Provided is a chamber system for solid free form fabrication, the chamber system having a deposition chamber, a service chamber and one or more loading/unloading chambers. The chamber system allows for a more efficient and cost effective process to service the deposition apparatus, load holding substrates, and unload workpieces without requiring having to adjust the atmosphere in the deposition chamber.

A tensioning device, including a base configured to carry a mask plate, a clamp configured to clamp the mask plate, and a deformation adjusting assembly provided on the base or on the clamp, wherein the deformation adjusting assembly is configured to adjust a deformation of an end portion of the mask plate protruding from the base in a direction of gravity when the base carries the mask plate, so as to make the deformation less than a preset deformation threshold. A base, a clamp and a clamping for the mask plate are also provided.

A tensioning device, including a base configured to carry a mask plate, a clamp configured to clamp the mask plate, and a deformation adjusting assembly provided on the base or on the clamp, wherein the deformation adjusting assembly is configured to adjust a deformation of an end portion of the mask plate protruding from the base in a direction of gravity when the base carries the mask plate, so as to make the deformation less than a preset deformation threshold. A base, a clamp and a clamping for the mask plate are also provided.

An apparatus for manufacturing a display apparatus includes a deposition source, a nozzle head, a substrate fixer, and a deposition preventer. The deposition source is outside the chamber and vaporizes or sublimates a deposition material. The nozzle head is in the chamber, is connected to the at least one deposition source, and simultaneously sprays the deposition material onto an entire surface of a display substrate. The substrate fixer is connected to the chamber and moves linearly, with the display apparatus is mounted on the substrate fixer. The deposition preventer is in the chamber surrounding an edge portion of the nozzle head and an edge portion of the substrate fixer. The deposition preventer is heated during a deposition process.

A transfer device including at least one first transfer component and at least one second transfer component are provided. The first transfer component includes a first carrier pad contacting the transferred object, and the second transfer component includes a second carrier pad contacting the transferred object, and material of the first carder pad has stronger capability to capture electrons than that of the second carrier pad and material of the second carrier pad has stronger capability to lose electrons than that of the first carder pad.

An evaporating mask plate, an evaporating mask plate set and an evaporating system are provided. The evaporating mask plate includes a mask pattern plate. The evaporating mask pattern plate includes an evaporating area and a test area located around the evaporating area. The test area is provided with at least two test element groups located in different regions of the test area, and each test element group includes at least one test hole for alignment.

An evaporating mask plate, an evaporating mask plate set and an evaporating system are provided. The evaporating mask plate includes a mask pattern plate. The evaporating mask pattern plate includes an evaporating area and a test area located around the evaporating area. The test area is provided with at least two test element groups located in different regions of the test area, and each test element group includes at least one test hole for alignment.

Provided is a mask assembly. The mask assembly includes a mask frame and a mask. The mask is coupled to the mask frame to distinguish first to third deposition areas from each other. Each of the first and third deposition areas has a first width greater than a reference width in a first direction and a second width less than the first width in a second direction. The second deposition area has a third width less than the first width in the first direction and a fourth width less than the reference width in the second direction.

The present disclosure relates to a structural coating and preparation method and use thereof. The structural coating provided in the present disclosure includes a titanium transition layer and platinum-hafnium composite structure layers laminated in sequence on a surface of a substrate; the number of the platinum-hafnium composite structure layer is ≥3; the platinum-hafnium composite structure layer includes a hafnium layer and a platinum layer laminated in sequence.

The present disclosure generally relates to bilayer metal dichalcogenides, to processes for forming bilayer metal dichalcogenides, and to uses of bilayer metal dichalcogenides in devices for quantum electronics. In an aspect, a device is provided. The device includes a gate electrode, a substrate disposed over at least a portion of the gate electrode, and a bottom layer including a first metal dichalcogenide, the bottom layer disposed over at least a portion of the substrate. The device further includes a top layer including a second metal dichalcogenide, the top layer disposed over at least a portion of the bottom layer, the first metal dichalcogenide and the second metal dichalcogenide being the same or different. The device further includes a source electrode and a drain electrode disposed over at least a portion of the top layer.