder and both the source mounting portion and the shielding element.

In the field of trace organic matter detection, a substrate holder for mass production of surface-enhanced Raman scattering (SERS) substrates includes a ring-shaped body and a support frame thereof. A plurality of cones are disposed on the ring-shaped body, and a plurality of substrates are pasted on both surfaces of each cone. The substrate holder allows for simultaneous deposition of silver nanorods on a plurality of substrates by glancing angle deposition method. An array film composed of the silver nanorods of a plurality of substrates has good product homogeneity, and the production efficiency of a traditional preparation method can be improved.

A semiconductor device is manufactured by modifying an electromagnetic field within a deposition chamber. In embodiments in which the deposition process is a sputtering process, the electromagnetic field may be modified by adjusting a distance between a first coil and a mounting platform. In other embodiments, the electromagnetic field may be adjusted by applying or removing power from additional coils that are also present.

The present disclosure provides a flexible workpiece pedestal capable of tilting a workpiece support surface. The workpiece pedestal further includes a heater mounted on the workpiece support surface. The heater includes a plurality of heating sources such as heating coils. The plurality of heating sources in the heater allows heating the workpiece at different temperatures for different zones of the workpiece. For example, the workpiece can have a central zone heated by a first heating coil, a first outer ring zone that is outside of the central zone heated by a second heating coil, a second outer ring zone that is outside of the first outer ring zone heated by a third heating coil. By using the tunable heating feature and the tilting feature of the workpiece pedestal, the present disclosure can reduce or eliminate the shadowing effect problem of the related workpiece pedestal in the art.

A sputtering apparatus includes a first target and a second target that emit sputter particles, a substrate support configured to support a substrate, and a slit plate disposed between the first and the second targets and the substrate and having a slit unit through which the sputter particles pass. The slit unit includes a first slit to the first and the second target side and a second slit to the substrate side. The second slit has a first protrusion and a second protrusion protruding toward the center of the second slit. When the slit unit is viewed from the first target, the first protrusion is hidden. When the slit unit is viewed from the second target, the second protrusion is hidden.

A method of fabricating a device, comprising forming portions of electronic circuitry and a shadow wall structure over a substrate, and subsequently depositing a conducting layer over the substrate by angled deposition of a conducting material in at least a first deposition direction at an acute angle relative to the plane of the substrate. The shadow wall structure is arranged to cast a shadow in the deposition, leaving areas where the conducting material is not deposited. The shadow wall structure comprises one or more gaps each shorter than a shadow length of a respective part of the shadow wall structure casting the shadow into the gap, to prevent the conducting material forming in the gaps and to thereby create regions of said upper conducting layer that are electrically isolated from one another. These are arranged to form conducting elements for applying signals to, and/or receiving signals from, the electronic circuitry.

A method of fabricating a device, comprising forming portions of electronic circuitry and a shadow wall structure over a substrate, and subsequently depositing a conducting layer over the substrate by angled deposition of a conducting material in at least a first deposition direction at an acute angle relative to the plane of the substrate. The shadow wall structure is arranged to cast a shadow in the deposition, leaving areas where the conducting material is not deposited. The shadow wall structure comprises one or more gaps each shorter than a shadow length of a respective part of the shadow wall structure casting the shadow into the gap, to prevent the conducting material forming in the gaps and to thereby create regions of said upper conducting layer that are electrically isolated from one another. These are arranged to form conducting elements for applying signals to, and/or receiving signals from, the electronic circuitry.

A deposition system is disclosed that allows for growth of inclined c-axis piezoelectric material structures. The system integrates various sputtering modules to yield high quality films and is designed to optimize throughput lending it to a high-volume in manufacturing environment. The system includes two or more process modules including an off-axis module constructed to deposit material at an inclined c-axis and a longitudinal module constructed to deposit material at normal incidence; a central wafer transfer unit including a load lock, a vacuum chamber, and a robot disposed within the vacuum chamber and constructed to transfer a wafer substrate between the central wafer transfer unit and the two or more process modules; and a control unit operatively connected to the robot.

A film-forming device includes: a chamber in which a mold is to be housed for shearing work; a support disposed in the chamber, the support being configured to support the mold with a hole of the mold being open in a vertical direction; and an evaporation source disposed in the chamber, the evaporation source having an evaporation surface from which metal ions are to be generated. The evaporation source is installed such that the evaporation surface is directed in a prescribed direction which is tilted with respect to a horizontal direction, and in the prescribed direction in which the evaporation surface is directed, part of an inner peripheral surface of the hole of the mold is located.