It comprises: a film made of a resin in which an aperture pattern is formed, the aperture pattern passing through the film, the aperture being with a shape and dimension corresponding to the thin-film pattern in a pre-established region for formation of the thin-film pattern on the substrate; and a metal member that has an aperture part opposite the aperture pattern with a shape and dimension larger than the aperture pattern, the metal member being provided as a thin sheet in intimate contact with one surface of the film on an outside part of the aperture pattern of the film. The film is mutually distanced and distributed, at a position where the film does not overlap the aperture pattern, into a plurality of divided parts on one surface of the metal member.

It comprises: a film made of a resin in which an aperture pattern is formed, the aperture pattern passing through the film, the aperture being with a shape and dimension corresponding to the thin-film pattern in a pre-established region for formation of the thin-film pattern on the substrate; and a metal member that has an aperture part opposite the aperture pattern with a shape and dimension larger than the aperture pattern, the metal member being provided as a thin sheet in intimate contact with one surface of the film on an outside part of the aperture pattern of the film. The film is mutually distanced and distributed, at a position where the film does not overlap the aperture pattern, into a plurality of divided parts on one surface of the metal member.

Provided is a chamber system for solid free form fabrication, the chamber system having a deposition chamber, a service chamber and one or more loading/unloading chambers. The chamber system allows for a more efficient and cost effective process to service the deposition apparatus, load holding substrates, and unload workpieces without requiring having to adjust the atmosphere in the deposition chamber.

Provided is a chamber system for solid free form fabrication, the chamber system having a deposition chamber, a service chamber and one or more loading/unloading chambers. The chamber system allows for a more efficient and cost effective process to service the deposition apparatus, load holding substrates, and unload workpieces without requiring having to adjust the atmosphere in the deposition chamber.

A vapor deposition apparatus includes a chamber configured to operate at vacuum and at least one crucible in the chamber. The crucible is configured to receive an ingot, a feeder operable to move the ingot with respect to the at least one crucible, and a heater in the chamber and configured to heat a hot zone between the at least one crucible and the feeder. A method for vapor deposition is also disclosed.

A vapor deposition apparatus includes a chamber configured to operate at vacuum and at least one crucible in the chamber. The crucible is configured to receive an ingot, a feeder operable to move the ingot with respect to the at least one crucible, and a heater in the chamber and configured to heat a hot zone between the at least one crucible and the feeder. A method for vapor deposition is also disclosed.

A device for separating analytes is disclosed. The device has a sample injector, sample injection needle, sample reservoir container in communication with the sample injector, chromatography column downstream of the sample injector, and fluid conduits connecting the sample injector and the column. The interior surfaces of the fluid conduits, sample injector, sample reservoir container, and column form a flow path having wetted surfaces. A portion of the wetted surfaces of the flow path are coated with an alkylsilyl coating that is inert to at least one of the analytes. The alkylsilyl coating has the Formula I: ##STR00001##
R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, and R.sup.6 are each independently selected from (C.sub.1-C.sub.6)alkoxy, —NH(C.sub.1-C.sub.6)alkyl, —N((C.sub.1-C.sub.6)alkyl).sub.2, OH, OR.sup.A, and halo. R.sup.A represents a point of attachment to the interior surfaces of the fluidic system. At least one of R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, and R.sup.6 is OR.sup.A. X is (C.sub.1-C.sub.20)alkyl, —O[(CH.sub.2).sub.2O].sub.1-20—, —(C.sub.1-C.sub.10)[NH(CO)NH(C.sub.1-C.sub.10)].sub.1-20—, or —(C.sub.1-C.sub.10)[alkylphenyl(C.sub.1-C.sub.10)alkyl].sub.1-20-.

A device for separating analytes is disclosed. The device has a sample injector, sample injection needle, sample reservoir container in communication with the sample injector, chromatography column downstream of the sample injector, and fluid conduits connecting the sample injector and the column. The interior surfaces of the fluid conduits, sample injector, sample reservoir container, and column form a flow path having wetted surfaces. A portion of the wetted surfaces of the flow path are coated with an alkylsilyl coating that is inert to at least one of the analytes. The alkylsilyl coating has the Formula I: ##STR00001##
R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, and R.sup.6 are each independently selected from (C.sub.1-C.sub.6)alkoxy, —NH(C.sub.1-C.sub.6)alkyl, —N((C.sub.1-C.sub.6)alkyl).sub.2, OH, OR.sup.A, and halo. R.sup.A represents a point of attachment to the interior surfaces of the fluidic system. At least one of R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, and R.sup.6 is OR.sup.A. X is (C.sub.1-C.sub.20)alkyl, —O[(CH.sub.2).sub.2O].sub.1-20—, —(C.sub.1-C.sub.10)[NH(CO)NH(C.sub.1-C.sub.10)].sub.1-20—, or —(C.sub.1-C.sub.10)[alkylphenyl(C.sub.1-C.sub.10)alkyl].sub.1-20-.

A film-forming apparatus is provided. The film-forming apparatus includes: a head connected to an evaporation source and having a plurality of opening portions; and a heater wound around the head. The heater has a first region at a side of the evaporation source and a second region at an opposite side of the first region from the evaporation source. The heater is arranged ununiformly in comparison between the first region and the second region. Furthermore, a film-forming method by using this film-forming apparatus is provided.

A film-forming apparatus is provided. The film-forming apparatus includes: a head connected to an evaporation source and having a plurality of opening portions; and a heater wound around the head. The heater has a first region at a side of the evaporation source and a second region at an opposite side of the first region from the evaporation source. The heater is arranged ununiformly in comparison between the first region and the second region. Furthermore, a film-forming method by using this film-forming apparatus is provided.