A transducer includes a first piezoelectric layer; and a second piezoelectric layer that is above the first piezoelectric layer; wherein the second piezoelectric layer is a more compressive layer with an average stress that is less than or more compressive than an average stress of the first piezoelectric layer.

A sputtering target including Ge, Sb, and Te, in which a content of C is set in a range of 0.2 atom % or more and 10 atom % or less, an oxygen content is set to 1000 ppm or less by mass, carbon particles are dispersed in a Ge—Sb—Te phase, and an average particle size of the carbon particles is in a range of more than 0.5 μm and 5.0 μm or less.

A sputtering target having a unitary body. The unitary body includes a planar substrate plate and a toroidal portion extending from a top surface of the substrate plate. The toroidal portion reduces non-uniform erosion against the plate caused by a magnetic field applied to the target. In use, the magnetic field is initially received at the toroidal portion. After the magnetic field wears down the toroidal portion, the magnetic field is received at the substrate plate.

A high-power pulsed surface processing system includes insulated-gate bipolar transistors (IGBT) to replicate desirable pulse structures with high precision, at low cost, and with high reliability within a single system. The pulsed surface processing system includes a power supply, an anode and a cathode, a dual gate driver supplying power to one or more IGBT gates, and one or more capacitor banks. Pulse formation software controls the timing and duration of electrical pulses to the electrodes. A freewheeling diode protects the system from an abrupt reduction of current in the circuit. The high-power pulsed surface processing system may be used to control versatile and complex pulse structures while with precise control of instantaneous pulse powers, pulse timing, and process control. The inclusion of dual gate drivers also offers the ability for multiple pulsers to be created and “slaved” together for a wide variety of custom processes.

A power transfer system is described for transfer of electrical power to a sputter target in a sputter device. It comprises a first part comprising a contact surface positionable against a first part of an endblock of the sputter device, a second part inseparably connected to the first part and a third part, and a third part comprising a contact surface positionable against a second part of the endblock or directly against a sputter target when mounted on the endblock. At least two of the three parts are formed as one monolithic piece. One of the parts of the power transfer system is resilient such that, when mounted, the power transfer system is clamped between the first part of the endblock and the second part of the endblock or the sputter target. This part is also responsible for the transfer of electrical power.

A termination unit for a deposition system, comprising a device for effecting a function, the device comprising at least one component comprising electrical steel, and at least one shielding element which is electrically conductive. The shielding element is configured so: an effect of a neighboring current on the component comprising electrical steel, which is not contributing to the function of the device, is mitigated, wherein this neighboring current has a first topology; and so an effect of at least one neighboring current having a different topology than the first topology is not significantly mitigated. The device moreover comprises a current transfer means neighboring the at least one component comprising electrical steel, and adapted for guiding a current according to the first topology and for transferring power to a target when mounted on the termination unit.

A method of manufacturing a thermal cutting element for a surgical instrument includes manufacturing a substrate, coating at least a portion of the substrate via Plasma Electrolytic Oxidation (PEO), and disposing a heating element on at least a portion of the PEO-coated substrate. The method may further include attaching the thermal cutting element to a jaw member of a surgical instrument.

A method of manufacturing a thermal cutting element for a surgical instrument includes manufacturing a substrate, coating at least a portion of the substrate via Plasma Electrolytic Oxidation (PEO), and disposing a heating element on at least a portion of the PEO-coated substrate. The method may further include attaching the thermal cutting element to a jaw member of a surgical instrument.

A processing system for forming an optical coating on a substrate is provided, wherein the optical coating including an anti-reflective coating and an oleophobic coating, the system comprising: a linear transport processing section configured for processing and transporting substrate carriers individually and one at a time in a linear direction; at least one evaporation processing system positioned in the linear transport processing system, the evaporation processing system configured to form the oleophobic coating; a batch processing section configured to transport substrate carriers in unison about an axis; at least one ion beam assisted deposition processing chamber positioned in the batch processing section, the ion beam assisted deposition processing chamber configured to deposit layer of the anti-reflective coating; a plurality of substrate carriers for mounting substrates; and, means for transferring the substrate carriers between the linear transport processing section and the batch processing section without exposing the substrate carrier to atmosphere.

A system for treating a substrate comprising an unwinder adapted to receive and unwind a roll of substrate and a rewinder adapted to rewind the substrate from the unwinder. The system further comprising a physical vapour deposition (PVD) apparatus, a vacuum chamber in which the unwinder, PVD apparatus and rewinder are disposed; and wherein a coating drum of the PVD apparatus has a temperature of between 0° C. and 10° C., and is adapted to increase a desorption rate of the substrate.